公开(公告)号：AU2003299866A8

公开(公告)日：2004-09-28

申请号：AU2003299866

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  KUBOTA YOICHI ,  KANG TECK-GYU ,  WARNER MICHAEL ,  URBISH GLENN ,  PARK JAE M ,  SMITH LEE

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/28 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L39/00

公开(公告)号：AU3623000A

公开(公告)日：2000-09-28

申请号：AU3623000

申请日：2000-03-10

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  HABA BELGACEM ,  WOLTER KLAUS-JURGEN

IPC: H01L21/283 ,  H01L21/288 ,  H01L21/56 ,  H01L21/60 ,  H01L21/603 ,  H01L21/68 ,  H01L23/31 ,  H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/52

公开(公告)号：AU2003299866A1

公开(公告)日：2004-09-28

申请号：AU2003299866

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  WARNER MICHAEL ,  SMITH LEE ,  URBISH GLENN ,  KANG TECK-GYU ,  PARK JAE M ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L25/065

公开(公告)号：WO2005065424A3

公开(公告)日：2006-07-20

申请号：PCT/US2004044088

申请日：2004-12-21

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  HUMPSTON GILES ,  PARK JAE M

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  HUMPSTON GILES ,  PARK JAE M

IPC: H01R13/62 ,  H01L21/48 ,  H01L23/13 ,  H01R13/24

CPC classification number: H01L23/13 ,  H01L21/4846 ,  H01L2924/0002 ,  H01R13/2414 ,  H01R13/2464 ,  H01L2924/00

Abstract: A microelectronic package includes a mounting structure (136), a microelectronic element associated with the mounting structure, and a plurality of conductive posts (146) physically connected to the mounting structure and electrically connected to the microelectronic element. The conductive posts (146) project from the mounting structure (136) in an upward direction (Z), at least one of the conductive posts being an offset post. Each offset post has a base (154) connected to the mounting structure (136), the base of each offset post defining a centroid (156). Each offset post also defines an upper extremity (178) having a centroid (160), the centroid of the upper extremity being offset from the centroid (156) of the base (154) in a horizontal offset direction transverse to the upward direction (Z). The mounting structure (136) is adapted to permit tilting of each offset post about a horizontal axis so that the upper extremities (178) may wipe across a contact pad of an opposing circuit board.

Abstract translation: 微电子封装包括安装结构（136），与安装结构相关联的微电子元件以及物理连接到安装结构并电连接到微电子元件的多个导电柱（146）。 导电柱（146）从安装结构（136）沿向上的方向（Z）突出，至少一个导电柱是偏移柱。 每个偏移柱具有连接到安装结构（136）的基部（154），每个偏移柱的基部限定重心（156）。 每个偏移柱还限定具有质心（160）的上端（178），上端的质心在垂直于向上方向（Z）的水平偏移方向上偏离基座（154）的重心（156） ）。 安装结构（136）适于允许每个偏移柱绕水平轴线倾斜，使得上端（178）可以擦拭相对电路板的接触垫。

公开(公告)号：WO2005065207A3

公开(公告)日：2006-05-11

申请号：PCT/US2004042415

申请日：2004-12-16

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

IPC: H01L21/44 ,  H01L21/66 ,  H01L23/58

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).

Abstract translation: 微电子封装包括具有面和触点（83）的微电子元件（80）和与微电子元件（82）的第一面（84）间隔开并且覆盖其上的柔性基板（90）。 包装（80）还包括从柔性基板（90）延伸并远离微电子元件（82）的第一面（84）突出的多个导电柱（98），其中至少一些导电柱（ 98）与微电子元件（82）电互连，以及支撑微电子元件（82）上的柔性基板（90）的多个支撑元件（88）。 导电柱（98）从支撑元件（82）偏移，以便于衬底（90）的挠曲和柱（98）相对于微电子元件（82）的移动。

公开(公告)号：WO2005107345A3

公开(公告)日：2006-12-28

申请号：PCT/US2005013699

申请日：2005-04-21

Applicant: TESSERA INC ,  BEROZ MASUD ,  PARK JAE M ,  HABA BELGACEM ,  TAN FION ,  OSBORN PHILIP R

Inventor： BEROZ MASUD ,  PARK JAE M ,  HABA BELGACEM ,  TAN FION ,  OSBORN PHILIP R

IPC: H01R43/00 ,  H01L21/60 ,  H01L23/13 ,  H01L23/31 ,  H01L23/48 ,  H01L23/495 ,  H01L23/498 ,  H01L23/50 ,  H01L23/52 ,  H01R9/00 ,  H01R12/04 ,  H05K1/11

