公开(公告)号：US07156149B2

公开(公告)日：2007-01-02

申请号：US11142146

申请日：2005-06-01

Applicant: Robert Mergen ,  Günter Kutzik

Inventor： Robert Mergen ,  Günter Kutzik

IPC: B22D11/00 ,  B22D19/08 ,  B22F7/04 ,  B05D1/12

CPC classification number: B05D7/14 ,  B05C9/14 ,  B05C19/04 ,  B05D1/30 ,  B05D3/0245 ,  B05D3/0281 ,  B05D3/0486 ,  B05D7/52 ,  B05D2252/02 ,  B05D2401/32

Abstract: A method is described for producing a stratified composite material, with a layer of sinterable solids particles being applied to a strip-like metal carrier and being sintered with liquid phase by the supply of heat continuously in the forward feed direction. In order to provide simplified production conditions it is proposed that the metal carrier is heated continuously in the forward feed direction with a temperature profile which decreases towards lower temperatures from a maximum temperature above the melting temperature of the solids particles in the region of a surface layer receiving the particle layer towards a core layer of the metal carrier, and that the particle layer is sintered at least in a layer resting on the metal carrier by a heat transmission from the heated metal carrier.

Abstract translation: 描述了一种用于生产分层复合材料的方法，将一层可烧结固体颗粒施加到带状金属载体上，并通过在向前进给方向上连续供应热量与液相烧结。 为了提供简化的生产条件，提出金属载体在正向进给方向上连续加热，温度分布从表面层区域中固体颗粒的熔融温度以上的最高温度降低到较低的温度 将颗粒层接收到金属载体的芯层，并且通过来自加热的金属载体的热传递，至少在层上沉积颗粒层。

公开(公告)号：US20060269663A1

公开(公告)日：2006-11-30

申请号：US10547725

申请日：2004-03-04

Applicant: Katsuhiro Mori

Inventor： Katsuhiro Mori

IPC: C08F2/46 ,  B05D5/06 ,  B05D3/12

CPC classification number: B05D3/067 ,  B05D1/002 ,  B05D3/0486 ,  B05D5/061 ,  G02B1/105 ,  G02B1/14 ,  G02B1/16

Abstract: A process for efficiently forming a thick coating layer having a uniform thickness on the surface of a base material having a curved surface. The process comprises the steps of forming a coating film having a predetermined thickness by applying a coating agent containing a polymerizable monomer on the curved surface of a base material, and then curing the coating-film in an atmosphere of an oxygen concentration of not more than 500 ppm by photo-polymerization while substantially maintaining the uniformity of the thickness of the coating film. Preferably, the photo-polymerization of the coating film is carried out while rotating the base material at a rotational speed of from 20 to 1500 rpm.

Abstract translation: 在具有弯曲表面的基材的表面上有效地形成具有均匀厚度的厚涂层的方法。 该方法包括以下步骤：通过在基材的曲面上涂布含有可聚合单体的涂布剂，然后在氧浓度不大于的气氛中固化涂膜，从而形成具有预定厚度的涂膜 500ppm，同时基本上保持涂膜厚度的均匀性。 优选地，在以20-1500rpm的转速旋转基材的同时进行涂膜的光聚合。

公开(公告)号：US20060105356A1

公开(公告)日：2006-05-18

申请号：US10992889

申请日：2004-11-18

Applicant: Duane Dutton ,  Brent Tolosko

Inventor： Duane Dutton ,  Brent Tolosko

IPC: C12Q1/68 ,  C12M1/34 ,  B05D3/04 ,  B05D3/00

CPC classification number: B82Y30/00 ,  B01J19/0046 ,  B01J2219/00286 ,  B01J2219/00378 ,  B01J2219/00497 ,  B01J2219/00527 ,  B01J2219/00547 ,  B01J2219/00576 ,  B01J2219/00585 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00626 ,  B01J2219/00637 ,  B01J2219/00657 ,  B01J2219/00659 ,  B01J2219/00662 ,  B01J2219/00664 ,  B01J2219/00675 ,  B01J2219/00689 ,  B01J2219/00691 ,  B01J2219/00722 ,  B01J2219/00725 ,  B01J2219/00729 ,  B01L3/0293 ,  B01L2200/142 ,  B01L2300/0636 ,  B01L2300/10 ,  B05D3/0486

Abstract: Methods of contacting a surface of an object with a liquid are provided. Aspects of the invention include positioning an object in a reaction chamber and flowing a liquid across a surface of the object, where at least a portion of the flowing step occurs in the presence of a gas that limits evaporation of a solvent component of the liquid. Also provided are devices for practicing the subject methods.

