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公开(公告)号：CN106315503A
公开(公告)日：2017-01-11
申请号：CN201610704386.3
申请日：2016-08-23
Applicant: 中山大学
CPC classification number: B81C1/00206 , B81B7/00 , B81C1/00341 , B81C1/00404 , B81C1/00849 , B81C2201/01 , B81C2201/0156
Abstract: 本发明提供了一种硅基准三维纳米结构有序阵列及其制备方法，所述的准三维纳米结构为纳米级的两头大中间小的柱状结构，所述的柱状结构的两头的直径和柱状结构的中间的直径的比例为3~20：1。与现有的硅基纳米有序结构阵列相比，本发明的硅基准三维纳米结构有序阵列具有更复杂的准三维结构，该结构高度有序、高度精密、尺寸极小、结构可控，具有特殊的光学、电学性质，在电子信息、太阳能电池、生化传感等领域有重要价值；本发明通过调整反应离子刻蚀工艺，实现了结构更复杂的硅基准三维纳米结构有序阵列的制备，并能可控地调节纳米结构的尺寸；本发明提供的硅基准三维纳米结构有序阵列，在光电器件、传感芯片等方面具有广阔的应用前景。
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公开(公告)号：CN108439329A
公开(公告)日：2018-08-24
申请号：CN201810209247.2
申请日：2018-03-14
Applicant: 河南科技大学
IPC: B81C1/00
CPC classification number: B81C1/00349 , B81C1/00531 , B81C2201/0132 , B81C2201/0156 , B81C2201/018
Abstract: 一种微纳模具型槽的制备方法，包括镀膜步骤：在等离子体增强化学气相沉积镀膜机中，采用Si片作为基体材料，在基体材料表面沉积SiC膜层；光刻步骤：采用光刻工艺将掩膜的图形转移到SiC膜层上；刻蚀步骤：采用感应耦合等离子体刻蚀机在SiC膜层上刻蚀型槽。本发明制备的模具型槽，导热系数高、热膨胀系数小，耐火、耐磨性强，对氢氧化钾碱溶液和氟化氢酸溶液等腐蚀剂都有抗腐蚀作用。
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公开(公告)号：CN107176588A
公开(公告)日：2017-09-19
申请号：CN201710462649.9
申请日：2017-06-19
Applicant: 鲁东大学
IPC: B81C1/00
CPC classification number: B81C1/00071 , B81C1/00119 , B81C1/00388 , B81C1/00523 , B81C2201/0156
Abstract: 本发明公开了一种中空微通道结构的制备方法，具体涉及微细加工领域。该方法采用光刻技术和热回流技术制作微米尺寸的微通道母版，并利用此母板制作PDMS柔性模板，获得的柔性模板具有与微通道母版互补的图案结构，将PDMS柔性模板紧密粘附在基片表面形成微通道空腔，并在一侧滴注S1813光刻胶，光刻胶在毛细力的作用下填充微通道空腔，填充较长时间后进行加热，微腔内的光刻胶发生回流，而与微腔内壁相接触的光刻胶将附着在内壁上，冷却固化并揭掉PDMS柔性模板后，就在基片表面上得到了中空微通道结构。本发明与其他制备中空微通道的方法相比，具有成本低廉，工艺简单等优点。本发明适用于微细加工、微流控芯片、生物医药等应用领域。
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公开(公告)号：US20230406692A1
公开(公告)日：2023-12-21
申请号：US17878924
申请日：2022-08-02
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Jung-Hao Chang , Weng-Yi Chen
CPC classification number: B81B3/0021 , B81C1/00158 , B81B2201/0257 , B81B2203/0127 , B81B2203/0315 , B81C2201/0132 , B81C2201/0156 , B81C2201/0176
Abstract: A microelectromechanical system (MEMS) microphone includes a substrate, a membrane supported relative to the substrate, an opening extending through the entire thickness of the membrane, and a spacer disposed on the sidewall of the opening. The spacer protrudes beyond the top surface of the membrane.
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公开(公告)号：US11787685B2
公开(公告)日：2023-10-17
申请号：US17126903
申请日：2020-12-18
Applicant: STMicroelectronics S.r.l.
