公开(公告)号：US11993740B2

公开(公告)日：2024-05-28

申请号：US17508218

申请日：2021-10-22

Applicant: KANEKA CORPORATION

Inventor： Yuichi Imamura ,  Keisuke Oguma ,  Masayoshi Kido

IPC: G02F1/1333 ,  C09K19/02 ,  C09K19/38 ,  C09K19/54 ,  H05K1/02 ,  C08F255/02 ,  C08L51/00

CPC classification number: C09K19/38 ,  C09K19/02 ,  C09K19/542 ,  H05K1/024 ,  C08F255/023 ,  C08L51/003 ,  C09K2219/03 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0183

Abstract: The present disclosure provides a low dielectric resin composition having good melt processability and excellent low dielectric characteristics in a high frequency band as compared to low dielectric materials such as liquid crystal polymers. A molded article and a film, each of which is formed from the low dielectric resin composition, a multilayer film obtained by superposing a metal foil on at least one main surface of the film, and a flexible printed wiring board which includes the film are also provided. The present disclosure includes, as a low dielectric resin composition, a resin composition which contains (A) a liquid crystal polymer and (B) a graft-modified polyolefin having a polar group. The low dielectric resin composition has a dielectric constant of 2.80 or less at a frequency of 10 GHz and a dielectric loss tangent of 0.0025 or less at a frequency of 10 GHz.

公开(公告)号：US11930595B2

公开(公告)日：2024-03-12

申请号：US17162122

申请日：2021-01-29

Applicant: Shengyi Technology Co., Ltd.

Inventor： Weifeng Yin ,  Cui Huo ,  Rui Liu ,  Yongjing Xu ,  Shanyin Yan

IPC: H05K1/03 ,  C09J11/06 ,  C09J153/02 ,  C09J171/12 ,  C09J179/08

CPC classification number: H05K1/0373 ,  C09J11/06 ,  C09J153/02 ,  C09J171/12 ,  C09J179/085 ,  C09J2203/326 ,  H05K2201/0158 ,  H05K2201/0195

Abstract: The present application provides a circuit material and a circuit board containing the same. The circuit material comprises a conductive metal layer and a dielectric substrate layer, and an adhesive layer arranged therebetween, wherein the adhesive layer is made of a material which comprises an adhesive composition comprising a resin component and a non-resin component, wherein the resin component is composed of unsaturated polyphenylene ether resin, SBS resin and maleimide resin; and the non-resin component comprises an initiator; and the adhesive layer is obtained by applying the adhesive composition dissolved in a solvent onto the surface of the conductive metal layer or the dielectric substrate layer in the form of a solution, or by applying to a release material and removing the release material after partially curing or completely curing.

公开(公告)号：US11643586B2

公开(公告)日：2023-05-09

申请号：US17040733

申请日：2019-03-26

Applicant: SHPP Global Technologies B.V.

Inventor： Jian Wang ,  Shijie Song ,  Yaqin Zhang

IPC: C09K5/14 ,  C08J3/20 ,  C08L71/12 ,  H05K1/02 ,  H05K1/03

CPC classification number: C09K5/14 ,  C08J3/203 ,  C08L71/123 ,  H05K1/024 ,  H05K1/0373 ,  C08L2203/20 ,  C08L2205/035 ,  C08L2207/066 ,  H05K2201/0158

Abstract: A polymer composition includes: from about 20 wt. % to about 80 wt. % of a polymer base resin; from about 10 wt. % to about 60 wt. % of a thermally conductive filler; and from about 5 wt. % to about 60 wt. % of a dielectric ceramic filler having a Dk of at least 20 when measured at 1.1 GHz or greater. The polymer composition exhibits a dielectric constant greater than 3.0 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150. The polymer composition exhibits a dissipation factor of less than 0.002 at 1.1 GHz when tested using a split post dielectric resonator and network analyzer on a sample size of 120 mm by 120 mm and 6 mm thickness according to ASTM D150.

