公开(公告)号：AU2003270392A8

公开(公告)日：2004-04-30

申请号：AU2003270392

申请日：2003-09-08

Applicant: TESSERA INC

Inventor： KANG TECK-GYU ,  KUBOTA YOICHI

IPC: H01L25/065 ,  H01L25/18 ,  H01L23/02 ,  H01L23/34 ,  H01L23/48

公开(公告)号：AU2003299866A8

公开(公告)日：2004-09-28

申请号：AU2003299866

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  KUBOTA YOICHI ,  KANG TECK-GYU ,  WARNER MICHAEL ,  URBISH GLENN ,  PARK JAE M ,  SMITH LEE

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/28 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L39/00

公开(公告)号：JP2014168094A

公开(公告)日：2014-09-11

申请号：JP2014095937

申请日：2014-05-07

Applicant: Tessera Inc ,  テッセラ,インコーポレイテッド

Inventor： BELGACEM HABA ,  MASUD BEROZ ,  KANG TECK-GYU ,  KUBOTA YOICHI ,  SRIDHAR KRISHNAN ,  JOHN B RILEY III ,  ILYAS MOHAMMED

IPC: H01L23/12 ,  H01L23/02 ,  H01L23/31 ,  H01L23/367 ,  H01L23/498 ,  H01L25/10

CPC classification number: H01L23/49811 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4985 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: PROBLEM TO BE SOLVED: To provide a micro electronic component package to be examined easier.SOLUTION: A micro electronic component package comprises a micro electronic device 62. A flexible dielectric layer 42 overlaps a first face of the micro electronic device having an interval therebetween. A periphery 86 of the flexible dielectric layer 42 extends beyond a periphery of the micro electronic device. The micro electronic component package has a plurality of conductive posts 40a-40f exposed on a surface of the flexible dielectric layer, and mutually connected to the micro electronic device electrically. One of the plurality conductive posts is arranged on the periphery of the flexible dielectric layer. A soft layer 74 is arranged between the first face of the micro electronic device and the flexible dielectric layer. The soft layer overlaps at least one of the conductive posts arranged on the periphery of the flexible dielectric layer. The package comprises a support body 84 in contact with the micro electronic device and the soft layer. The support body overlaps the periphery of the flexible dielectric layer.

Abstract translation: 要解决的问题：提供容易检查的微电子部件封装。解决方案：微电子部件封装包括微电子器件62.柔性介电层42与微电子器件的在其间具有间隔的第一面重叠。 柔性介电层42的周边86延伸超出微电子器件的周边。 微电子部件封装具有在柔性介电层的表面上露出的多个导电柱40a-40f，并且电连接到微电子器件。 多个导电柱中的一个布置在柔性介电层的周边上。 柔性层74布置在微电子器件的第一面和柔性介电层之间。 软层与布置在柔性介电层的周边上的至少一个导电柱重叠。 该包装包括与微电子装置和软层接触的支撑体84。 支撑体与柔性介电层的周边重叠。

公开(公告)号：AU2003299866A1

公开(公告)日：2004-09-28

申请号：AU2003299866

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  WARNER MICHAEL ,  SMITH LEE ,  URBISH GLENN ,  KANG TECK-GYU ,  PARK JAE M ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L25/065

公开(公告)号：AU2003270392A1

公开(公告)日：2004-04-30

申请号：AU2003270392

申请日：2003-09-08

Applicant: TESSERA INC

Inventor： KUBOTA YOICHI ,  KANG TECK-GYU

IPC: H01L25/065 ,  H01L25/18

公开(公告)号：WO2005065207A3

公开(公告)日：2006-05-11

申请号：PCT/US2004042415

申请日：2004-12-16

Applicant: TESSERA INC ,  HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

Inventor： HABA BELGACEM ,  BEROZ MASUD ,  GREEN RONALD ,  MOHAMED ILYAS ,  WILSON STUART E ,  ZOHNI WAEL ,  KUBOTA YOICHI ,  THOMPSON JESSE BURL