Inventor： Luca Seghizzi , Nicolo′ Boni , Laura Oggioni , Roberto Carminati , Marta Carminati
CPC classification number: B81B3/0021 , B81C1/0069 , B81C2201/013 , B81C2201/0156
Abstract: For manufacturing an optical microelectromechanical device, a first wafer of semiconductor material having a first surface and a second surface is machined to form a suspended mirror structure, a fixed structure surrounding the suspended mirror structure, elastic supporting elements which extend between the fixed structure and the suspended mirror structure, and an actuation structure coupled to the suspended mirror structure. A second wafer is machined separately to form a chamber delimited by a bottom wall having a through opening. The second wafer is bonded to the first surface of the first wafer in such a way that the chamber overlies the actuation structure and the through opening is aligned to the suspended mirror structure. Furthermore, a third wafer is bonded to the second surface of the first wafer to form a composite wafer device. The composite wafer device is then diced to form an optical microelectromechanical device.
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Patent Agency Ranking
公开(公告)号：US11905168B2
公开(公告)日：2024-02-20
申请号：US17072863
申请日：2020-10-16
Applicant: Microjet Technology Co., Ltd.
Inventor： Hao-Jan Mou , Hsien-Chung Tai , Lin-Huei Fang , Yung-Lung Han , Chi-Feng Huang , Chang-Yen Tsai , Wei-Ming Lee
IPC: B81C1/00 , F04B43/04 , H10N30/067 , H10N30/081 , H10N30/082 , F16K99/00
CPC classification number: B81C1/00182 , B81C1/00119 , B81C1/00166 , F04B43/046 , H10N30/067 , H10N30/081 , H10N30/082 , B81C2201/013 , B81C2201/0156 , F16K99/0048 , F16K2099/0074 , F16K2099/0094
Abstract: A manufacturing method of miniature fluid actuator is disclosed and includes the following steps. A flow-channel main body manufactured by a CMOS process is provided, and an actuating unit is formed by a deposition process, a photolithography process and an etching process. Then, at least one flow channel is formed by etching, and a vibration layer and a central through hole are formed by a photolithography process and an etching process. After that, an orifice layer is provided to form at least one outflow opening by an etching process, and then a chamber is formed by rolling a dry film material on the orifice layer. Finally, the orifice layer and the flow-channel main body are flip-chip aligned and hot-pressed, and then the miniature fluid actuator is obtained by a flip-chip alignment process and a hot pressing process.
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7.发明公开公开(公告)号：US20230219804A1
公开(公告)日：2023-07-13
申请号：US18153795
申请日：2023-01-12
Applicant: KING FAHD UNIVERSITY OF PETROLEUM AND MINERALS , King Abdullah University of Science and Technology
Inventor： Xuecui ZOU , Sally AHMED , Hossein FARIBORZI , Nizar JABER
CPC classification number: B81B3/0021 , B81C1/00158 , B81B2201/0278 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , B81B2207/017 , B81C2201/0156 , B81C2201/0188
Abstract: A MEMS temperature sensor including a clamped-clamped microbeam having a drive electrode on one side configured for applying an AC current, and a sense electrode diagonally situated on the other side, a first anchor at one end and a second anchor at the other end of the microbeam. The first anchor receive a DC bias currents, which heats the microbeam to an operating temperature. The sense electrode is configured to capacitively sense oscillations in the microbeam due to an applied AC current. The MEMS temperature sensor has a three wafer construction in which the components are formed. The device is encapsulated by aluminum, and metal wires connect the first and second anchor, the drive electrode and the sense electrode to side electrode pads outside of the encapsulation. The MEMS temperature sensor has a linear operating region of 30-60 degrees Celsius.
