公开(公告)号：US20100005651A1

公开(公告)日：2010-01-14

申请号：US12586242

申请日：2009-09-17

Applicant: James J. Levante ,  Dennis Johnson ,  Tom Sahakian

Inventor： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC: H05K3/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

公开(公告)号：US20090315168A1

公开(公告)日：2009-12-24

申请号：US12543104

申请日：2009-08-18

Applicant: Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

Inventor： Paul W. Coteus ,  Shawn A. Hall ,  Gareth G. Hougham ,  Alphonso P. Lanzetta ,  Rick A. Rand

IPC: H01L23/52 ,  H01L21/50

CPC classification number: H05K3/325 ,  H05K2201/0314 ,  H05K2201/10545 ,  H05K2201/10719 ,  H05K2201/2018

Abstract: A package design is provided where a chip module is connected to a printed circuit board (PCB) via a land grid array (LGA) on the top surface of the PCB, and where a power supply is connected to the PCB via a second LGA on the bottom surface of the PCB. The stack of the chip module, power supply, and LGA is held in place and compressed with actuation hardware forming an adjustable frame. The package allows field replacibility of either the module, or the PS, and provides the shortest possible wiring distance from the PS to the module leading to higher performance.

Abstract translation: 提供了一种封装设计，其中芯片模块通过PCB顶表面上的焊盘网格阵列（LGA）连接到印刷电路板（PCB），并且电源通过第二个LGA连接到PCB PCB的底面。 芯片模块，电源和LGA的堆叠被保持就位并用致动硬件压缩形成可调节的框架。 该封装允许模块或PS的现场可替代性，并提供从PS到模块的最短可能布线距离，从而实现更高的性能。

公开(公告)号：US20090161331A1

公开(公告)日：2009-06-25

申请号：US12227059

申请日：2007-05-14

Applicant: Junya Sato ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

Inventor： Junya Sato ,  Nobuhiro Mikami ,  Shinji Watanabe ,  Atsumasa Sawada ,  Nozomu Nishimura

IPC: H01R12/00

CPC classification number: H05K3/368 ,  H01L2224/16225 ,  H01R12/61 ,  H01R12/714 ,  H05K1/144 ,  H05K3/365 ,  H05K2201/0314 ,  H05K2201/042 ,  H05K2201/09409 ,  H05K2201/10378 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A circuit board device, a wiring board connecting method, and a circuit board module device are provided for controlling a compression ratio of anisotropically conductive members within an optimal range, for restraining variations in the impact resilient force of the anisotropically conductive members even if an increased number of wiring boards are laminated, for restraining deformations of the wiring board and fluctuations in the impact resilient force of the anisotropically conductive members even if a static external force or the like is applied, for suppressing a linear expansion of the anisotropically conductive members, even if the ambient temperature changes, to increase the stability of electric connections, and for reducing the impact resilient force of the anisotropically conductive members to allow for a reduction in thickness. The circuit board device comprises wiring boards 101-104, anisotropically conductive members 105 placed between the individual wiring boards, functional blocks 106 separate from anisotropically conductive members 105 and are placed on the same plane as anisotropically conductive members 105 so as to enclose anisotropically conductive members 105, and a pair of holding blocks 107, 108 placed to sandwich wiring boards 101-104. These wiring boards 101-104 are kept compressed while they are clamped between pair of holding blocks 107, 108, so that they are electrically connected with each other by anisotropically conductive members 105.

Abstract translation: 提供电路板装置，布线板连接方法和电路板模块装置，用于控制各向异性导电构件在最佳范围内的压缩比，以便限制各向异性导电构件的冲击弹力的变化，即使增加 为了抑制布线基板的变形以及各向异性导电部件的冲击弹力的波动，即使施加静电外力等，也能够抑制各向异性导电部件的线膨胀，甚至 如果环境温度变化，则增加电连接的稳定性，并且用于减小各向异性导电构件的冲击弹性力以允许减小厚度。 电路板装置包括配线板101-104，放置在各个布线板之间的各向异性导电构件105，与各向异性导电构件105分离的功能块106，并且与各向异性导电构件105放置在同一平面上，以包围各向异性导电构件 105，以及一对夹持布线板101-104的保持块107,108。 这些布线板101-104被夹持在一对保持块107,108之间时被保持压缩，使得它们通过各向异性导电构件105彼此电连接。

公开(公告)号：US20090156029A1

公开(公告)日：2009-06-18

申请号：US12316677

申请日：2008-12-16

Applicant: James V. Russell

Inventor： James V. Russell

IPC: H01R4/58

CPC classification number: H01R13/2414 ,  H01R4/58 ,  H01R13/03 ,  H05K3/245 ,  H05K3/326 ,  H05K2201/0314 ,  H05K2201/10719

Abstract: An electrical connector using an isotropic conductive elastomer as the interconnect medium.

