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    Conductive bonding material fill techniques
    92.
    发明授权
    Conductive bonding material fill techniques 有权
    导电接合材料填充技术

    公开(公告)号：US07669748B2

    公开(公告)日：2010-03-02

    申请号：US12173346

    申请日：2008-07-15

    Applicant: Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    Inventor： Steven A. Cordes ,  Peter A. Gruber ,  John U. Knickerbocker ,  James L. Speidell

    IPC: B23K31/02

    CPC classification number: H05K3/3484 ,  B23K3/0607 ,  B23K2101/42 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09472 ,  H05K2203/0126 ,  H05K2203/043 ,  H05K2203/0568

    Abstract: A system provides solder into cavities in a circuit supporting substrate. The system places a fill head in substantial contact with a circuit supporting substrate. The circuit supporting substrate includes at least one cavity. A linear motion or a rotational motion is provided to at least one of the circuit supporting substrate and the fill head while the fill head is in substantial contact with the circuit supporting substrate. Solder is forced out of the fill head toward the circuit supporting substrate. The solder is provided into the at least one cavity contemporaneous with the at least one cavity being in proximity to the fill head. The system brings a second circuit supporting substrate in close proximity to the circuit supporting substrate, at least one receiving pad on the second circuit supporting substrate substantially contacts the conductive bonding material of the at least one cavity.

    Abstract translation: 系统将焊料提供到电路支撑衬底中的空腔中。 该系统使填充头与电路支撑衬底基本接触。 电路支撑衬底包括至少一个空腔。 当填充头与电路支撑衬底基本接触时，向电路支撑衬底和填充头中的至少一个提供直线运动或旋转运动。 焊料被迫从填充头朝向电路支撑基板。 焊料被提供到与填充头附近的至少一个空腔同时的至少一个空腔中。 系统使第二电路支撑衬底紧靠电路支撑衬底，第二电路支撑衬底上的至少一个接收衬垫基本上接触至少一个空腔的导电接合材料。

    SOLDER STANDOFFS FOR INJECTION MOLDING OF SOLDER
    93.
    发明申请
    SOLDER STANDOFFS FOR INJECTION MOLDING OF SOLDER 有权
    用于注射成型的焊接标准

    公开(公告)号：US20100001045A1

    公开(公告)日：2010-01-07

    申请号：US12166523

    申请日：2008-07-02

    Applicant: Steven A. Cordes ,  Peter A. Gruber

    Inventor： Steven A. Cordes ,  Peter A. Gruber

    IPC: B23K1/20

    CPC classification number: B23K1/0016 ,  B23K3/0623 ,  B23K2101/40 ,  H05K3/3478 ,  H05K3/3484 ,  H05K2203/0113 ,  H05K2203/0338 ,  H05K2203/043

    Abstract: A method of producing standoffs in an injection molded solder (IMS) mold, which possesses cavities, each of which is filled with a solder paste using standard techniques, such as screening or IMS. This solder paste is heated to a reflow temperature at which the solder melts and forms a ball or sphere. Since solder pastes are known to reduce in volume due to the therein contained organic material burning off, the remaining solder ball will be significantly lower in volume than that of the cavity. A solder material having a lower melting point is then filled into the cavities about the solder balls. The mold and solder metal are then allowed to cool, resulting in the formation of a solid sphere of metal in the cavity surrounded by solder material of a lower melting point, which, upon transfer to a wafer, form the standoffs.

