Patent search ap:("株式会社瑞萨科技") AND inv:"伊藤和利" Page 1

1.

发明授权
半导体器件及其制造方法失效转让

公开(公告)号：CN100481428C

公开(公告)日：2009-04-22

申请号：CN200610005710.9

申请日：2006-01-06

Applicant: 株式会社瑞萨科技

Inventor： 梶原良一 , 伊藤和利 , 键井秀政 , 冈浩伟 , 中村弘幸

IPC: H01L23/488 , H01L21/60 , H01L21/52 , B23K35/22 , B23K35/26

CPC classification number: H01L23/3735 , H01L23/3107 , H01L23/3677 , H01L23/4334 , H01L23/49537 , H01L23/49562 , H01L23/49575 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/04042 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29294 , H01L2224/29298 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78 , H01L2224/78301 , H01L2224/83192 , H01L2224/83206 , H01L2224/83385 , H01L2224/83801 , H01L2224/85181 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/01039 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01012 , H01L2924/01032 , H01L2924/01026 , H01L2924/01083 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929

Abstract: 本发明的课题是在管芯键合中可使用无铅焊锡。在半导体芯片(1)与Cu合金制的键和焊盘(4)之间配置应力缓冲板(8)，通过用以固相温度大于等于270℃且液相温度小于等于400℃的Sn-Sb-Ag-Cu为主要构成元素的无铅焊锡的接合材料(10、9)接合半导体芯片(1)与应力缓冲板(8)和应力缓冲板(8)与键和焊盘(4)，可使用无铅焊锡进行管芯键合而不发生芯片裂纹。

2.

发明公开
半导体器件及其制造方法失效转让

公开(公告)号：CN1812083A

公开(公告)日：2006-08-02

申请号：CN200610005710.9

申请日：2006-01-06

Applicant: 株式会社瑞萨科技

Inventor： 梶原良一 , 伊藤和利 , 键井秀政 , 冈浩伟 , 中村弘幸

IPC: H01L23/488 , H01L21/60 , H01L21/52 , B23K35/22 , B23K35/26

CPC classification number: H01L23/3735 , H01L23/3107 , H01L23/3677 , H01L23/4334 , H01L23/49537 , H01L23/49562 , H01L23/49575 , H01L24/06 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/743 , H01L24/78 , H01L24/83 , H01L24/85 , H01L24/97 , H01L2224/04042 , H01L2224/05553 , H01L2224/05624 , H01L2224/05647 , H01L2224/0603 , H01L2224/29 , H01L2224/291 , H01L2224/29101 , H01L2224/29111 , H01L2224/29294 , H01L2224/29298 , H01L2224/32245 , H01L2224/45124 , H01L2224/48091 , H01L2224/48247 , H01L2224/48472 , H01L2224/48724 , H01L2224/48747 , H01L2224/49171 , H01L2224/73265 , H01L2224/743 , H01L2224/78 , H01L2224/78301 , H01L2224/83192 , H01L2224/83206 , H01L2224/83385 , H01L2224/83801 , H01L2224/85181 , H01L2224/85205 , H01L2224/92 , H01L2224/92247 , H01L2224/97 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01023 , H01L2924/01024 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/0105 , H01L2924/01051 , H01L2924/01073 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/0133 , H01L2924/0134 , H01L2924/014 , H01L2924/10253 , H01L2924/12041 , H01L2924/181 , H01L2924/19043 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2224/83 , H01L2924/01039 , H01L2924/00 , H01L2924/00012 , H01L2924/01031 , H01L2924/01012 , H01L2924/01032 , H01L2924/01026 , H01L2924/01083 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929

Abstract: 本发明的课题是在管芯键合中可使用无铅焊锡。在半导体芯片1与Cu合金制的键和焊盘4之间配置应力缓冲板8，通过用以固相温度大于等于270℃且液相温度小于等于400℃的Sn－Sb－Ag－Cu为主要构成元素的无铅焊锡的接合材料10、9接合半导体芯片1与应力缓冲板8和应力缓冲板8与键和焊盘4，可使用无铅焊锡进行管芯键合而不发生芯片裂纹。

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