Abstract translation: 使用各向同性导电弹性体作为互连介质的电连接器。

公开(公告)号：US20090154122A1

公开(公告)日：2009-06-18

申请号：US12379199

申请日：2009-02-13

Applicant: Naoki Makamura

Inventor： Naoki Makamura

IPC: H05K1/18 ,  B23P19/00

CPC classification number: H05K3/4092 ,  H05K1/0293 ,  H05K1/186 ,  H05K3/365 ,  H05K3/4046 ,  H05K3/4611 ,  H05K3/4652 ,  H05K3/4688 ,  H05K3/4691 ,  H05K2201/0314 ,  H05K2201/09163 ,  H05K2201/09754 ,  H05K2201/09845 ,  H05K2201/10053 ,  H05K2201/10189 ,  H05K2201/10393 ,  H05K2203/308 ,  Y10T29/53174

Abstract: A mechanical component-containing board includes a board body and a mechanical component having a part thereof built in and integrated with the board body.

Abstract translation: 一种包含机械部件的板包括板主体和机械部件，其部分内置并与板体一体化。

公开(公告)号：US07544898B2

公开(公告)日：2009-06-09

申请号：US10678062

申请日：2003-10-06

Applicant: Tomio Hirano ,  Masao Ono ,  Nobuyuki Oikawa

Inventor： Tomio Hirano ,  Masao Ono ,  Nobuyuki Oikawa

IPC: H05K1/16

CPC classification number: G06F3/045 ,  G06F3/047 ,  H05K3/305 ,  H05K3/321 ,  H05K3/361 ,  H05K2201/0314 ,  H05K2203/0191

Abstract: Providing a method for manufacturing a multilayer wiring board and a touch panel, which does not cause decreasing of yields, reliabilities and productivities even though the materials of each board to be stacked are different, and which manufactures the multilayer wiring board and the touch panel at low cost with high productivities. A multilayer wired board constituting at least part of a electrical circuit board in which a plurality of wired boards are stacked so as to face their wired surfaces each other, wherein: electrical connection parts between the multilayer wired boards are connected through an elastic conductive material part adhered to one of the wired boards; and at least part of a peripheral edge portion of the elastic conductive material part is adhered by a double-sided adhesive material part to seal the plurality of multilayer wired boards.

Abstract translation: 提供一种制造多层布线板和触摸面板的方法，即使要堆叠的每个板的材料不同，也不会导致产量，可靠性和生产率的降低，并且将多层布线板和触摸面板制造在 成本低，生产效率高。 构成电路板的至少一部分的多层布线板，其中多个布线板堆叠成面对它们的布线表面，其中：多层布线板之间的电连接部分通过弹性导电材料部分 坚持其中一个有线电路板; 并且弹性导电材料部分的周缘部分的至少一部分通过双面粘合材料部分粘合以密封多个多层布线板。

公开(公告)号：US07507777B2

公开(公告)日：2009-03-24

申请号：US11445279

申请日：2006-06-02

Applicant: Daichi Todoroki ,  Tsutomu Nakamura

Inventor： Daichi Todoroki ,  Tsutomu Nakamura

IPC: C08L83/04 ,  C08G77/12

CPC classification number: H01B1/22 ,  C08G77/20 ,  C08L83/04 ,  H05K3/323 ,  H05K2201/0162 ,  H05K2201/0209 ,  H05K2201/0314 ,  C08L83/00 ,  C08L2666/54

Abstract: A press-bonding anisotropic conductive resin composition comprising (A) an organopolysiloxane having on the average at least two alkenyl groups per molecule, (B) an adhesion promoter, (C) finely divided silica, (D) metallized conductive particles, and (E) a curing agent becomes an anisotropic conductor by press bonding. The conductive particles accommodate height variations among electrode terminals, allowing the composition to achieve stable interconnects between all electrode terminals.

Abstract translation: 一种压接各向异性导电树脂组合物，其包含（A）每分子平均具有至少两个烯基的有机聚硅氧烷，（B）粘合促进剂，（C）细分二氧化硅，（D）金属化导电颗粒和（E ）固化剂通过压接成为各向异性导体。 导电颗粒适应电极端子之间的高度变化，允许组合物在所有电极端子之间实现稳定的互连。

公开(公告)号：US07385288B2

公开(公告)日：2008-06-10

申请号：US11761315

申请日：2007-06-11

Applicant: David W. Boggs ,  John H. Dungan ,  Frank A. Sanders ,  Daryl A. Sato ,  Dan Willis

Inventor： David W. Boggs ,  John H. Dungan ,  Frank A. Sanders ,  Daryl A. Sato ,  Dan Willis

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/14

CPC classification number: H05K7/1053 ,  H01L21/4853 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/321 ,  H05K7/1061 ,  H05K2201/0314 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10719

Abstract: Formation of a plurality of conductive connectors of an integrated circuit package is described. The conductive connectors made with a conductive elastomer material and formed using an interposer that includes a plurality of the conductive connectors linked together.