Abstract translation: 提供了将物体的表面与液体接触的方法。 本发明的方面包括将物体定位在反应室中并使液体流过物体的表面，其中至少一部分流动步骤在限制液体的溶剂成分的蒸发的气体的存在下发生。 还提供了用于实践主题方法的装置。

公开(公告)号：US06982102B2

公开(公告)日：2006-01-03

申请号：US10801817

申请日：2004-03-17

Applicant: Hiroichi Inada ,  Shinichi Hayashi

Inventor： Hiroichi Inada ,  Shinichi Hayashi

IPC: B05D3/00

CPC classification number: H01L21/6715 ,  B05D1/005 ,  B05D3/0486 ,  G03F7/162 ,  H01L21/67017

Abstract: The present invention is a coating unit for applying a coating solution on a substrate, comprising: a container enclosing the substrate; a casing for accommodating the container therein; a supply device for supplying a predetermined gas into the casing; a first exhaust pipe for exhausting an atmosphere inside the container; a second exhaust pipe for exhausting an atmosphere inside the casing; a first adjusting device which is disposed in the first exhaust pipe, for adjusting a flow rate of an atmosphere passing through the first exhaust pipe; and a second adjusting device which is disposed in the second exhaust pipe, for adjusting a flow rate of an atmosphere passing through the second exhaust pipe. According to the present invention, the second exhaust pipe is usable for adjusting the exhaust flow rate to maintain a pressure inside the casing at a positive pressure. This makes it possible to divide, with the use of the first exhaust pipe and the second exhaust pipe, the work which satisfies the conditions of exhausting the atmosphere inside the casing to maintain the pressure inside the casing at the positive pressure relative to an amount of the supplied gas and exhausting the atmosphere inside the container at a predetermined flow rate or higher to prevent the atmosphere inside the container from flowing out of the container. Thereby, the atmospheres inside the casing and the container can be controlled more easily.

公开(公告)号：US06977098B2

公开(公告)日：2005-12-20

申请号：US09795924

申请日：2001-02-28

Applicant: Emir Gurer ,  Tom Zhong ,  John Lewellen ,  Ed Lee ,  Robert P. Mandal ,  James C. Grambow ,  Ted C. Bettes ,  Donald R. Sauer ,  Edmond R. Ward

Inventor： Emir Gurer ,  Tom Zhong ,  John Lewellen ,  Ed Lee ,  Robert P. Mandal ,  James C. Grambow ,  Ted C. Bettes ,  Donald R. Sauer ,  Edmond R. Ward

IPC: B05C5/02 ,  B05D1/00 ,  B05D1/26 ,  B05D3/04 ,  G03F1/16 ,  H01L21/00 ,  B05D3/12

CPC classification number: H01L21/6715 ,  B05C5/0208 ,  B05C5/0254 ,  B05D1/005 ,  B05D1/265 ,  B05D3/0486

Abstract: A method of and an apparatus for coating a substrate with a polymer solution to produce a film of uniform thickness, includes mounting the substrate inside an enclosed housing and passing a control gas, which may be a solvent vapor-bearing gas into the housing through an inlet. The polymer solution is deposited onto the surface of the substrate in the housing and the substrate is then spun. The control gas and any solvent vapor and particulate contaminants suspended in the control gas are exhausted from the housing through an outlet and the solvent vapor concentration is controlled by controlling the temperature of the housing and the solvent from which the solvent vapor-bearing gas is produced. Instead the concentration can be controlled by mixing gases having different solvent concentrations. The humidity of the gas may also be controlled.