公开(公告)号：US20180332720A1

公开(公告)日：2018-11-15

申请号：US16031748

申请日：2018-07-10

Applicant: Amphenol Corporation

Inventor： Arthur E. Harkness, JR. ,  Eva M. Kenny-McDermott ,  Paul W. Farineau ,  Raymond A. Lavallee ,  Michael Fancher

IPC: H05K3/46 ,  H05K3/22 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00 ,  H05K1/09 ,  H05K1/03 ,  H05K3/20

CPC classification number: H05K3/4632 ,  H05K1/0242 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0073 ,  H05K3/202 ,  H05K3/22 ,  H05K3/38 ,  H05K3/382 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4658 ,  H05K3/4685 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1194

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

公开(公告)号：US20180288296A1

公开(公告)日：2018-10-04

申请号：US15705217

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H04N5/225 ,  H05K1/02 ,  G02B5/20 ,  G02B7/00 ,  G02B7/02 ,  H04M1/02 ,  H05K1/18 ,  G02B3/00 ,  H01L27/146

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US20180012923A1

公开(公告)日：2018-01-11

申请号：US15705225

申请日：2017-09-14

Applicant: NINGBO SUNNY OPOTECH CO., LTD.

Inventor： Mingzhu WANG ,  Bojie Zhao ,  Takehiko Tanaka ,  Nan Guo ,  Zhenyu Chen ,  Heng Jiang ,  Zhongyu Luan ,  Fengsheng Xi ,  Feifan Chen ,  Liang Ding

IPC: H01L27/146

CPC classification number: G02B7/021 ,  B29C45/14639 ,  B29L2031/3481 ,  G02B3/0075 ,  G02B5/201 ,  G02B7/006 ,  G02B13/001 ,  G02B13/004 ,  H01L21/565 ,  H01L25/0655 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14627 ,  H01L27/14634 ,  H01L27/14636 ,  H01L27/14685 ,  H01L27/14687 ,  H01L27/1469 ,  H04M1/0264 ,  H04N5/2252 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/2257 ,  H04N5/2258 ,  H05K1/0203 ,  H05K1/0274 ,  H05K1/183 ,  H05K1/185 ,  H05K1/189 ,  H05K2201/0141 ,  H05K2201/0158 ,  H05K2201/0175 ,  H05K2201/09036 ,  H05K2201/10121

Abstract: An array imaging module includes a molded photosensitive assembly which includes a supporting member, at least a circuit board, at least two photosensitive units, at least two lead wires, and a mold sealer. The photosensitive units are coupled at the chip coupling area of the circuit board. The lead wires are electrically connected the photosensitive units at the chip coupling area of the circuit board. The mold sealer includes a main mold body and has two optical windows. When the main mold body is formed, the lead wires, the circuit board and the photosensitive units are sealed and molded by the main mold body of the mold sealer, such that after the main mold body is formed, the main mold body and at least a portion of the circuit board are integrally formed together at a position that the photosensitive units are aligned with the optical windows respectively.

公开(公告)号：US20170273181A1

公开(公告)日：2017-09-21

申请号：US15240132

申请日：2016-08-18

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hiesang SOHN ,  Chan KWAK ,  Mi Jeong KIM ,  Hyeon Cheol PARK ,  Weonho SHIN ,  Youngjin CHO

IPC: H05K1/09 ,  C01B31/04 ,  H05K3/22 ,  H05K1/03 ,  H05K3/14

CPC classification number: H05K1/09 ,  C01B31/0484 ,  C01B32/184 ,  H05K1/0306 ,  H05K1/0313 ,  H05K3/146 ,  H05K3/22 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2203/0783 ,  Y02E10/50

Abstract: A conductor includes a substrate, a first conductive layer disposed on the substrate and including two or more islands including graphene, and a second conductive layer disposed on the first conductive layer and including a conductive metal nanowire, wherein at least one of an upper surface and a lower surface of the islands including graphene includes a P-type dopant.

