公开(公告)号：US20020070834A1

公开(公告)日：2002-06-13

申请号：US09735030

申请日：2000-12-11

Inventor： Majid Dadafshar

IPC: H05K001/11 ,  H05K007/06

CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F27/2804 ,  H05K1/029 ,  H05K1/141 ,  H05K3/222 ,  H05K3/4611 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10196 ,  H05K2201/10303 ,  H05K2203/171

Abstract: A multi-layer micro-printed circuit board (PCB) is disclosed, which defines a magnetic component, such as a transformer, using planar technology. Instead of using the traditional twelve-layer PCB incorporating both a primary and a secondary winding, this invention stacks multiple PCBs, each having four or six layers and each including a single winding (either the primary or the secondary). The PCBs are stacked in an offset arrangement such that the pins penetrating the PCB or PCBs including the primary winding or windings do not penetrate the PCB or PCBs including the secondary winding or windings. Additionally, this offset arrangement prevents the pins penetrating the secondary PCBs from penetrating the primary PCBs in the same manner. This offset configuration thereby avoids significant flashover problems associated with current planar components. Moreover, the invention describes an arrangement whereby a jumper or other connection can be used to connect the windings in a series or in a parallel configuration allowing the user to configure the component according to user-required parameters.

Abstract translation: 公开了一种使用平面技术来限定诸如变压器的磁性部件的多层微印刷电路板（PCB）。 本发明不是使用结合了主绕组和次级绕组的传统的十二层PCB，而是堆叠多个PCB，每个PCB具有四层或六层，每个PCB包括单个绕组（主要或次级）。 PCB以偏移布置堆叠，使得贯穿PCB的引脚或包括初级绕组或绕组的PCB不穿透包括次级绕组或绕组的PCB或PCB。 此外，该偏移布置防止了穿过次级PCB的引脚以相同的方式穿透主PCB。 该偏移构造因此避免了与当前平面部件相关联的显着的闪络问题。 此外，本发明描述了一种布置，其中可以使用跳线或其它连接来以一系列或并联配置连接绕组，允许用户根据用户需要的参数来配置部件。

公开(公告)号：US20020052146A1

公开(公告)日：2002-05-02

申请号：US09434682

申请日：1999-11-05

Inventor： JAMES KEITH CUSTER ,  JAMES HIRAM ROBERSON ,  WILLIAM KERR VEITSCHEGGER

IPC: H05K001/00

CPC classification number: H01R12/7082 ,  H01R12/523 ,  H01R12/58 ,  H05K3/1216 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/10303 ,  H05K2201/10871 ,  Y10T29/49139 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49163

Abstract: A method allowing for the inexpensive automated construction of interconnections between circuit boards is provided. According to the present invention, printed circuit pins are inserted in a circuit board from the top (component side). Provided the heads of the pins are thin enough to lie beneath a solder stencil, the pins may be pre-installed on the circuit board and solder applied to the pins at the same time solder is applied to other regions of the board. Thus, known surface mount techniques may be employed to form solder connections between the pins and conductive traces on the circuit board, which facilitates the automation of the previously manual operation of soldering the printed circuit pins separately.

Abstract translation: 提供了允许在电路板之间廉价自动构建互连的方法。 根据本发明，印刷电路引脚从顶部（部件侧）插入到电路板中。 如果引脚的头部足够薄以便位于焊料模板之下，则引脚可以预先安装在电路板上，并且将焊料施加到引脚上，同时将焊料施加到板的其它区域。 因此，可以采用已知的表面贴装技术来形成引脚和电路板上的导电迹线之间的焊接连接，这有助于分别对印刷电路引脚进行以前的手动操作的自动化。

