公开(公告)号：US5095406A

公开(公告)日：1992-03-10

申请号：US587013

申请日：1990-09-24

Applicant: Ulrich Buschmann ,  Gunter Gomoll ,  Wolfgang Hauslaib

Inventor： Ulrich Buschmann ,  Gunter Gomoll ,  Wolfgang Hauslaib

IPC: H01R29/00 ,  H05K3/22

CPC classification number: H05K3/222 ,  H01R29/00 ,  H05K2201/09854 ,  H05K2201/10053

Abstract: A circuit board arrangement that is for an electronic/electromechanical apparatus and that has a mechanically actuable switch for at least two different power line voltages includes a circuit board having a polygonal cutout therethrough, which defines a plurality of polygon sides. A plurality of contact surfaces on a first side of the circuit board is provided, each such contact surface being associated with a respective polygon side of the polygonal cutout. Each of the contact surfaces is connected to an electrical conductor of a power supply unit and is positioned such that a pair of contact surfaces opposite to each other with respect to the cutout correspond to one voltage. A contact spring extends into the cutout and has a pair of spring legs respectively contacting a pair of contact surfaces positioned opposite to each other with respect to the cutout.

Abstract translation: 用于电子/机电装置并且具有用于至少两个不同电力线电压的机械致动开关的电路板装置包括限定多个多边形侧面的具有多边形切口的电路板。 提供了在电路板的第一侧上的多个接触表面，每个这样的接触表面与多边形切口的相应多边形侧相关联。 每个接触表面连接到电源单元的电导体并且被定位成使得相对于切口彼此相对的一对接触表面对应于一个电压。 接触弹簧延伸到切口中，并且具有一对分别接触相对于切口相对定位的一对接触表面的弹簧腿。

公开(公告)号：US4980217A

公开(公告)日：1990-12-25

申请号：US226013

申请日：1988-07-29

Applicant: Michael A. Grundfest ,  Joseph A. Grundfest

Inventor： Michael A. Grundfest ,  Joseph A. Grundfest

IPC: B29C70/20 ,  H05K1/03 ,  H05K1/11 ,  H05K3/00

CPC classification number: B29C70/202 ,  H05K1/0366 ,  H05K1/115 ,  B29C2793/0045 ,  B29L2031/3425 ,  H05K2201/0287 ,  H05K2201/0296 ,  H05K2201/09854 ,  H05K3/0047 ,  H05K3/005 ,  Y10S428/901 ,  Y10T428/24124 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/249924

Abstract: The reinforcing fibers in a printed circuit board laminate are arranged in an ordered manner to leave fiber-free zones for the formation of holes. The holes may be oblong to enhance the connection to electrical leads of components mounted on the printed circuit board. The holes may be oriented with their long dimensions transverse to the side of an electrical component, and the electrical component may have its leads correspondingly oriented, to improve wiring flexibility and allow more direct wiring paths.

Abstract translation: 印刷电路板层叠体中的增强纤维以有序的方式布置以留下用于形成孔的无纤维区域。 孔可以是长圆形的，以增强与安装在印刷电路板上的部件的电引线的连接。 孔可以以其横向于电气部件的侧面的长尺寸定向，并且电气部件可以使其引线相应地定向，以提高布线灵活性并允许更直接的布线路径。

公开(公告)号：US4646204A

公开(公告)日：1987-02-24

申请号：US827705

申请日：1986-02-10

Applicant: Eric A. Brauer

Inventor： Eric A. Brauer

IPC: H01R4/02 ,  H05K3/30 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K3/308 ,  H01R12/79 ,  H01R4/028 ,  H05K2201/09854 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10878 ,  H05K3/3468

Abstract: The printed circuit board (PCB) is provided with a plurality of square connector stakes, which are pressed into the respective holes disposed in the PCB. The connector stake holes are arranged on the PCB such that a conductive pad encircles each of the connector holes. The connector holes have a cross-section that provides the required mechanical interference between the connector stakes and the connector holes to hold the stakes in place prior to soldering. At the same time, the walls of the holes are configured to limit the flux from migrating to the upper portions of the connector stakes during the wave soldering operation.