CPC classification number: H01L23/13 ,  H01L23/3114 ,  H01L23/4951 ,  H01L23/4952 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/85 ,  H01L2224/05647 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4824 ,  H01L2224/48463 ,  H01L2224/48471 ,  H01L2224/85447 ,  H01L2924/00014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/19107 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A connection component (100) for a semiconductor chip includes a substrate (102) having a gap (106) over which extends a plurality of parallel spaced apart leads (120). The ends of the leads (120) are adhered to the substrate either by being bonded to contacts or being embedded in the substrate. The connection component can be formed, in one embodiment, by stitch bonding wire leads (120) across the gap (106). In another embodiment, a prefabricated lead assembly supporting spaced apart parallel leads (120) is juxtaposed and transferred to the substrate (102). The connection component is juxtaposed overlying a semiconductor chip whereby leads extending over the gap (106) may have one end detached and bonded to an underlying chip contact.

Abstract translation: 用于半导体芯片的连接部件（100）包括具有间隙（106）的基板（102），多个平行间隔开的​​引线（120）延伸穿过该间隙。 引线（120）的端部通过结合到触点或嵌入基板中而粘附到基板上。 在一个实施例中，连接部件可以通过跨过间隙（106）的引线（120）进行缝合而形成。 在另一个实施例中，支撑间隔开的平行引线（120）的预制引线组件并置并转移到衬底（102）。 连接部件并置在半导体芯片上，由此在间隙（106）上延伸的引线可以具有一端分离并结合到下面的芯片触点。

公开(公告)号：WO2006004671A3

公开(公告)日：2006-05-04

申请号：PCT/US2005022750

申请日：2005-06-24

Applicant: TESSERA INC ,  HUMPSTON GILES ,  BEROZ MASUD ,  TUCKERMAN DAVID B

Inventor： HUMPSTON GILES ,  BEROZ MASUD ,  TUCKERMAN DAVID B

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L21/563 ,  H01L21/4853 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3121 ,  H01L23/3128 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/4985 ,  H01L24/48 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05644 ,  H01L2224/11003 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81801 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/0221 ,  H05K2201/0379 ,  H05K2201/10234 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package includes a microelectronic element having faces and contacts, and a flexible substrate spaced from and overlying a first face of the microelectronic element, the flexible substrate having conductive pads facing away from the first face of the microelectronic element. The package includes a plurality of spheres attached to the conductive pads of the flexible substrate and projecting away from the first face of the microelectronic element, each sphere having a contact surface remote from the conductive pads, the contact surfaces of the spheres including a contact metal devoid of solder. The package also includes a plurality of support elements disposed between the microelectronic element and the substrate for supporting the flexible substrate over the microelectronic element, the spheres being offset from the support elements.

Abstract translation: 微电子封装包括具有面和触点的微电子元件，以及与微电子元件的第一面间隔开并覆盖微电子元件的第一面的柔性基板，柔性基板具有背离微电子元件的第一面的导电焊盘。 该封装包括附接到柔性基板的导电焊盘并且远离微电子元件的第一面突出的多个球体，每个球体具有远离导电焊盘的接触表面，球体的接触表面包括接触金属 没有焊料。 封装还包括多个支撑元件，其设置在微电子元件和基板之间，用于将柔性基板支撑在微电子元件上，该球体与支撑元件相抵消。

公开(公告)号：WO2006012127A2

公开(公告)日：2006-02-02

申请号：PCT/US2005021968

申请日：2005-06-21

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  KANG TECK-GYU ,  KUBOTA YOICHI ,  KRISHNAN SRIDHAR ,  RILEY JOHN B III ,  MOHAMMED ILYAS

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  KANG TECK-GYU ,  KUBOTA YOICHI ,  KRISHNAN SRIDHAR ,  RILEY JOHN B III ,  MOHAMMED ILYAS

IPC: H01L23/02 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A microelectronic package (90) includes a microelectronic element (62) having faces, contacts and an outer perimeter, and a flexible substrate (42) overlying and spaced from a first face of the Microelectronic element (62), an outer region (86) of the flexible substrate (42) extending beyond the outer perimeter of the Microelectronic element (62). The package (90) includes a plurality of conductive posts (40a-40f) exposed at a surface of the flexible substrate (42) and being electrically interconnected with the microelectronic element (62), whereby at least one of the conductive posts (40a-40f) is disposed in the outer region (86) of the flexible substrate (42), and a compliant layer (74) disposed between the first face of the microelectronic element (62) and the flexible substrate (42), wherein the compliant layer (74) overlies the at least one of the conductive posts that is disposed in the outer region (86) of the flexible substrate (42). The package includes a support element (84) in contact with the microelectronic element (62) and the compliant layer (74), whereby the support element 84 overlies the outer region (86) of the flexible substrate (42).