公开(公告)号：US20020007967A1

公开(公告)日：2002-01-24

申请号：US09887093

申请日：2001-06-25

Applicant: Yazaki Corporation

Inventor： Makoto Yamanashi ,  Takao Murakami ,  Hiroyuki Suzuki

IPC: H05K001/11

CPC classification number: H01R12/774 ,  H01R12/523 ,  H01R12/613 ,  H01R12/78 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10333 ,  H05K2201/10962

Abstract: A wiring unit 1 is provided with a plurality of printed circuit boards 2 which are successively stacked and pin units 3. The printed circuit boards 2 each has a conductor pattern 7 formed on the surface 6a of an insulating plate 6. The conductor pattern 7 is composed of a first plurality of belt-like conductors 11 and a second plurality of belt-like conductors 12. Through-holes 13 are formed at points 14 where the belt-like conductors 11 and 12 cross each other. The pin units 21 each is composed of a conductive pin 20 and a C-bush 21. The C-bush 21 is provided with a pair of spring segment segments 24. The C-bush 21 is press-fit into the through-hole 13 to sandwich the printed circuit board 2 between the pair of spring segments 24. The C-bush 21 is communicated with the conductor pattern 7. The pin 20 is inserted into the through-hole 13 into which the C-bush 21 is press-fit. The conductive pin 20 is communicated with the C-bush 21. In this configuration, the wiring unit can be minimized in production cost and size.

Abstract translation: 布线单元1设置有多个依次堆叠的印刷电路板2和针单元3.印刷电路板2各自具有形成在绝缘板6的表面6a上的导体图案7.导体图案7是 由第一多个带状导体11和第二多个带状导体12组成。在带状导体11和12彼此交叉的点14处形成通孔13。 销单元21各自由导电销20和C形衬套21构成.C-衬套21设置有一对弹簧段段24.将C形衬套21压配合到通孔13中 将印刷电路板2夹在该对弹簧片24之间.C-衬套21与导体图形7连通。销20被插入通孔13中，C衬套21被压入其中 。 导电销20与C型衬套21连通。在这种结构中，布线单元的生产成本和尺寸可以最小化。

公开(公告)号：US06179631B2

公开(公告)日：2001-01-30

申请号：US08975892

申请日：1997-11-21

Applicant: Stuart D. Downes ,  Leonard A. Merrill

Inventor： Stuart D. Downes ,  Leonard A. Merrill

IPC: H01R1340

CPC classification number: H01R43/0256 ,  H01R12/58 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10871 ,  H05K2203/0415

Abstract: An electrical contact that is mounted on a printed circuit board to provide an electrical connection to the printed circuit board. The contact has the structural integrity of a through-hole component with the capability of being soldered to the circuit board using a surface mount reflow process. The contact includes a pair of elongated, conductive pins with a base disposed therebetween, and a solder preform supported on one of the conductive pins adjacent the base. The pin supporting the solder preform is insertable into a plated-through hole on the circuit board so that the solder preform can be reflowed into the hole along the pin to form a solder joint between the contact and the hole. The contact may include a retainer to secure the solder preform to the pin and the end of the base adjacent the pin may be beveled to facilitate gas ventilation from the hole during the soldering process. The base may be configured so that it can be grasped with a test instrument or support a wire connection to the contact. The contact may be symmetrical so that the solder preform can be supported on either conductive pin.

Abstract translation: 安装在印刷电路板上以提供到印刷电路板的电连接的电触点。 该接触件具有通过使用表面安装回流工艺将电极焊接到电路板的能力的通孔部件的结构完整性。 接触件包括一对细长的导电销，其中设置有基部，并且支撑在与基座相邻的导电销之一上的焊料预制件。 支撑焊料预成型件的销可插入到电路板上的电镀通孔中，使得焊料预成型件可以沿着销回流到孔中，以在接触件和孔之间形成焊接接头。 触点可以包括用于将焊料预制件固定到销的保持器，并且邻近销的基座的端部可以被倾斜以便于在焊接过程期间从孔中进行气体通风。 基座可以被配置为使得其可以用测试仪器抓住或支撑与触点的电线连接。 触点可以是对称的，使得焊料预制件可以被支撑在任一导电引脚上。