Abstract translation: 一种用聚合物溶液涂覆基材以产生均匀厚度的膜的方法和装置，包括将基板安装在封闭的壳体内，并将控制气体（其可以是溶剂蒸气承载气体）通过一个 进口。 聚合物溶液沉积在壳体中的基底表面上，然后旋转基底。 控制气体和悬浮在控制气体中的任何溶剂蒸汽和颗粒污染物通过出口从壳体排出，并且通过控制壳体的温度和产生溶剂蒸气的气体的溶剂来控制溶剂蒸汽浓度 。 而是可以通过混合具有不同溶剂浓度的气体来控制浓度。 也可以控制气体的湿度。

公开(公告)号：US20050160975A1

公开(公告)日：2005-07-28

申请号：US11020852

申请日：2004-12-22

Applicant: Christopher Gilmore ,  Christopher Barney

Inventor： Christopher Gilmore ,  Christopher Barney

IPC: B05C3/02 ,  B22D31/00 ,  B05C13/00 ,  B05C13/02

CPC classification number: B05C3/09 ,  B05C3/02 ,  B05C9/12 ,  B05D1/18 ,  B05D3/0486 ,  B05D7/14 ,  B22D31/005

Abstract: A machine for impregnating a die cast metal part with liquid impregnant comprises an impregnation chamber having liquid impregnant in a lower portion, an opening for ingress and egress of the parts being defined in a side wall of the chamber above the liquid impregnant, a door for sealing the opening, a part holder in the chamber and an elevator for positioning parts above the liquid impregnant during evacuation of the chamber and then immersing the parts in the liquid impregnant during subsequent pressurization of the chamber.

Abstract translation: 用液体浸渍剂浸渍压铸金属部件的机器包括在下部具有液体浸渍剂的浸渍室，位于液体浸渍剂上方的室的侧壁中的用于进入和流出的开口，用于 密封开口，腔室中的部件保持器和用于在腔室抽出期间将液体浸渍剂上方的部件定位的电梯，然后在腔室的后续加压期间将部件浸入液体浸渍剂中。

公开(公告)号：US20050147748A1

公开(公告)日：2005-07-07

申请号：US10748457

申请日：2003-12-29

Applicant: Andrew Nguyen

Inventor： Andrew Nguyen

IPC: B05D1/00 ,  B05D3/04 ,  G03F7/16 ,  H01L21/00 ,  B05D3/12 ,  B05C11/02

CPC classification number: H01L21/6715 ,  B05D1/005 ,  B05D3/0486 ,  G03F7/162

Abstract: A method and apparatus of coating a polymer solution on a substrate such as a semiconductor wafer. The apparatus includes a coating chamber having a rotatable chuck to support a substrate to be coated with a polymer solution. A dispenser to dispense the polymer solution over the substrate extends into the coating chamber. A vapor distributor having a solvent vapor generator communicable with the coating chamber is included to cause a solvent to be transformed into a solvent vapor. A carrier gas is mixed with the solvent vapor to form a carrier-solvent vapor mixture. The carrier-solvent vapor mixture is flown into the coating chamber to saturate the coating chamber. A solvent remover communicable with the coating chamber is included to remove excess solvent that does not get transformed into the solvent vapor to prevent the excess solvent from dropping on the substrate.

Abstract translation: 一种在诸如半导体晶片的衬底上涂覆聚合物溶液的方法和设备。 该设备包括具有可旋转卡盘的涂覆室，以支撑待涂覆聚合物溶液的基材。 将聚合物溶液分配在基材上的分配器延伸到涂布室中。 包括具有与涂覆室可连通的溶剂蒸汽发生器的蒸气分配器，以使溶剂转化为溶剂蒸汽。 将载气与溶剂蒸气混合以形成载体 - 溶剂蒸气混合物。 载体 - 溶剂蒸气混合物流入涂覆室以使涂覆室饱和。 包括可与涂布室通信的溶剂去除剂以除去不被转化为溶剂蒸气的多余溶剂，以防止过量的溶剂滴落在基材上。

公开(公告)号：US20040175497A1

公开(公告)日：2004-09-09

申请号：US10801817

申请日：2004-03-17

Applicant: Tokyo Electron Limited

Inventor： Hiroichi Inada ,  Shinichi Hayashi

IPC: B05D003/12

CPC classification number: H01L21/6715 ,  B05D1/005 ,  B05D3/0486 ,  G03F7/162 ,  H01L21/67017

