公开(公告)号：JP2014168094A

公开(公告)日：2014-09-11

申请号：JP2014095937

申请日：2014-05-07

Applicant: Tessera Inc ,  テッセラ,インコーポレイテッド

Inventor： BELGACEM HABA ,  MASUD BEROZ ,  KANG TECK-GYU ,  KUBOTA YOICHI ,  SRIDHAR KRISHNAN ,  JOHN B RILEY III ,  ILYAS MOHAMMED

IPC: H01L23/12 ,  H01L23/02 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To provide a micro electronic component package to be examined easier.SOLUTION: A micro electronic component package comprises a micro electronic device 62. A flexible dielectric layer 42 overlaps a first face of the micro electronic device having an interval therebetween. A periphery 86 of the flexible dielectric layer 42 extends beyond a periphery of the micro electronic device. The micro electronic component package has a plurality of conductive posts 40a-40f exposed on a surface of the flexible dielectric layer, and mutually connected to the micro electronic device electrically. One of the plurality conductive posts is arranged on the periphery of the flexible dielectric layer. A soft layer 74 is arranged between the first face of the micro electronic device and the flexible dielectric layer. The soft layer overlaps at least one of the conductive posts arranged on the periphery of the flexible dielectric layer. The package comprises a support body 84 in contact with the micro electronic device and the soft layer. The support body overlaps the periphery of the flexible dielectric layer.

Abstract translation: 要解决的问题：提供容易检查的微电子部件封装。解决方案：微电子部件封装包括微电子器件62.柔性介电层42与微电子器件的在其间具有间隔的第一面重叠。 柔性介电层42的周边86延伸超出微电子器件的周边。 微电子部件封装具有在柔性介电层的表面上露出的多个导电柱40a-40f，并且电连接到微电子器件。 多个导电柱中的一个布置在柔性介电层的周边上。 柔性层74布置在微电子器件的第一面和柔性介电层之间。 软层与布置在柔性介电层的周边上的至少一个导电柱重叠。 该包装包括与微电子装置和软层接触的支撑体84。 支撑体与柔性介电层的周边重叠。

公开(公告)号：AU2003299866A8

公开(公告)日：2004-09-28

申请号：AU2003299866

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  KUBOTA YOICHI ,  KANG TECK-GYU ,  WARNER MICHAEL ,  URBISH GLENN ,  PARK JAE M ,  SMITH LEE

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/28 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L39/00

公开(公告)号：AU2003265963A1

公开(公告)日：2004-03-29

申请号：AU2003265963

申请日：2003-09-05

Applicant: TESSERA INC

Inventor： BANG KYONG-MO ,  KANG TECK-GYU

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H01L21/48 ,  H01L23/50

Abstract: A microelectronic package is fabricated by a process which includes folding a substrate. A substrate is folded by engaging a folding portion of the substrate with a die so that the folding portion pivots with respect to a first portion of the substrate.

公开(公告)号：AU2003270392A8

公开(公告)日：2004-04-30

申请号：AU2003270392

申请日：2003-09-08

Applicant: TESSERA INC

Inventor： KANG TECK-GYU ,  KUBOTA YOICHI

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/02 ,  H01L23/34 ,  H01L23/48

公开(公告)号：AU2003265417A1

公开(公告)日：2004-03-03

申请号：AU2003265417

申请日：2003-08-13

Applicant: TESSERA INC

Inventor： BANG KYONG-MO ,  KANG TECK-GYU ,  PARK JAE M

IPC: H01L23/31 ,  H01L23/498 ,  H01L23/544 ,  H01L25/10 ,  H01L21/60

公开(公告)号：AU2003299866A1

公开(公告)日：2004-09-28

申请号：AU2003299866

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  WARNER MICHAEL ,  SMITH LEE ,  URBISH GLENN ,  KANG TECK-GYU ,  PARK JAE M ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L25/065

公开(公告)号：AU2003270392A1

公开(公告)日：2004-04-30

申请号：AU2003270392

申请日：2003-09-08

Applicant: TESSERA INC

Inventor： KUBOTA YOICHI ,  KANG TECK-GYU

IPC: H01L25/065 ,  H01L25/18

公开(公告)号：WO2005065238A3

公开(公告)日：2009-03-26

申请号：PCT/US2004043049

申请日：2004-12-21

Applicant: TESSERA INC ,  DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

Inventor： DAMBERG PHILIP ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  KANG TECK-GYU

IPC: H01L23/48 ,  H01L21/44 ,  H01L21/48 ,  H01L21/50 ,  H01L23/498 ,  H01L23/52 ,  H01L29/40 ,  H05K1/11 ,  H05K3/32 ,  H05K3/34

CPC classification number: H01L23/4985 ,  H01L23/49811 ,  H01L23/49838 ,  H01L2924/0002 ,  H05K1/118 ,  H05K3/326 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0367 ,  H05K2201/09063 ,  H05K2201/09081 ,  H05K2201/10674 ,  H01L2924/00