公开(公告)号：US06176709B1

公开(公告)日：2001-01-23

申请号：US09472518

申请日：1999-12-27

Applicant: Yoshiiku Sonobe ,  Makoto Oya ,  Satoru Watanabe ,  Osamu Nishida

Inventor： Yoshiiku Sonobe ,  Makoto Oya ,  Satoru Watanabe ,  Osamu Nishida

IPC: H01R909

CPC classification number: H01R12/57 ,  H01L2924/0002 ,  H01R12/58 ,  H05K1/0231 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/049 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10704 ,  H01L2924/00

Abstract: A socket for an integrated circuit which is used for attaching the integrated circuit to a socket mounted on a primary wiring board with an intermediate wiring board interposed therebetween, an adapter for an integrated circuit utilizing the integrated circuit socket, and an integrated circuit assembly utilizing the integrated circuit adapter. The integrated circuit socket includes: a housing to be directly fitted with the integrated circuit; a long insertion pin which is to be inserted through the intermediate wiring board and to be fitted in the socket of the primary wiring board; a short insertion pin which is to be inserted through the intermediate wiring board but not to reach the socket of the primary wiring board; and a surface-mount pin which is to be connected to a surface of the intermediate wiring board opposed to the housing; the long insertion pin, the short insertion pin and the surface-mount pin being implanted in the housing.

Abstract translation: 一种用于集成电路的插座，其用于将集成电路连接到安装在主布线板上的插座之间的中间布线板，用于使用集成电路插座的集成电路的适配器以及利用该集成电路的集成电路组件 集成电路适配器。 集成电路插座包括：直接安装集成电路的外壳; 插入穿过中间布线板并被安装在主布线板的插座中的长插销; 插入中间布线板但不到达初级布线板的插座的短插销; 以及要连接到与壳体相对的中间布线板的表面的表面安装销; 长插入销，短插入销和表面安装销植入壳体中。

公开(公告)号：US6126459A

公开(公告)日：2000-10-03

申请号：US822535

申请日：1997-03-24

Applicant: Prathap Amerwai Reddy ,  Cuong Van Pham ,  Brian John Hayden ,  Daniel Edward Farnstrom

Inventor： Prathap Amerwai Reddy ,  Cuong Van Pham ,  Brian John Hayden ,  Daniel Edward Farnstrom

IPC: H01R12/65 ,  H05K1/11 ,  H01R9/09

CPC classification number: H05K1/119 ,  H01R12/65 ,  H05K2201/0191 ,  H05K2201/09118 ,  H05K2201/10303

Abstract: A substrate and electrical connector assembly including a unitary panel structure with metal conductors having a rigid main body portion, a rigid marginal edge portion, and a thin flexible section extending between the rigid main body portion and the rigid marginal edge portion. The assembly also includes an at least one conductive lead deposited on a surface of the plastic panel structure which extends from the rigid main body portion across the flexible section to the rigid marginal edge portion. Further included is an at least one conductive terminal affixed to the rigid marginal edge portion which is in electrical connection with the at least one conductive lead. The at least one conductive terminal is adapted to receive a mating connector. The flexible section enables the rigid marginal edge portion to move relative to the rigid main body portion.

Abstract translation: 一种基板和电连接器组件，包括具有金属导体的整体面板结构，金属导体具有刚性主体部分，刚性边缘部分以及在刚性主体部分和刚性边缘部分之间延伸的薄柔性部分。 组件还包括沉积在塑料板结构的表面上的至少一个导电引线，该导电引线从刚性主体部分穿过柔性部分延伸到刚性边缘部分。 还包括至少一个固定到刚性边缘部分的导电端子，该刚性边缘部分与至少一个导电引线电连接。 所述至少一个导电端子适于接收配合连接器。 柔性部分使得刚性边缘部分相对于刚性主体部分移动。