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公开(公告)号：US09364807B2
公开(公告)日：2016-06-14
申请号：US13635972
申请日：2011-03-10
Applicant: Christian Schoen , Michael Wagner
Inventor： Christian Schoen , Michael Wagner
CPC classification number: B01J4/001 , B01L3/502707 , B01L3/502738 , B01L3/502746 , B01L2200/0621 , B01L2200/10 , B01L2300/0636 , B01L2300/0681 , B01L2300/0816 , B01L2300/0822 , B01L2300/0864 , B01L2300/0887 , B01L2300/161 , B01L2400/0406 , B01L2400/0688 , B01L2400/088 , B81C1/00047 , B81C1/00063 , B81C2201/0105 , B81C2201/0143 , B81C2201/0156 , Y10T137/85938
Abstract: The invention relates to a component (4) of a biosensor, comprising at least one first device (6) for receiving a sample liquid, wherein the device (6) is connected via a distributor channel (7) to further receiving devices (8 to 11), into each of which a feed channel (71, 72, 73, 74) branching off from the distributor channel (7) opens, and the feed channels (71, 72, 73, 74) are arranged in succession in flow direction (S) of the sample liquid passed on through the distributor channel (7). In accordance with the invention, it is envisaged that, in the distributor channel (7), in each case between two immediately successive feed channels (71, 72; 72, 73; 73, 74) in flow direction (S), at least one region (K) for at least temporary slowing or stoppage of the capillary flow of the sample liquid has been inserted. It is thus possible to control the capillary flow of the sample liquid such that always only one receiving device (8, 9, 10, 11) is filled with the volume flow of sample liquid available before the next is filled, and effectively simultaneous filling of the receiving devices (8, 9, 10, 11) is prevented. This leads to rapid and complete filling of the respective receiving device (8, 9, 10, 11). Additionally presented is a process with which the regions (K) can be inserted into the distributor channel (7) in a simple manner.
Abstract translation: 本发明涉及生物传感器的组件（4），其包括用于接收样品液体的至少一个第一装置（6），其中所述装置（6）经由分配器通道（7）连接到另外的接收装置（8至 其中，从分配器通道（7）分支出的进料通道（71,72,73,74）打开，并且进料通道（71,72,73,74）在流动方向上连续地排列 （S）通过分配器通道（7）通过的样品液体。 根据本发明，设想在分配器通道（7）中，在每种情况下，在流动方向（S）处的两个紧邻的供给通道（71,72; 72,73; 73,74）之间至少 已经插入了用于至少暂时放慢或停止样品液体的毛细管流动的区域（K）。 因此，可以控制样品液体的毛细管流动，使得总是只有一个接收装置（8,9,10,11）填充下一个填充之前可用的样品液体的体积流量，并且有效地同时填充 接收装置（8,9,10,11）被防止。 这导致相应的接收装置（8,9,10,11）的快速和完全的填充。 另外提出了一种可以简单地将区域（K）插入到分配器通道（7）中的过程。
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公开(公告)号：US11903139B2
公开(公告)日：2024-02-13
申请号：US17181756
申请日：2021-02-22
Applicant: CARNEGIE MELLON UNIVERSITY
Inventor： Carmel Majidi , Burak Ozdoganlar , Arya Tabatabai , Bulent Arda Gozen
CPC classification number: H05K3/107 , G03F7/0002 , H05K1/0283 , B81C2201/0156 , B81C2201/0159 , H05K1/162 , H05K3/281 , H05K2201/0162 , H05K2201/10015 , H05K2203/0108 , H05K2203/0156
Abstract: The disclosure describes a soft-matter electronic device having micron-scale features, and methods to fabricate the electronic device. In some embodiments, the device comprises an elastomer mold having microchannels, which are filled with an eutectic alloy to create an electrically conductive element. The microchannels are sealed with a polymer to prevent the alloy from escaping the microchannels. In some embodiments, the alloy is drawn into the microchannels using a micro-transfer printing technique. Additionally, the molds can be created using soft-lithography or other fabrication techniques. The method described herein allows creation of micron-scale circuit features with a line width and spacing that is an order-of-magnitude smaller than those previously demonstrated.
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公开(公告)号：US20230406698A1
公开(公告)日：2023-12-21
申请号：US18333924
申请日：2023-06-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Altti TORKKELI , Jussi OKSANEN , Aarni HÄRKÖNEN , Juha LAHDENPERÄ
CPC classification number: B81C3/001 , B81B7/02 , B81B2201/0264 , B81B2203/0315 , B81B2203/0361 , B81B2207/094 , B81C2201/0147 , B81C2203/031 , B81C2201/013 , B81C2201/0156 , B81B2203/04
Abstract: A microelectromechanical element is provided with patterned regions of wafer material and glass material. The regions of glass material include at least a first glass region and a second glass region formed of a first glass material and a second glass material, respectively. The first glass material enables anodic bonding with the wafer material. An alkali metal content of the second glass material is less than an alkali metal content of the first glass material.
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