Abstract translation: 微电子封装（90）包括具有面，触点和外周边的微电子元件（62），以及覆盖并与微电子元件（62）的第一面间隔开的柔性基板（42），外部区域（86） 所述柔性基底（42）延伸超出所述微电子元件（62）的外周边。 封装（90）包括在柔性基板（42）的表面处暴露并与微电子元件（62）电互连的多个导电柱（40a-40f），由此至少一个导电柱（40a- 40f）设置在柔性基板（42）的外部区域（86）中，以及设置在微电子元件（62）的第一面和柔性基板（42）之间的顺应层（74），其中柔顺层 （74）覆盖设置在柔性基板（42）的外部区域（86）中的至少一个导电柱。 该封装包括与微电子元件（62）和柔性层（74）接触的支撑元件（84），由此支撑元件84覆盖柔性基板（42）的外部区域（86）。

公开(公告)号：WO2006020744A3

公开(公告)日：2006-06-08

申请号：PCT/US2005028492

申请日：2005-08-11

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  URBISH GLENN ,  TUCKERMAN DAVID B

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  URBISH GLENN ,  TUCKERMAN DAVID B

IPC: B81B7/00

CPC classification number: B81B7/007 ,  H03H3/02 ,  H03H9/0547 ,  H03H9/059 ,  H03H9/1057 ,  H03H9/1092

Abstract: As disclosed herein, structures and methods are provided for forming capped chips. As provided by the disclosed method, a metal base pattern (26) is formed on a chip (8) insulated from wiring (11) of the chip, and a cap (42) is formed including a metal. The cap (42) is joined to the metal base pattern (26) on the chip to form the capped chip (48). In one embodiment, a front surface (9) of the chip is exposed which extends from a contact (14) or (16) of the chip to an edge (13) of the chip (8). In another embodiment, a conductive connection is formed to the contact (14) or (16), the conductive connection extending from the contact to a terminal (46) at an exposed plane (49) above the front surface (9) of the chip (8).

Abstract translation: 如本文所公开的，提供了用于形成加盖芯片的结构和方法。 如所公开的方法所示，在与芯片的布线（11）绝缘的芯片（8）上形成金属基底图案（26），并且形成包括金属的帽（42）。 帽（42）连接到芯片上的金属基底图案（26）以形成封盖芯片（48）。 在一个实施例中，芯片的前表面（9）暴露，其从芯片的接触件（14）或（16）延伸到芯片（8）的边缘（13）。 在另一个实施例中，导电连接形成于接触件（14）或（16），导电连接件在芯片的前表面（9）上方的暴露平面（49）处从接触件延伸到端子（46） （8）。

公开(公告)号：WO2004080134A3

公开(公告)日：2005-01-27

申请号：PCT/US0341132

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  WARNER MICHAEL ,  SMITH LEE ,  URBISH GLENN ,  KANG TECK-GYU ,  PARK JAE M ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/28 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L39/00

CPC classification number: H01L25/0657 ,  H01L23/49861 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A radio frequency chip package is formed by assembling a connecting element such as a circuit board (52) or flexible circuit tape having chips (72, 84) thereon with a bottom plane element (20) such as a lead frame incorporating a large thermally-conductive plate (22) and leads (40, 42) projecting upwardly from the plane of the plate. The assembly step places the rear surfaces (78) of the chips (72) on the bottom side of the connecting element (52) into proximity with the thermal conductor (22) and joins the conductive traces (60) on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends (45) of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board (102). The leads (40, 42) provide robust electrical connections between the connecting element (52) and the circuit board (102).

Abstract translation: 通过将诸如电路板（52）的连接元件或其上具有芯片（72,84）的柔性电路带组装在诸如引线框架的底平面元件（20）上而形成射频芯片封装， 导电板（22）和从板的平面向上突出的引线（40,42）。 组装步骤将芯片（72）的后表面（78）放置在连接元件（52）的底侧上，接近热导体（22），并将连接元件上的导电迹线（60）与 线索。 所得的组件被封装，导致引线的底端（45）露出。 封装的组件可以表面安装到电路板（102）。 引线（40,42）在连接元件（52）和电路板（102）之间提供牢固的电连接。