    Abstract translation: 在注射成型焊料（IMS）模具中制造支座的方法，其具有空腔，其中使用诸如筛选或IMS的标准技术填充焊膏。 该焊膏被加热至回流温度，焊料熔化并形成球或球。 由于已知焊膏由于其中含有有机材料燃烧而体积减小，所以剩余的焊球体积将明显低于空腔。 然后将具有较低熔点的焊料材料填充到围绕焊料球的空腔中。 然后允许模具和焊料金属冷却，导致在由熔点较低的焊料材料包围的空腔中形成金属固体球，其在转移到晶片时形成支座。

    FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER
    95.
    发明申请
    FLEXIBLE NOZZLE FOR INJECTION MOLDED SOLDER 审中-公开
    用于注射成型焊枪的柔性喷嘴

    公开(公告)号：US20090301685A1

    公开(公告)日：2009-12-10

    申请号：US12542016

    申请日：2009-08-17

    Applicant: Peter A. Gruber ,  John U. Knickerbocker

    Inventor： Peter A. Gruber ,  John U. Knickerbocker

    IPC: B22D17/00

    CPC classification number: B22D17/2023 ,  B22D17/30 ,  B22D18/04 ,  B23K3/0623 ,  B23K3/0638 ,  H05K3/3457 ,  H05K2203/0113 ,  H05K2203/0126 ,  H05K2203/0338

    Abstract: A flexible nozzle for injection molded solder of utilizing a flexible nozzle for injection molded solder applications. In order to be able to efficiently carry out the injection molded soldering process, there is utilized a compliant or flexible solder-dispensing nozzle structure, which is particularly advantageously adapted to be utilized with circular or round molds. In this connection, the tip of the nozzle, which provides for the discharge of the solder, provides a series of small holes or apertures for extruding the solder under pressure from at least one solder reservoir. In one embodiment, there may be employed a single solder reservoir with which there communicates a plurality of discharge apertures or holes for extruding the solder so as to fill suitable cavities or recesses formed in a facing surface of a mold for injection molded solder. Alternatively, rather than dispensing or extruding the solder from a single reservoir through a plurality of holes or discharge apertures, each respective aperture or a group of apertures may be connected to, respectively, a separate solder reservoir of a plurality of reservoirs subjected to pressure to facilitate the solder extrusion onto the mold surface.

    Abstract translation: 用于注射成型焊料的柔性喷嘴，其利用用于注射成型焊料应用的柔性喷嘴。 为了能够有效地执行注射成型的焊接工艺，采用柔性或柔性的焊料分配喷嘴结构，其特别有利地适用于圆形或圆形模具。 在这方面，提供用于排出焊料的喷嘴的尖端提供一系列小孔或孔，用于在至少一个焊料储存器的压力下挤出焊料。 在一个实施例中，可以使用单个焊料储存器，其中连通多个排出孔或孔，用于挤出焊料，以填充形成在用于注射成型焊料的模具的相对表面中的合适的空腔或凹部。 或者，而不是通过多个孔或排出孔从单个储存器分配或挤出焊料，每个相应的孔或一组孔可以分别连接到经受压力的多个储存器的单独的焊料储存器 有助于将焊料挤出到模具表面上。

    Assembly Method For Reworkable Chip Stacking With Conductive Film
    97.
    发明申请
    Assembly Method For Reworkable Chip Stacking With Conductive Film 审中-公开
    带导电膜的可重复芯片堆叠的装配方法

    公开(公告)号：US20090181476A1

    公开(公告)日：2009-07-16

    申请号：US11972129

    申请日：2008-01-10

    Applicant: Stephen L. Buchwalter ,  Bing Dang ,  Claudius Feger ,  Peter A. Gruber ,  John Knickerbocker

    Inventor： Stephen L. Buchwalter ,  Bing Dang ,  Claudius Feger ,  Peter A. Gruber ,  John Knickerbocker

    IPC: H01L21/02

    CPC classification number: H01L25/0657 ,  H01L25/50 ,  H01L2225/06513 ,  H01L2225/06596 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: A method of stacking a chip, including an integrated circuit, onto a substrate including applying an anisotropic conductive film (ACF) or a solder-filled conductive film onto a surface thereof, the surface being configured to electrically couple to the film, placing the chip onto the film, the chip being configured to electrically couple to the film, compressively pressurizing the chip, the film and the surface such that the chip is electrically coupled to the surface via the film,, testing the chip to determine whether the chip is operating normally, reworking the placement of the chip onto the film and repeating the compressive pressurization if the chip is determined to not be operating normally, repeating the testing to determine whether the chip is operating normally, and once the chip is determined to be operating normally, bonding the chip, the film and the surface.