Abstract translation: 印刷电路板（PCB）设置有多个方形连接器桩，其被压入设置在PCB中的各个孔中。 连接器插孔布置在PCB上，使得导电垫圈围绕每个连接器孔。 连接器孔具有横截面，其在连接器桩和连接器孔之间提供所需的机械干涉，以在焊接之前将桩保持在适当位置。 同时，孔的壁被配置为在波峰焊操作期间限制焊剂迁移到连接器桩的上部。

公开(公告)号：US4572757A

公开(公告)日：1986-02-25

申请号：US573084

申请日：1984-01-23

Applicant: Vincent A. Spadafora

Inventor： Vincent A. Spadafora

IPC: H01L23/12 ,  H01L21/48 ,  H01L23/498 ,  H05K1/09 ,  H05K3/00 ,  H05K3/32 ,  H05K3/40 ,  H05K3/42 ,  B32B31/20 ,  H01L23/48

CPC classification number: H05K3/403 ,  H01L21/4853 ,  H01L23/49805 ,  H01L24/97 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L24/45 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/14 ,  H01L2924/15787 ,  H05K1/092 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10946 ,  H05K3/0052 ,  H05K3/328 ,  H05K3/4061 ,  H05K3/42 ,  Y10T156/1056 ,  Y10T29/49121 ,  Y10T29/49139 ,  Y10T29/49142 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49165

Abstract: Individual ceramic substrates for electronic microcircuits are formed in an array having rectangular perforations which define score lines along which the array is broken to yield the individual substrates. The surfaces of the rectangular perforations are metallized and leads are attached thereto by thermocompression bonding after the array is broken. The rectangular perforations result in semi-rectangular openings around the periphery of the individual substrates, which eliminate tensile forces on the substrate during lead bonding.

Abstract translation: 用于电子微电路的单独的陶瓷衬底形成为具有矩形穿孔的阵列，其限定了阵列被破坏的刻痕线以产生单独的衬底。 在阵列破裂之后，矩形穿孔的表面被金属化并且引线通过热压粘合附着在其上。 矩形穿孔导致围绕各个基板的周边的半矩形开口，这消除了在引线接合期间在基板上的拉力。

公开(公告)号：US4336419A

公开(公告)日：1982-06-22

申请号：US167754

申请日：1980-07-14

Applicant: Yoichi Wakayama ,  Tadao Kikuchi

Inventor： Yoichi Wakayama ,  Tadao Kikuchi

IPC: H01G2/06 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/184 ,  H05K3/3442 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10643 ,  H05K2203/1178 ,  Y02P70/613

Abstract: A construction for mounting plate-like electric parts within insertion holes formed in a printed circuit board is described which has additional holes for releasing any gases formed by soldering the parts to the printed circuit board. These additional holes are formed contiguous with said insertion holes at positions spaced away from any electrodes of the plate-like electric parts.

Abstract translation: 描述了一种用于将板状电气部件安装在形成在印刷电路板中的插入孔内的结构，其具有用于释放通过将部件焊接到印刷电路板而形成的任何气体的附加孔。 这些附加孔在与板状电气部件的任何电极间隔开的位置处与所述插入孔形成邻接。

公开(公告)号：US4185378A

公开(公告)日：1980-01-29

申请号：US877555

申请日：1978-02-10

Applicant: Hideo Machida

Inventor： Hideo Machida

IPC: H05K3/00 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40 ,  H05K3/04

CPC classification number: H05K3/326 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K3/0047 ,  H05K3/306 ,  H05K3/3447 ,  Y10T29/49142

Abstract: A printed circuit base board comprising an insulating substrate having a thin electric circuit layer composed of an electrically conductive material on one surface is disclosed. This printed circuit base board is drilled at parts of the insulating substrate contiguous to component lead attaching land-forming portions of the electric circuit layer from the opposite surface of the printed circuit base board, while leaving the land-forming portions undrilled, so that composite lead-inserting holes having a size sufficient to insert component leads exactly therein and having one end closed on the side of the land-forming portions of the electric circuit layer and the other end opened are formed. Component leads are inserted in these component lead-inserting holes from the open ends thereof, the top ends of these component leads are extended through the land-forming portions to project the top ends of the component leads on the printed circuit base board, and these projected top ends of the component leads are soldered to the land-forming portions of the electric circuit layer.