公开(公告)号：US6100606A

公开(公告)日：2000-08-08

申请号：US225495

申请日：1999-01-06

Applicant: Atsushi Nakahata ,  Shigeyuki Okumura ,  Tomohiro Taguchi

Inventor： Atsushi Nakahata ,  Shigeyuki Okumura ,  Tomohiro Taguchi

IPC: H01H50/10 ,  H01P1/12 ,  H05K1/02 ,  H05K3/34 ,  H03K17/04

CPC classification number: H05K1/0243 ,  H01H50/10 ,  H01P1/127 ,  H05K2201/10303 ,  H05K2201/10371 ,  H05K2201/10969 ,  H05K2203/1147 ,  H05K3/3447

Abstract: A miniaturized high frequency switching device is capable of giving an optimum over-all impedance over the length of a signal path while compensating for inevitable impedance variation seen in a particular segment of the signal path. The switching device includes a contact block having fixed contacts and a movable contact. The fixed contacts and the movable contact are surrounded by an electromagnetic shield which is supported on a conductor base to be grounded therethrough for isolating the current path from a surrounding electromagnetic field. The fixed contacts are formed respectively on one ends of terminal pins provided for electrical connection to an external load circuit operating on high frequency signals. The terminal pin extends through an insulation ring fitted in the conductor base so as to be electrically insulated therefrom and form the signal path flowing a high frequency current. An impedance compensating structure is provided in the contact block for differentiating a first impedance at a first segment of a limited length along the terminal pin from a second impedance inherent to a second segment immediately adjacent the first segment so as to give a target over-all impedance, which is between the first and second impedance, over the full length of the terminal pin.

Abstract translation: 小型化的高频开关装置能够在信号路径的长度上给出最佳的全部阻抗，同时补偿在信号路径的特定段中看到的不可避免的阻抗变化。 开关装置包括具有固定触点和可动触头的触点块。 固定触点和可动触头被电磁屏蔽围绕，电磁屏蔽被支撑在导体基座上，以便将电流路径与周围的电磁场隔离。 固定触点分别形成在端子引脚的一端上，用于与在高频信号上工作的外部负载电路电连接。 端子销延伸穿过安装在导体基座中的绝缘环，以便与其电绝缘，并形成流过高频电流的信号路径。 在接触块中提供阻抗补偿结构，用于沿着端子引脚将有限长度的第一段上的第一阻抗与紧邻第一段的第二段固有的第二阻抗进行微分，从而使目标全部 在第一和第二阻抗之间的阻抗在端子引脚的整个长度上。

公开(公告)号：US5960537A

公开(公告)日：1999-10-05

申请号：US17074

申请日：1998-02-02

Applicant: Brian R. Vicich ,  John K. Hynes

Inventor： Brian R. Vicich ,  John K. Hynes

IPC: H01R12/55 ,  H01R43/20 ,  H05K3/34 ,  H01R9/00

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H01R43/205 ,  H05K2201/10303 ,  H05K2201/1031 ,  H05K2201/10598 ,  H05K2201/10916 ,  H05K3/3484 ,  Y02P70/611 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: A fastener for an electrical connector. The fastener (10) includes a fastener body (12) having an opening (16) therethrough for receiving a pin (21). The fastener body (12) includes a plurality of gripping elements (14) protruding into the hole (16) for securing the fastener (10) to the pin (21) when disposed therebetween. The fastener (10) is then soldered to the pin (21) and to a mounting surface (34), such as a printed circuit board, by known soldering techniques.

