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    Bus bar wiring plate body for electric coupling box
    92.
    发明授权
    Bus bar wiring plate body for electric coupling box 失效
    母线巴电线板电主板

    公开(公告)号：US6444911B2

    公开(公告)日：2002-09-03

    申请号：US82252101

    申请日：2001-04-02

    Applicant: YAZAKI CORP

    Inventor： MARUYAMA MITSUKO ,  YAMANASHI HIDENORI

    IPC: B29C35/02 ,  H01R4/70 ,  H01R9/03 ,  H02G3/16 ,  H02G5/00 ,  H05K1/00 ,  H05K3/20 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H02G5/005 ,  H02G3/16 ,  H05K1/0298 ,  H05K3/202 ,  H05K3/4084 ,  H05K3/4611 ,  H05K2201/0352 ,  H05K2201/0382 ,  H05K2201/0391 ,  H05K2201/0397 ,  H05K2203/063

    Abstract: A bus wiring plate body (20), for an electric coupling box, is arranged in a manner that bus bar members (23, 24) are wired between pre-hardening epoxy resin plates (21, 22) and these pre-hardening epoxy resin plates are subjected to a heat pressing process to thereby integrate the pre-hardening epoxy resin plates (21, 22) and the bus bar members (23, 24) in a laminated state. When hardened epoxy resin plates (25, 26) are disposed outside of the pre- hardening epoxy resin plates (21, 22), respectively, the strength of the bus bar wiring plate body (20) can be improved. Thus, since the bus bar members (23, 24) are sealed in an insulated state, leak current is reduced. Further, the thickness of the bus bar wiring plate body (20) is reduced to a large extent, so that the electric coupling box can be miniaturized and lightweighted.

    Abstract translation: 用于电耦合箱的总线接线板体（20）以汇流条构件（23,24）布线在预硬化环氧树脂板（21,22）和这些预硬化环氧树脂 对板进行热压加工，从而将预硬化环氧树脂板（21,22）和汇流条构件（23,24）以层压状态一体化。 当硬化环氧树脂板（25,26）分别设置在预硬化环氧树脂板（21,22）的外侧时，可以提高母线接线板体（20）的强度。 因此，由于汇流条构件（23,24）在绝缘状态下被密封，因此泄漏电流降低。 此外，汇流条布线板体（20）的厚度大幅度减小，能够将电耦合盒小型化，轻量化。

    Ceramic circuit substrate and method of fabricating the same
    96.
    发明授权
    Ceramic circuit substrate and method of fabricating the same 失效
    陶瓷电路基板及其制造方法

    公开(公告)号：US6103354A

    公开(公告)日：2000-08-15

    申请号：US934674

    申请日：1997-09-22

    Applicant: Hideaki Araki ,  Kunihiko Mori

    Inventor： Hideaki Araki ,  Kunihiko Mori

    IPC: H01L21/48 ,  H01L23/538 ,  H05K3/24 ,  H05K3/46 ,  B32B3/00 ,  B32B31/20 ,  B32B31/26

    CPC classification number: H01L23/538 ,  H01L21/4867 ,  H05K3/245 ,  H01L2924/0002 ,  H05K2201/0352 ,  H05K2203/1476 ,  H05K3/4629 ,  Y10S428/901 ,  Y10T428/12347 ,  Y10T428/24926

    Abstract: A ceramic circuit substrate includes an insulating layer fabricated of a ceramic, a first surface conductor layer fabricated on a surface of the insulating layer and embedded in the insulating layer except at least its surface, and a second surface conductor layer fabricated to be stacked on the first surface conductor layer. A method of fabricating the ceramic circuit substrate includes the steps of printing a first surface conductor layer on a surface of a ceramic green sheet forming an insulating layer, laminating the green sheet and another green sheet on which an inner conductor layer is printed, and co-firing the green sheets, thereby fabricating the first surface conductor layer on a surface of a multilayer substrate, and printing a second surface conductor layer on the first surface conductor layer so that the second surface conductor layer is stacked on the first surface conductor layer and firing the second surface conductor layer, thereby fabricating the two stacked surface conductor layers on the surface of the multilayer substrate.

    Abstract translation: 陶瓷电路基板包括由陶瓷制成的绝缘层，在绝缘层的表面上制造的第一表面导体层，并且绝缘层至少除了其表面之外，还包括第二表面导体层， 第一表面导体层。 制造陶瓷电路基板的方法包括以下步骤：在形成绝缘层的陶瓷生片的表面上印刷第一表面导体层，层叠生片和印有内导体层的另一生片， 从而在多层基板的表面上制造第一表面导体层，在第一表面导体层上印刷第二表面导体层，使第二表面导体层层叠在第一表面导体层上， 烧制第二表面导体层，从而在多层基板的表面上制造两层叠的表面导体层。

    Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly
    97.
    发明授权
    Electronic control board assembly including embedded lead frames for electrically connecting the circuit boards of the assembly 失效
    电子控制板组件，包括用于电连接组件的电路板的嵌入式引线框架