IPC: H01L21/44 ,  H01L21/66 ,  H01L23/58

CPC classification number: H01L23/49811 ,  G01R1/06744 ,  G01R1/0735 ,  H01L21/563 ,  H01L23/4985 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/0603 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/13187 ,  H01L2224/13188 ,  H01L2224/1319 ,  H01L2224/1329 ,  H01L2224/133 ,  H01L2224/1357 ,  H01L2224/136 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/48091 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/83194 ,  H01L2224/85399 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01084 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3011 ,  H01L2224/13099 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A microelectronic package includes a microelectronic element (80) having faces and contacts (83) and a flexible substrate (90) spaced from and overlying a first face (84) of the microelectronic element (82). The package (80) also includes a plurality of conductive posts (98) extending from the flexible substrate (90) and projecting away from the first face (84) of the microelectronic element (82), wherein at least some of the conductive posts (98) are electrically interconnected with the microelectronic element (82), and a plurality of support elements (88) supporting the flexible substrate (90) over the microelectronic element (82). The conductive posts (98) are offset from the support elements (82) to facilitate flexure of the substrate (90) and movement of the posts (98) relative to the microelectronic element (82).

Abstract translation: 微电子封装包括具有面和触点（83）的微电子元件（80）和与微电子元件（82）的第一面（84）间隔开并且覆盖其上的柔性基板（90）。 包装（80）还包括从柔性基板（90）延伸并远离微电子元件（82）的第一面（84）突出的多个导电柱（98），其中至少一些导电柱（ 98）与微电子元件（82）电互连，以及支撑微电子元件（82）上的柔性基板（90）的多个支撑元件（88）。 导电柱（98）从支撑元件（82）偏移，以便于衬底（90）的挠曲和柱（98）相对于微电子元件（82）的移动。

公开(公告)号：WO2010005592A8

公开(公告)日：2011-02-10

申请号：PCT/US2009004033

申请日：2009-07-08

Applicant: TESSERA INC ,  RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

Inventor： RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L21/48

CPC classification number: B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A microelectronic interconnect element can include a plurality of first metal lines (110) and plurality of second metal lines (110') interleaved with the first metal lines (110). Each of the first and second metal lines has a surface (122), (120') extending within the same reference plane. The first metal lines (110) have surfaces (120) above the reference plane and remote therefrom and the second metal lines (110') have surfaces (122') below the reference plane and remote therefrom. A dielectric layer (114A) can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract translation: 微电子互连元件可以包括与第一金属线（110）交错的多个第一金属线（110）和多个第二金属线（110'）。 第一和第二金属线中的每一个具有在同一参考平面内延伸的表面（122），（120'）。 第一金属线（110）在参考平面上方具有远离其的表面（120），并且第二金属线（110'）在参考平面下方具有远离其的表面（122'）。 电介质层（114A）可以将第一金属线的金属线与第二金属线的相邻金属线分开。

公开(公告)号：WO2010005592A2

公开(公告)日：2010-01-14

申请号：PCT/US2009004033

申请日：2009-07-08

Applicant: TESSERA INC ,  RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

Inventor： RYU CHANG MYUNG ,  ENDO KIMITAKA ,  HABA BELGACEM ,  KUBOTA YOICHI

IPC: H01L23/498

CPC classification number: B81B7/0006 ,  B81C1/00539 ,  C25D7/00 ,  H01L21/4846 ,  H01L21/768 ,  H01L23/498 ,  H01L24/19 ,  H01L24/24 ,  H01L2224/244 ,  H01L2924/0002 ,  H01L2924/12042 ,  H01L2924/00

Abstract: A microelectronic interconnect element can include a plurality of first metal lines (110) and plurality of second metal lines (110') interleaved with the first metal lines (110). Each of the first and second metal lines has a surface (122), (120') extending within the same reference plane. The first metal lines (110) have surfaces (120) above the reference plane and remote therefrom and the second metal lines (110') have surfaces (122') below the reference plane and remote therefrom. A dielectric layer (114A) can separate a metal line of the first metal lines from an adjacent metal line of the second metal lines.

Abstract translation: 微电子互连元件可以包括与第一金属线（110）交错的多个第一金属线（110）和多个第二金属线（110'）。 第一和第二金属线中的每一个具有在同一参考平面内延伸的表面（122），（120'）。 第一金属线（110）具有位于参考平面之上并远离其的表面（120），并且第二金属线（110'）具有在参考平面之下并远离其的表面（122'）。 介电层（114A）可将第一金属线的金属线与第二金属线的相邻金属线分隔开。