Abstract translation: 用于电连接器的紧固件。 紧固件（10）包括紧固件主体（12），其具有穿过其的开口（16），用于接收销（21）。 紧固件主体（12）包括突出到孔（16）中的多个夹紧元件（14），用于将紧固件（10）固定在销（21）上。 紧固件（10）然后通过已知的焊接技术被焊接到销（21）和安装表面（34），例如印刷电路板。

公开(公告)号：US5749143A

公开(公告)日：1998-05-12

申请号：US695443

申请日：1996-08-12

Applicant: Joe Guillot ,  Michael Quan Dinh ,  Bill Roberts ,  Linda M. McLemore

Inventor： Joe Guillot ,  Michael Quan Dinh ,  Bill Roberts ,  Linda M. McLemore

IPC: H05K1/14 ,  H05K1/18 ,  H05K3/28 ,  H05K3/34 ,  H05K5/00 ,  H05K3/30

CPC classification number: H05K5/0095 ,  H05K1/18 ,  H05K3/284 ,  H05K5/0091 ,  H05K1/141 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/10303 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K3/3447 ,  Y10S257/924 ,  Y10T29/49146 ,  Y10T29/49171 ,  Y10T29/49172 ,  Y10T29/4922

Abstract: An electronic module comprises (a) an electrical assembly of electrical components and a cap. The cap surrounds a portion of the electrical assembly of electrical components to form a pocket between a portion of the electrical assembly of electrical components and the cap. The cap has at least one sidewall, each of the at least one sidewalls having an end, one of at least one sidewalls proximately positioned to at least one electrical lead and having at least one notch positioned in the end, the pocket filled with an encapsulant. A process comprises providing a cap and filling the cap with encapsulant, placing an electrical assembly of electrical components in the cap filled with the preselected amount of encapsulant, and allowing the electrical assembly to seat to a proper depth.

Abstract translation: 电子模块包括（a）电气部件和盖子的电气组件。 盖围绕电气部件的电气组件的一部分以在电气部件的电气组件的一部分和盖之间形成凹穴。 所述盖具有至少一个侧壁，所述至少一个侧壁中的每一个具有端部，至少一个侧壁中的至少一个侧壁中的至少一个侧壁邻近地定位到至少一个电引线并且具有位于其末端的至少一个凹口，所述凹穴填充有密封剂 。 一种方法包括提供盖子并用盖子填充盖子，将电气部件的电气组件放置在填充有预选量的密封剂的盖中，并允许电气组件座位到适当的深度。

公开(公告)号：US5734555A

公开(公告)日：1998-03-31

申请号：US220813

申请日：1994-03-30

Applicant: John Francis McMahon

Inventor： John Francis McMahon

IPC: H05K1/02 ,  H05K1/14 ,  H05K7/10 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K7/1084 ,  H01L2924/15312 ,  H05K1/144 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10416

Abstract: An electronic package for an integrated circuit (IC). The package has a plurality of first pins extending from a laminated plastic/printed circuit board substrate. The pins are coupled to the integrated circuit and provide a means for mounting the package to an external printed circuit board. The package also has an internal circuit board that is coupled to both the substrate and the IC by a plurality of second pins. Mounted to the circuit board are passive and/or active electrical elements that are connected to the integrated circuit through the second pins. Some of the second pins may extend entirely through the substrate to directly couple the internal circuit board and electrical elements to the external printed circuit board. To improve the thermal impedance of the package, the integrated circuit is mounted to a heat slug which can be attached to a heat sink. The heat sink may also provide a substrate for the internal circuit board.

Abstract translation: 用于集成电路（IC）的电子封装。 封装具有从层压的塑料/印刷电路板基板延伸的多个第一引脚。 引脚耦合到集成电路并且提供用于将封装安装到外部印刷电路板的装置。 封装还具有通过多个第二引脚耦合到基板和IC两者的内部电路板。 安装到电路板的是无源和/或有源电气元件，其通过第二引脚连接到集成电路。 一些第二引脚可以完全延伸穿过基板，以将内部电路板和电气元件直接耦合到外部印刷电路板。 为了提高封装的热阻抗，集成电路安装到可以连接到散热器的散热片上。 散热器还可以为内部电路板提供衬底。