Abstract translation: 描述了集成电路封装的多个导电连接器的形成。 导电连接器由导电弹性体材料制成，并使用包括连接在一起的多个导电连接器的插入件形成。

公开(公告)号：US07361057B1

公开(公告)日：2008-04-22

申请号：US11670551

申请日：2007-02-02

Applicant: Shanquan Bao ,  Taojin Le ,  Hongqi Wu

Inventor： Shanquan Bao ,  Taojin Le ,  Hongqi Wu

IPC: H01R24/00

CPC classification number: G06K19/07743 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/0314 ,  H05K2201/09409 ,  H05K2201/09954 ,  Y10S439/946

Abstract: A connector system for a miniaturized form factor card allows a communications system for mobile information devices having an applications processor and user interface components. A receiving frame is provided in the mobile information device for an insertable miniaturized form factor card incorporating means for RF transmission and reception and a wireless modem. A connector moiety on the card is received in a mating moiety in the receiving frame. The miniaturized form factor card also incorporates an array of solder pads for alternative permanent engagement of a mating array of solder pads on a printed circuit board in an alternative mobile information device. The applications processor and the user interface components in the mobile information device are interconnected to digital functions of the wireless modem and means for RF transmission and reception through the connector or, alternatively, the solder pad array.

Abstract translation: 用于小型化形状因子卡的连接器系统允许具有应用处理器和用户界面组件的移动信息设备的通信系统。 在移动信息设备中提供接收帧，用于可插入小型化形状因子卡，其包括用于RF发送和接收的装置和无线调制解调器。 卡上的连接器部分被接收在接收框架中的配合部分中。 小型化外形尺寸卡还包括一组焊盘，用于可替换的移动信息装置中的印刷电路板上的匹配焊盘阵列的永久接合。 移动信息设备中的应用处理器和用户接口组件与无线调制解调器的数字功能相互连接，以及用于通过连接器进行RF传输和接收的装置，或备选地，焊盘阵列。

公开(公告)号：US20080072422A1

公开(公告)日：2008-03-27

申请号：US11803979

申请日：2007-05-15

Applicant: James J. Levante ,  Dennis Johnson ,  Tom Sahakian

Inventor： James J. Levante ,  Dennis Johnson ,  Tom Sahakian

IPC: H01R12/00

CPC classification number: H01R12/57 ,  H01R12/52 ,  H01R13/2414 ,  H05K3/326 ,  H05K3/42 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09827 ,  H05K2201/10378 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  Y10T29/49218 ,  Y10T29/49222

Abstract: A conductive elastomeric and mechanical pin and contact system for creation of a Elastromechanical Connector (1) that combines Mechanical Pins, an Insulator Array with Conductive Elastromeric Memory Material. This combination provides a low cost, high density, reliable, reusable electronic interconnect system. This system can be used in place of most connector systems in use today. It replaces any connector that uses pins and sockets and also supports the fine conductor pitch required in the semiconductor business like Ball Grid Array (BGA) Sockets and related devises. The inventive device includes mechanical pins (2), installed in an insulator (3), each mechanical pin is topped with conductive elastromeric compound (4). A mechanical pin is used for each connection point, the insulator positions the mechanical pins in an array pattern appropriate to the interconnection requirement. A conductive elastromeric compound is added to each metal pin to create the Z axis electrical coplanality to the mating unit. This connector will mate between printed circuit boards, packaged electronic assembles, BGAs or LGA type products, harnesses or cables without the need of solder or pins and sockets. Eliminating solder or pins and sockets reduces the pitch between connections. Mechanical pins are plated drawn, formed or machined conductive metal alloys. Insulator is molded or machined out of engineered plastic examples being, but not limited to, FR-4, Ultem®, Polyimide, Torlon®. Electrically conductive elastromeric compounds made up of flexible silicone and rubbers with conductive compounds added.

Abstract translation: 用于产生弹性机械连接器（1）的导电弹性体和机械销和接触系统，其结合机械销，绝缘体阵列与导电弹性记忆材料。 这种组合提供了低成本，高密度，可靠，可重复使用的电子互连系统。 该系统可用于代替目前使用的大多数连接器系统。 它替代了使用引脚和插座的任何连接器，并且还支持半导体业务中所需的精细导体间距，如球栅阵列（BGA）插座和相关设计。 本发明的装置包括安装在绝缘体（3）中的机械销（2），每个机械销顶部带有导电弹性体化合物（4）。 对于每个连接点使用机械销，绝缘体将机械销定位成适合于互连要求的阵列图案。 向每个金属销添加导电弹性体化合物以产生与配合单元的Z轴电气共同性。 该连接器将在印刷电路板，封装的电子组件，BGA或LGA型产品，线束或电缆之间配合，而不需要焊料或针脚和插座。 消除焊料或引脚和插座可减少连接间距。 机械销是电镀拉制，成型或加工的导电金属合金。 绝缘体由工程塑料实例模制或加工而成，但不限于FR-4，聚酰亚胺，Torlon（R）。 导电弹性体化合物由柔性硅胶和橡胶与导电化合物相加而成。