Abstract translation: 公开了一种印刷电路基板，其包括在一个表面上具有由导电材料构成的薄电路层的绝缘基板。 该印刷电路基板在绝缘基板的与印刷电路基板的相对表面相邻的电路层的部件引线附着区域形成部分的部分处被钻孔，同时使得引导部分不被撞击，使得复合材料 引线插入孔的尺寸足以将部件引线准确地插入其中，并且在电路层的焊盘形成部分的一侧封闭一端，另一端形成。 部件引线从其开口端插入这些部件引线插入孔中，这些部件引线的顶端延伸穿过焊盘形成部分，以使印刷电路基板上的部件引线的顶端突出，并且这些引线 部件引线的突出顶端焊接到电路层的焊盘形成部分。

公开(公告)号：US2990498A

公开(公告)日：1961-06-27

申请号：US59531256

申请日：1956-07-02

Applicant: GEN ELECTRIC

Inventor： EVANS STEVEN W

IPC: H01G4/08 ,  H05K1/11 ,  H05K1/18

CPC classification number: H01G4/08 ,  H05K1/119 ,  H05K1/184 ,  H05K2201/09854 ,  H05K2201/10568 ,  H05K2201/10643

公开(公告)号：US20240306300A1

公开(公告)日：2024-09-12

申请号：US18000891

申请日：2022-08-18

Applicant: HONOR DEVICE CO., LTD.

Inventor： Jianqiang Guo ,  Wenjun Luo ,  Mingchuan Li

IPC: H05K1/11 ,  H01R12/62

CPC classification number: H05K1/118 ,  H01R12/62 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/09854

Abstract: A flexible circuit board, a circuit board assembly, and an electronic device are provided. The flexible circuit board includes at least a flexible dielectric layer and a first connection metal layer. The flexible dielectric layer includes a through hole extending along a thickness direction of the flexible dielectric layer. The through hole includes a middle basic hole and outer auxiliary holes. Two or more outer auxiliary holes are distributed and arranged along a circumferential direction of the middle basic hole. The middle basic hole is in communication with the two or more outer auxiliary holes. The first connection metal layer is arranged on an inner wall of the through hole and is connected to the flexible dielectric layer. The first connection metal layer includes a middle channel extending along a thickness direction.

公开(公告)号：US12089325B2

公开(公告)日：2024-09-10

申请号：US17596257

申请日：2020-06-04

Applicant: LG INNOTEK CO., LTD.

Inventor： Jae Hwa Kim ,  Seung Yul Shin ,  Sung Wuk Ryu

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0296 ,  H05K1/115 ,  H05K2201/09036 ,  H05K2201/09509 ,  H05K2201/09854

Abstract: A printed circuit board according to an embodiment includes a first insulating layer; a second insulating layer disposed on the first insulating layer; and a cavity formed in the first and second insulating layers; wherein the cavity includes a first portion formed in the second insulating layer; and a second portion formed in the first insulating layer; wherein the first portion has a first cross-sectional shape, and wherein the second part has a second cross-sectional shape different from the first cross-sectional shape.

公开(公告)号：US12082383B2

公开(公告)日：2024-09-03

申请号：US17513765

申请日：2021-10-28

Applicant: Aptiv Technologies AG

Inventor： Sebastian Melfried ,  Maciej Barszczowski

IPC: H05K9/00 ,  B60R16/02 ,  H05K5/00 ,  H05K7/14

CPC classification number: H05K9/0028 ,  B60R16/02 ,  H05K5/006 ,  H05K7/1402 ,  H05K2201/09854 ,  H05K2201/10371

Abstract: Electronic device such as a camera for a vehicle, including: a supporting frame, a main electronic substrate, provided with at least one electric or electronic component or circuit and coupled to the supporting frame; a secondary electronic substrate, provided with at least one electric or electronic component or circuit and coupled to the supporting frame; wherein the supporting frame has at least one main projecting tab and at least one secondary projecting tab, each capable to occupy a non-twisted position or a twisted position, wherein the main projecting tab, when in the twisted position, is providing an attachment of the main electronic substrate to the supporting frame, and wherein the secondary projecting tab, when in the twisted position, is providing an attachment of the secondary electronic substrate to the supporting frame.