Abstract: The present invention is a coating unit for applying a coating solution on a substrate, comprising: a container enclosing the substrate; a casing for accommodating the container therein; a supply device for supplying a predetermined gas into the casing; a first exhaust pipe for exhausting an atmosphere inside the container; a second exhaust pipe for exhausting an atmosphere inside the casing; a first adjusting device which is disposed in the first exhaust pipe, for adjusting a flow rate of an atmosphere passing through the first exhaust pipe; and a second adjusting device which is disposed in the second exhaust pipe, for adjusting a flow rate of an atmosphere passing through the second exhaust pipe. According to the present invention, the second exhaust pipe is usable for adjusting the exhaust flow rate to maintain a pressure inside the casing at a positive pressure. This makes it possible to divide, with the use of the first exhaust pipe and the second exhaust pipe, the work which satisfies the conditions of exhausting the atmosphere inside the casing to maintain the pressure inside the casing at the positive pressure relative to an amount of the supplied gas and exhausting the atmosphere inside the container at a predetermined flow rate or higher to prevent the atmosphere inside the container from flowing out of the container. Thereby, the atmospheres inside the casing and the container can be controlled more easily.

Abstract translation: 本发明是一种涂布单元，用于将涂布溶液涂覆在基材上，包括：封闭基材的容器; 用于在其中容纳容器的壳体; 用于将预定气体供应到壳体中的供应装置; 用于排出容器内的气氛的第一排气管; 用于排出壳体内的气氛的第二排气管; 第一调节装置，其设置在第一排气管中，用于调节通过第一排气管的气氛的流量; 以及第二调节装置，其设置在所述第二排气管中，用于调节通过所述第二排气管的气氛的流量。 根据本发明，第二排气管可用于调节排气流量以将壳体内的压力保持在正压力。 由此，能够利用第一排气管和第二排气管分配满足排出壳体内的气氛的条件的工作，以将壳体内的压力保持在正压下相对于 供给气体，以预定的流量或更高的流量排出容器内的气氛，防止容器内的气氛从容器流出。 因此，可以更容易地控制壳体和容器内的气氛。

公开(公告)号：US06726775B2

公开(公告)日：2004-04-27

申请号：US10421839

申请日：2003-04-24

Applicant: Kazuhiro Takeshita ,  Shinji Nagashima ,  Makoto Muramatsu ,  Yoji Mizutani ,  Kazutoshi Yano ,  Kyoshige Katayama

Inventor： Kazuhiro Takeshita ,  Shinji Nagashima ,  Makoto Muramatsu ,  Yoji Mizutani ,  Kazutoshi Yano ,  Kyoshige Katayama

IPC: C23C806

CPC classification number: H01L21/6708 ,  B05D1/005 ,  B05D3/0486 ,  B05D3/107 ,  H01L21/6715 ,  Y10S134/902

Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.

Abstract translation: 在转移晶片W之前，产生并排出混合气体，从而抑制了在气体引入室3开始时的溶剂成分的浓度和温度的波动。 将晶片W携带到老化单元中之后的胶凝步骤分为几个步骤。 直到晶片W的温度达到预定的处理温度，混合气体中的溶剂组分的平均浓度相对于晶片W的温度逐渐升高。由此，在将晶片W转移到密封室之后， 可以防止溶剂成分的气体冷凝。

公开(公告)号：US20030196595A1

公开(公告)日：2003-10-23

申请号：US10421839

申请日：2003-04-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kazuhiro Takeshita ,  Shinji Nagashima ,  Makoto Muramatsu ,  Yoji Mizutani ,  Kazutoshi Yano ,  Kyoshige Katayama

IPC: B05C011/00

CPC classification number: H01L21/6708 ,  B05D1/005 ,  B05D3/0486 ,  B05D3/107 ,  H01L21/6715 ,  Y10S134/902

Abstract: Prior to transfer of an wafer W, a mixed gas is being generated and exhausted, thereby fluctuation of concentration and temperature of a solvent component at the beginning of gas introduction into a chamber 3 is suppressed. A step of gelling after the wafer W is carried into an aging unit is divided into several steps. Until a temperature of the wafer W reaches a predetermined treatment temperature, an average concentration of the solvent component in a mixed gas is gradually raised relative to the temperature of the wafer W. Thereby, immediately after the wafer W is transferred into a sealed chamber, the gas of the solvent component is prevented from condensing.

Abstract translation: 在转移晶片W之前，产生并排出混合气体，从而抑制了在气体引入室3开始时的溶剂成分的浓度和温度的波动。 将晶片W携带到老化单元中之后的胶凝步骤分为几个步骤。 直到晶片W的温度达到预定的处理温度，混合气体中的溶剂组分的平均浓度相对于晶片W的温度逐渐升高。由此，在将晶片W转移到密封室之后， 可以防止溶剂成分的气体冷凝。