公开(公告)号：US20150188000A1

公开(公告)日：2015-07-02

申请号：US14583210

申请日：2014-12-26

Applicant: Genesis Photonics Inc.

Inventor： Jing-En Huang ,  Shao-Ying Ting ,  Po-Jen Su ,  Chih-Ling Wu ,  Yi-Ru Huang ,  Yu-Yun Lo

IPC: H01L33/48 ,  H01L33/50 ,  H01L33/52

CPC classification number: H01L33/502 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/504 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L2933/0033

Abstract: A light emitting diode (LED) package includes at least one light emitting unit having a first electrode and a second electrode, a first molding compound covering a part of the light emitting unit to expose the first electrode and the second electrode, and a first light transmissive plate disposed on the first molding compound opposite the light emitting unit. A side surface of the first molding compound and a side surface of the first light transmissive plate are coplanar or have even adjoined edges.

Abstract translation: 发光二极管（LED）封装包括至少一个具有第一电极和第二电极的发光单元，覆盖发光单元的一部分以暴露第一电极和第二电极的第一模塑料和第一光 设置在与发光单元相对的第一模塑料上的透光板。 第一模塑料的侧表面和第一透光板的侧表面是共面的或具有相邻的边缘。

公开(公告)号：USD731989S1

公开(公告)日：2015-06-16

申请号：US29495848

申请日：2014-07-04

Applicant: Genesis Photonics Inc.

Designer： Jing-En Huang ,  Kuan-Chieh Huang ,  Shao-Ying Ting ,  Yi-Ru Huang

公开(公告)号：US20150102377A1

公开(公告)日：2015-04-16

申请号：US14513215

申请日：2014-10-14

Applicant: Genesis Photonics Inc.

Inventor： Jing-En Huang ,  Shao-Ying Ting ,  Chih-Ling Wu ,  Kuan-Yung Liao ,  Yi-Ru Huang ,  Yu-Yun Lo

IPC: H01L33/58 ,  H01L33/50 ,  H01L33/36

CPC classification number: H01L33/505 ,  H01L33/486 ,  H01L33/50 ,  H01L33/54 ,  H01L33/58

Abstract: A flip chip light emitting diode package structure includes a package carrier, a light guiding unit and at least one light emitting unit. The light guiding unit and the light emitting unit are disposed on the package carrier, and the light emitting unit is located between the light guiding unit and the package carrier. A horizontal projection area of the light guiding unit is greater than that of the light emitting unit. The light emitting unit is adapted to emit a light beam, and the light beam enters the light guiding unit and emits from an upper surface of the light guiding unit away from the light emitting unit.

Abstract translation: 倒装芯片发光二极管封装结构包括封装载体，导光单元和至少一个发光单元。 导光单元和发光单元设置在封装载体上，并且发光单元位于导光单元和封装载体之间。 导光单元的水平投影区域大于发光单元的水平投影区域。 发光单元适于发射光束，并且光束进入导光单元并且从导光单元的上表面离开发光单元发射。