    公开(公告)号：US5699235A

    公开(公告)日：1997-12-16

    申请号：US507729

    申请日：1995-07-26

    Applicant: Osamu Tsurumiya ,  Hitoshi Suda ,  Kazuyuki Iwasaki ,  Naofumi Inomata

    Inventor： Osamu Tsurumiya ,  Hitoshi Suda ,  Kazuyuki Iwasaki ,  Naofumi Inomata

    IPC: H05K1/18 ,  H05K1/02 ,  H05K1/14 ,  H05K3/20 ,  H05K3/22 ,  H05K3/34 ,  H05K3/36 ,  H05K5/00 ,  H05K7/14 ,  H01R9/09 ,  H01R23/68

    CPC classification number: H05K1/0265 ,  H05K1/141 ,  H05K5/0047 ,  H05K7/1432 ,  H05K1/144 ,  H05K2201/0352 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/09972 ,  H05K3/202 ,  H05K3/222 ,  H05K3/3447 ,  H05K3/366 ,  H05K3/368

    Abstract: An electronic control board assembly has a large-current control unit and a small-current control unit connected to the large-current control unit. The large-current control unit has an insert-molded board with lead frames embedded therein. The insert-molded board has a first component mounting surface and a first component soldering surface facing away therefrom. A first group of components are mounted on the first component mounting surface and have leads extending through the insert-molded board and soldered to the lead frames. The small-current control unit has a printed wiring board which has a second component mounting surface and a second component soldering surface facing away therefrom. A second group of components are mounted on the second component mounting surface and have leads extending through the printed wiring board and soldered to interconnections patterned on the second component soldering surface. The lead frames have ends extending through the printed wiring board and soldered to the interconnections. The first component soldering surface and the second component soldering surface face outwardly.

    Abstract translation: 电子控制板组件具有连接到大电流控制单元的大电流控制单元和小电流控制单元。 大电流控制单元具有插入成型板，其中引入框架嵌入其中。 插入成型板具有第一部件安装表面和与其背离的第一部件焊接表面。 第一组部件安装在第一部件安装表面上，并且具有延伸穿过嵌入成型板并且焊接到引线框架的引线。 小电流控制单元具有印刷电路板，其具有第二部件安装表面和与其背离的第二部件焊接表面。 第二组部件安装在第二部件安装表面上，并具有延伸穿过印刷线路板的引线，并焊接到在第二部件焊接表面上图案化的互连。 引线框架的端部延伸穿过印刷电路板并焊接到互连。 第一部件焊接表面和第二部件焊接表面朝外。

    Laminated electronic package including a power/ground assembly
    98.
    发明授权
    Laminated electronic package including a power/ground assembly 失效
    层压电子封装，包括电源/接地组件

    公开(公告)号：US5574630A

    公开(公告)日：1996-11-12

    申请号：US438952

    申请日：1995-05-11

    Applicant: John S. Kresge ,  David N. Light ,  Tien Y. Wu

    Inventor： John S. Kresge ,  David N. Light ,  Tien Y. Wu

    IPC: H01L23/32 ,  H01L23/498 ,  H01L23/50 ,  H01L23/538 ,  H05K1/14 ,  H05K3/42 ,  H05K3/46 ,  H05K7/14

    CPC classification number: H01L23/50 ,  H01L23/49861 ,  H01L23/5384 ,  H05K1/0265 ,  H05K1/144 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4688 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2924/01078 ,  H01L2924/09701 ,  H01L2924/10253 ,  H05K2201/0352 ,  H05K2201/09309 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2203/061 ,  H05K3/429 ,  H05K3/4623 ,  H05K3/4641

    Abstract: A power/ground structure and associated circuit card or board are provided in which the coefficient of thermal expansion of the power/ground structure and associated circuit board are closely matched to each other. The circuit board or card is formed of organic electrically-insulating material having electrical circuitry thereon which carries an integrated circuit chip. The power/ground assembly is formed of alternating layers of organic insulating material and at least two layers of electrically-conducting material, typically copper, one of the layers of electrically-conducting material forming a power connection and another layer of the electrically-conducting material forming a ground plane. There is also at least one additional layer of a structural material having a relatively high Young's Modulus and a CTE of less than about 10 PPM/.degree.C. Invar or copper clad Invar are preferred materials for this structure. The electrically-conducting copper material and the Invar are selected in thickness and number such that, together with the electrically-insulating material, the composite CTE of the power/ground structure closely matches that of the circuit card or board.

    Abstract translation: 提供了电源/接地结构和相关电路卡或电路板，其中电源/接地结构和相关电路板的热膨胀系数彼此紧密匹配。 电路板或卡由其上具有电路的有机电绝缘材料形成，其上承载集成电路芯片。 电源/接地组件由有机绝缘材料的交替层和至少两层导电材料（通常为铜）形成，导电材料层之一形成电源连接，另一层导电材料 形成地平面。 还有至少一个附加层的结构材料具有相对高的杨氏模量和小于约10PPM /℃的CTE。殷钢或铜包层的殷钢是该结构的优选材料。 选择导电铜材料和殷钢的厚度和数量，使得与电绝缘材料一起，电源/接地结构的复合CTE与电路卡或电路板的复合CTE密切相匹配。

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