公开(公告)号：US09763326B1

公开(公告)日：2017-09-12

申请号：US14304029

申请日：2014-06-13

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/03 ,  A41D1/00 ,  H05K3/30

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more electrically conductive wire braids, one electrically conductive wire braid coupled to one electrical connection point on an electronic component. The electrically conductive wire braid is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the electrically conductive wire braid.

公开(公告)号：US09733565B2

公开(公告)日：2017-08-15

申请号：US14445771

申请日：2014-07-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Young Kwan Seo ,  Jun Young Kim

IPC: G03F7/085 ,  C07D257/04 ,  H05K3/38 ,  G03F7/004 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038 ,  H05K3/00 ,  H05K1/03

CPC classification number: G03F7/085 ,  G03F7/0047 ,  G03F7/027 ,  G03F7/029 ,  G03F7/031 ,  G03F7/038 ,  H05K1/0346 ,  H05K1/0373 ,  H05K3/0023 ,  H05K3/38 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2203/0514 ,  Y10T428/24802 ,  Y10T428/24917

Abstract: A resin composition, a printed circuit board using the composition, and a method of manufacturing the printed circuit board. The resin composition includes: a photopolymerizable compound, such as one having an ethylenically unsaturated bond which is polymerizable in a molecule, a photoinitiator, and a surface-modified silica by an alkyl sulfonated tetrazole compound.

公开(公告)号：US20160360614A1

公开(公告)日：2016-12-08

申请号：US15240958

申请日：2016-08-18

Applicant: NOVOSET, LLC

Inventor： Sajal Das ,  Patrick Shipman

IPC: H05K1/03 ,  C08J5/24 ,  B32B15/20 ,  B32B15/06 ,  B32B25/02 ,  C08F279/02 ,  C08F283/12

CPC classification number: H05K1/0326 ,  B32B15/06 ,  B32B15/20 ,  B32B25/02 ,  B32B2307/204 ,  B32B2457/08 ,  C08F279/02 ,  C08F283/12 ,  C08J5/24 ,  C08J2351/00 ,  C08J2351/08 ,  H05K1/0346 ,  H05K1/0366 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0162

Abstract: An ultra low loss dielectric thermosetting resin composition has at least one cyanate ester component (A) and at least one reactive intermediate component (B) that is capable of copolymerization with said component (A). The invention is a cyanate ester resin of the form: Tn-[W-(Z)f/(H)1-f-W]n−1-[W-(Z)f/(H)1-f-(OCN)f/(R)1-f]n+2, wherein T is a 1, 3, 5-substituted-triazine moiety (C3N3); W is a linking atom between triazine and either component A or component B; Z is component (A); H is component (B); OCN is a cyanate ester end group; R is a reactive end group of component B; n is an integer greater than or equal to 1; and f is a weight or mole fraction of component A. The composition exhibits excellent dielectric properties and yields a high performance laminate for use in high layer count, multilayer printed circuit board (PCB), prepregs, resin coated copper (RCC), film adhesives, high frequency radomes, radio frequency (RF) laminates and various composites.

Abstract translation: 超低损耗介电热固性树脂组合物具有至少一种能够与所述组分（A）共聚的氰酸酯组分（A）和至少一种反应性中间组分（B）。 本发明是以下形式的氰酸酯树脂：Tn- [W-（Z）f /（H）1-fW] n-1- [W-（Z）f /（H）1-f-（OCN） f /（R）1-f] n + 2，其中T是1,3,5-取代三嗪部分（C 3 N 3）; W是三嗪与组分A或组分B之间的连接原子; Z是组分（A）; H是组分（B）; OCN是氰酸酯端基; R是组分B的反应性端基; n是大于或等于1的整数; 并且f是组分A的重量或摩尔分数。组合物显示出优异的介电性能并产生用于高层计数，多层印刷电路板（PCB），预浸料，树脂涂层铜（RCC），膜粘合剂 ，高频雷达，射频（RF）层压板和各种复合材料。