公开(公告)号：WO2005086532A3

公开(公告)日：2006-01-26

申请号：PCT/US2005006565

申请日：2005-03-01

Applicant: TESSERA INC ,  HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

Inventor： HUMPSTON GILES ,  OSBORN PHILIP R ,  THOMPSON JESSE BURL ,  KUBOTA YOICHI ,  TSENG CHUNG-CHUAN ,  BURTZLAFF ROBERT ,  HABA BELGACEM ,  TUCKERMAN DAVID B ,  WARNER MICHAEL

IPC: B81B7/00 ,  H01L23/495 ,  H04R19/00 ,  H04R19/04

CPC classification number: B81B7/0077 ,  B81B2201/0257 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/16 ,  H01L2224/48227 ,  H01L2224/48228 ,  H01L2224/73265 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/07811 ,  H01L2924/09701 ,  H01L2924/10155 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/19041 ,  H01L2924/3025 ,  H04R19/005 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Various embodiments of packaged chips and ways of fabricating them are disclosed herein. One such packaged chip disclosed herein includes a chip having a front face, a rear face opposite the front face, and a device at one of the front and rear faces, the device being operable as transducer of at least one of acoustic energy and electromagnetic energy, and the chip including a plurality of bond pads exposed to one of the front and rear faces. The packaged chip includes a package element having a dielectric element and a metal layer disposed on the dielectric element, the package element having an inner surface facing the chop and an outer surface facing away from the chip. The metal layer includes a plurality of contacts exposed at at least one of the inner and outer surfaces, the contacts conductively connected to the bond pads. The metal layer further includes a first opening for passage of the at least one of acoustic energy and electromagnetic energy in a direction of at least one of the said device and from said device.

Abstract translation: 本文公开了封装芯片的各种实施例及其制造方法。 本文公开的一种这样的封装芯片包括具有前表面，与正面相对的后表面的芯片和在前表面和后表面中的一个处的器件，该器件可操作为声能和电磁能中的至少一个的换能器 并且所述芯片包括暴露于所述前表面和后表面中的一个的多个接合焊盘。 封装芯片包括具有介电元件和设置在电介质元件上的金属层的封装元件，封装元件具有面向斩波的内表面和背离芯片的外表面。 金属层包括暴露在内表面和外表面中的至少一个的多个触点，触点导电地连接到接合焊盘。 金属层还包括第一开口，用于沿着所述装置和所述装置中的至少一个的方向通过声能和电磁能中的至少一个。

公开(公告)号：WO2004080134A3

公开(公告)日：2005-01-27

申请号：PCT/US0341132

申请日：2003-12-24

Applicant: TESSERA INC

Inventor： BEROZ MASUD ,  WARNER MICHAEL ,  SMITH LEE ,  URBISH GLENN ,  KANG TECK-GYU ,  PARK JAE M ,  KUBOTA YOICHI

IPC: H01L23/498 ,  H01L25/065 ,  H01L23/02 ,  H01L23/28 ,  H01L23/34 ,  H01L23/52 ,  H01L29/40 ,  H01L39/00

CPC classification number: H01L25/0657 ,  H01L23/49861 ,  H01L24/48 ,  H01L25/0652 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/73253 ,  H01L2224/85399 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/15311 ,  H01L2924/1532 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19107 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00012

Abstract: A radio frequency chip package is formed by assembling a connecting element such as a circuit board (52) or flexible circuit tape having chips (72, 84) thereon with a bottom plane element (20) such as a lead frame incorporating a large thermally-conductive plate (22) and leads (40, 42) projecting upwardly from the plane of the plate. The assembly step places the rear surfaces (78) of the chips (72) on the bottom side of the connecting element (52) into proximity with the thermal conductor (22) and joins the conductive traces (60) on the connecting element with the leads. The resulting assembly is encapsulated, leaving terminals at the bottom ends (45) of the leads exposed. The encapsulated assembly may be surface-mounted to a circuit board (102). The leads (40, 42) provide robust electrical connections between the connecting element (52) and the circuit board (102).

Abstract translation: 通过将诸如电路板（52）的连接元件或其上具有芯片（72,84）的柔性电路带组装在诸如引线框架的底平面元件（20）上而形成射频芯片封装， 导电板（22）和从板的平面向上突出的引线（40,42）。 组装步骤将芯片（72）的后表面（78）放置在连接元件（52）的底侧上，接近热导体（22），并将连接元件上的导电迹线（60）与 线索。 所得的组件被封装，导致引线的底端（45）露出。 封装的组件可以表面安装到电路板（102）。 引线（40,42）在连接元件（52）和电路板（102）之间提供牢固的电连接。