Abstract: A microelectronic package (20) includes a microelectronic element (22) having faces and contacts (26), a flexible substrate (30) overlying and spaced from a first face (24) of the microelectronic element (22), and a plurality of conductive terminals (42) exposed at a surface of the flexible substrate. The conductive terminals (42) are electrically interconnected with the microelectronic element (22) and the flexible substrate (30) includes a gap (50) extending at least partially around at least one of the conductive terminals (42). In certain embodiments, the package includes a support layer, such as a compliant layer (48), disposed between the first face (24) of the microelectronic element (22) and the flexible substrate (30). In other embodiments, the support layer includes at least one opening that is at least partially aligned with one of the conductive terminals.

Abstract translation: 微电子封装（20）包括具有面和触点（26）的微电子元件（22），覆盖并与微电子元件（22）的第一面（24）隔开的柔性衬底（30），以及多个导电 端子（42）暴露在柔性基板的表面。 导电端子（42）与微电子元件（22）电互连，并且柔性基板（30）包括至少部分地围绕至少一个导电端子（42）延伸的间隙（50）。 在某些实施例中，封装包括设置在微电子元件（22）的第一面（24）和柔性基板（30）之间的支撑层，例如顺应层（48）。 在其他实施例中，支撑层包括至少一个与导电端子之一至少部分对准的开口。

公开(公告)号：WO2007075727A3

公开(公告)日：2007-08-23

申请号：PCT/US2006048499

申请日：2006-12-20

Applicant: TESSERA INC ,  HABA BELGACEM ,  KANG TECK-GYU ,  MOHAMMED ILYAS ,  CHAU ELLIS

Inventor： HABA BELGACEM ,  KANG TECK-GYU ,  MOHAMMED ILYAS ,  CHAU ELLIS

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L21/565 ,  G01R31/2886 ,  H01L21/56 ,  H01L23/3128 ,  H01L23/49805 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/49894 ,  H01L24/48 ,  H01L24/73 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/0652 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2924/3511 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A method of making a microelectronic assembly includes providing a microelectronic package having a substrate 400, a microelectronic element 410 overlying the substrate 400 and at least two conductive elements 418 projecting from a surface 402 of the substrate 400, the at least two conductive elements 418 having surfaces 434 remote from the surface 402 of the substrate 400. The method includes compressing the at least two conductive elements 418 so that the remote surfaces 434 thereof lie in a common plane, and after the compressing step, providing an encapsulant material 430 around the at least two conductive elements 418 for supporting the microelectronic package and so that the remote surfaces 434 of the at least two conductive elements 418 remain accessible at an exterior surface of the encapsulant material 430.

Abstract translation: 制造微电子组件的方法包括提供具有衬底400的微电子封装，覆盖衬底400的微电子元件410和从衬底400的表面402突出的至少两个导电元件418，所述至少两个导电元件418具有 表面434远离衬底400的表面402.该方法包括压缩至少两个导电元件418，使得它们的远端表面434位于公共平面中，并且在压缩步骤之后，围绕着该位置提供密封材料430 至少两个用于支撑微电子封装的导电元件418，并且使得至少两个导电元件418的远端表面434在密封剂材料430的外表面保持可访问。

公开(公告)号：WO2004080134A3

公开(公告)日：2005-01-27

申请号：PCT/US0341132

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  WARNER MICHAEL ,  SMITH LEE ,  URBISH GLENN ,  KANG TECK-GYU ,  PARK JAE M ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/28 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L39/00

CPC classification number: H01L25/0657 ,  H01L23/49861 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A radio frequency chip package is formed by assembling a connecting element such as a circuit board (52) or flexible circuit tape having chips (72, 84) thereon with a bottom plane element (20) such as a lead frame incorporating a large thermally-conductive plate (22) and leads (40, 42) projecting upwardly from the plane of the plate. The assembly step places the rear surfaces (78) of the chips (72) on the bottom side of the connecting element (52) into proximity with the thermal conductor (22) and joins the conductive traces (60) on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends (45) of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board (102). The leads (40, 42) provide robust electrical connections between the connecting element (52) and the circuit board (102).

Abstract translation: 通过将诸如电路板（52）的连接元件或其上具有芯片（72,84）的柔性电路带组装在诸如引线框架的底平面元件（20）上而形成射频芯片封装， 导电板（22）和从板的平面向上突出的引线（40,42）。 组装步骤将芯片（72）的后表面（78）放置在连接元件（52）的底侧上，接近热导体（22），并将连接元件上的导电迹线（60）与 线索。 所得的组件被封装，导致引线的底端（45）露出。 封装的组件可以表面安装到电路板（102）。 引线（40,42）在连接元件（52）和电路板（102）之间提供牢固的电连接。