Abstract:
The memory comprises a matrix of cells (10), a charge pump (11), a voltage regulator, controllable connection elements (12) each connected between the output of the charge pump (11) and a column line of the matrix of cells, and means (14) for selectively activating the connection elements. To arrange for the voltage of a cell in a predetermined biasing condition, for example, the programming condition, to be independent of temperature variations and of manufacturing and design parameters, the memory comprises a first element (12') equivalent to a connection element (12) and a second element (10') equivalent to a memory cell (10) in the predetermined biasing condition. These equivalent elements are connected in series with one another between the output terminal and the common terminal of the charge pump (11). The regulator (15, 17) is connected between the second equivalent element (10') and the input of the charge pump (11) in order to regulate the output voltage of the charge pump (11) in dependence on the voltage across the second equivalent element (10').
Abstract:
The present invention refers to a circuit disposal of a transistor shaped like a diode, in particular to a disposal able to reduce the threshold voltage of the transistor and equal to the difference of the threshold voltage of the used transistors in the circuit disposal. In an embodiment the circuit disposal comprises a first pMOS transistor (300) having a second pMOS transistor (301) shaped like a diode connected between the gate and the drain of the first transistor and a current generator (310) connected to the gates of the two transistors. Such a circuitry disposal it is also applicable to a nMOS transistor. From a general point of view this invention refers to a nMOS or pMOS transistor whose gate voltage is increased (for the nMOS transistors) or decreased (for the pMOS transistors) by using a circuit in series to the gate that provides an opportune delta of voltage.
Abstract:
A direct-comparison reading circuit for a nonvolatile memory array (2) having a plurality of memory cells (4) arranged in rows and columns (9), and at least one bit line (7), includes at least one array line (13), selectively connectable to the bit line (7), and a reference line (14); a precharging circuit (17) for precharging the array line (13) and reference line (14) at a preset precharging potential (V PC ); at least one comparator (35) having a first terminal connected to the array line (13), and a second terminal connected to the reference line (14); and an equalization circuit (15, 23, 26) for equalizing the potentials of the array line (13) and reference line (14) in the precharging step. In addition, the reading circuit includes an equalization line (15) distinct from the reference line (14); and controlled switches (23, 26) for connecting, in the precharging step, the equalization line (15) to the array line (13) and to the reference line (14), and for disconnecting the equalization line (15) from the array line (13) and from the reference line (14) at the end of the precharging step.
Abstract:
This invention relates to a method and a corresponding circuit for reading data from an integrated electronic memory device (2) including at least one non-volatile memory matrix (4). The method comprises the following steps:
supplying the memory with an address of a memory location where a reading is to be effected; accessing the memory matrix in a random read mode; supplying the memory with a clock signal (CK) and an address acknowledge signal (LAN); detecting a request for burst read mode access; starting the burst reading as the clock signal shows a rising edge.
Abstract:
An electrically alterable semiconductor memory comprises at least two substantially independent memory banks (1A, 1B), and first control circuit means (2, 4A, 4B) for controlling operations of electrical alteration of the content of the memory, capable of permitting the selective execution of an operation of electrical alteration of the content of one of the at least two memory banks. The memory also comprises second control circuit means (6, 4A, 4B) capable of permitting, simultaneously with said operation of electrical alteration of the content of one of the at least two memory banks, a burst mode read or page mode read operation or a standard read operation for reading the content of the other memory bank.
Abstract:
A circuit for reading a semiconductor memory device comprises at least one global circuit (1) for generating a global reference signal (RIFN) for a respective plurality of cell-reading circuits (SA1-SAn) disposed locally in the memory device. The circuit comprises at least one circuit (51-5an) for replicating the reference signal (RIFN) locally in order to generate a local reference signal (MAT11-MAT1n) to be supplied to at least one respective cell-reading circuit (SA1-SAn).
Abstract:
Output buffer in which the switching speed of the transistors (4,5) of the output stage (1) is kept constant, independently of the variations of the supply voltage (Vcc) and of the temperature, within the acceptable operating range for the device, by controlling, as a function of the supply voltage and the operating temperature detected by a correction circuit (14), the conductivity of additional transistors (13,15) in series with the transistors (7,8) of the predriving stage (2) which drive the transistors of the output stage in conduction, the transistors being driven by an analog signal (CNTRN, CNTRP) which is generated by the correction circuit (14) and is variable with the supply voltage and the operating temperature.