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公开(公告)号：JP2008060585A
公开(公告)日：2008-03-13
申请号：JP2007239062
申请日：2007-09-14
Applicant: Tessera Inc , テセラ,インコーポレイテッド
Inventor： KOVAC ZLATA , MITCHELL CRAIG , DISTEFANO THOMAS
IPC: H01L21/60 , H01L23/12 , H01L21/56 , H01L23/28 , H01L23/32 , H01L23/48 , H01L23/498 , H05K1/11 , H05K3/36 , H05K3/40
CPC classification number: H01L24/81 , H01L21/56 , H01L21/563 , H01L23/49811 , H01L23/49827 , H01L23/4985 , H01L24/72 , H01L24/75 , H01L2224/16 , H01L2224/73203 , H01L2224/73204 , H01L2224/75 , H01L2224/75301 , H01L2224/81801 , H01L2224/83136 , H01L2924/01004 , H01L2924/01006 , H01L2924/01013 , H01L2924/01027 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/15311 , H01L2924/1532 , H01L2924/16152 , H01L2924/19041 , H01L2924/19043 , H05K1/118 , H05K3/361 , H05K3/4084 , H05K2201/0133 , H05K2201/0394 , H05K2201/0397 , H05K2201/09081 , H05K2201/091 , H05K2203/063 , Y10T29/4913 , Y10T29/49144 , Y10T29/49174 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a compliant interface for coping with a discordance between the thermal expansion coefficients of a semiconductor chip and of a support structure, such as printed wiring board. SOLUTION: This method for forming a compliant interface of a semiconductor chip comprises processes of providing a first support structure 100 having a first face, a second face, a plurality of terminals 140 on the second face and a porous elastic layer disposed on the first face of the first supporting structure; butting a first face of a second supporting structure 120 to the porous layer so that the porous elastic layer is arranged between the first and second support structures and the first support structure is separated from the second support structure; arranging a first curable liquid within the porous layer after the butting process so that the first curable liquid is arranged between the first and second support structures; and substantially matching coplanarly a plurality of terminals to each other, by making a plurality of the terminals engage to a platen. COPYRIGHT: (C)2008,JPO&INPIT
Abstract translation: 要解决的问题：提供一种用于应对半导体芯片的热膨胀系数和诸如印刷线路板的支撑结构之间的不一致性的兼容接口。 解决方案：用于形成半导体芯片的兼容界面的方法包括提供具有第一面，第二面，第二面上的多个端子140的第一支撑结构100和设置在第二面上的多孔弹性层的工艺 第一支撑结构的第一面; 将第二支撑结构120的第一面与多孔层对接，使得多孔弹性层布置在第一和第二支撑结构之间，并且第一支撑结构与第二支撑结构分离; 在对接过程之后，在多孔层内布置第一可固化液体，使得第一可固化液体布置在第一和第二支撑结构之间; 并且通过使多个端子接合到压板上而使多个端子彼此大致匹配。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：DE69225495T2
公开(公告)日：1998-10-08
申请号：DE69225495
申请日：1992-12-30
Applicant: TESSERA INC
Inventor： DISTEFANO THOMAS , KHANDROS IGOR , GRUBE GARY , EHRENBERG SCOTT
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公开(公告)号：DE69225495D1
公开(公告)日：1998-06-18
申请号：DE69225495
申请日：1992-12-30
Applicant: TESSERA INC
Inventor： DISTEFANO THOMAS , KHANDROS IGOR , GRUBE GARY , EHRENBERG SCOTT
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