    Abstract translation: 一种将包括集成电路的芯片堆叠在基板上的方法，包括将各向异性导电膜（ACF）或焊料填充导电膜施加到其表面上，该表面被配置为电耦合到膜，将芯片 芯片被配置为电耦合到膜，对芯片，膜和表面进行压缩加压，使得芯片经由膜电耦合到表面，测试芯片以确定芯片是否正在操作 通常，如果芯片被确定为不正常工作，重复测试以确定芯片是否正常工作，并且一旦芯片确定正常工作，则将芯片放置在膜上并重复压缩加压， 粘合芯片，薄膜和表面。

    SPROCKET OPENING ALIGNMENT PROCESS AND APPARATUS FOR MULTILAYER SOLDER DECAL
    100.
    发明申请
    SPROCKET OPENING ALIGNMENT PROCESS AND APPARATUS FOR MULTILAYER SOLDER DECAL 失效
    SPROCKET打开对齐过程以及多层焊锡膏的设备

    公开(公告)号：US20090093111A1

    公开(公告)日：2009-04-09

    申请号：US11869573

    申请日：2007-10-09

    Applicant: Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

    Inventor： Stephen L. Buchwalter ,  Peter A. Gruber ,  Jae-Woong Nah ,  Da-Yuan Shih

    IPC: H01L21/44 ,  B23K1/00

    CPC classification number: H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/1131 ,  H01L2224/11849 ,  H01L2224/131 ,  H01L2924/0002 ,  H01L2924/14 ,  Y10T29/49149 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/05552

    Abstract: A process for aligning at least two layers in an abutting relationship with each other comprises forming a plurality of sprocket openings in each of the layers for receiving a sprocket of diminishing diameters as the sprocket extends outwardly from a base, with the center axes of the sprocket openings in each layer being substantially alignable with one another, the diameter of the sprocket openings in an abutting layer for first receiving the sprocket being greater than the diameter of the sprocket openings in an abutted layer. This is followed by forming a plurality of reservoir openings in each of at least two of the layers and positioning the sprocket openings in the layers to correspond with one another and the reservoir openings in the layers to correspond with one another so that substantial alignment of the center axes of the corresponding sprocket openings in the layers effects substantial alignment of the center axes of the corresponding reservoir openings in the layers. Engaging the sprocket openings with the sprocket by inserting the end of the sprocket having the smallest diameter into the sprocket openings having the largest diameter in the layers and continuing through to the sprocket opening having the smallest diameter in the layers effects substantial alignment of the center axes of the corresponding sprocket openings and substantial alignment of the center axes of the corresponding reservoir openings in the layers. The invention also comprises apparatus-for performing this process.

    Abstract translation: 用于将至少两个彼此邻接的层对准的方法包括在每个层中形成多个链轮开口，用于当链轮从基座向外延伸时接收链轮直径减小的链轮，链轮的中心轴线 每个层中的开口基本上彼此对准，用于首先接收链轮的邻接层中的链轮开口的直径大于邻接层中链轮开口的直径。 随后在至少两个层中的每一个中形成多个储存器开口，并且将链轮开口定位在层中以彼此对应并且层中的储存器开口彼此对应，使得 层中对应的链轮开口的中心轴线对层中对应的储存器开口的中心轴进行实质上的对准。 通过将具有最小直径的链轮的端部插入到具有最大直径的链轮的链轮开口中并且连续到具有最小直径的链轮开口，使链轮开口与链轮接合，使得中心轴线 的对应的链轮开口和相应的储存器开口的中心轴线在层中的基本对准。 本发明还包括用于执行该过程的装置。

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