公开(公告)号：US20100126008A1

公开(公告)日：2010-05-27

申请号：US12591240

申请日：2009-11-13

Applicant: Yoichi Kitamura ,  Minoru Hashimoto ,  Tatsuya Kaneko

Inventor： Yoichi Kitamura ,  Minoru Hashimoto ,  Tatsuya Kaneko

IPC: H05K3/10

CPC classification number: H01L23/04 ,  H01L23/10 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/09701 ,  H01L2924/15165 ,  H01L2924/16153 ,  H01L2924/16315 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/341 ,  H05K9/0056 ,  H05K2201/10371 ,  H05K2203/043 ,  H05K2203/0465 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/49165 ,  Y10T29/49171 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A circuit module containing a ceramic carrier substrate to carry electronic parts, ceramic substrate pads provided on a surface of the ceramic carrier substrate, and a lid having a cavity and a bottom surface joined to the ceramic substrate pads with solder, the lid being a stepped lid having protrusions adjacent to the cavity, and dents adjacent to the cavity with the protrusions intervening therebetween, the protrusions being in contact with the ceramic carrier substrate with a prescribed distance to the ceramic substrate pads, and the dents being joined to the ceramic substrate pads with solder.

公开(公告)号：US07714672B2

公开(公告)日：2010-05-11

申请号：US11965301

申请日：2007-12-27

Applicant: Hideo Nagaushi

Inventor： Hideo Nagaushi

IPC: H03B1/00

CPC classification number: H05K3/3405 ,  H05K3/403 ,  H05K2201/09181 ,  H05K2201/10371 ,  H05K2201/1059

Abstract: The crystal oscillator has a configuration where circuit elements including a crystal unit are arranged on a mounting board comprising external terminals, opening end faces of a concave metal cover are made to touch the surface of the mounting board, clearances from the opening end faces are comprised in the central regions at both ends in the width direction of the metal cover, protruding parts, which extend from the opening end faces and have a protrusion on an inner face, are comprised at both ends in the longitudinal direction of the metal cover, and each of the protruding parts is elastically inserted in a groove provided on both side faces in the longitudinal direction of the mounting board 1 and bonded by solder, wherein the tip side of each protrusion is thrust and bites into a metal film provided in the groove.

Abstract translation: 晶体振荡器具有将包括晶体单元的电路元件布置在包括外部端子的安装板上的构造，使凹入的金属盖的开口端面与安装板的表面接触，从开口端面的间隙被包括 在金属盖的宽度方向的两端的中央区域，从开口端面延伸并且在内表面具有突起的突出部分在金属盖的长度方向的两端包括， 每个突起部分弹性地插入设置在安装板1的纵向方向上的两个侧面上的槽中，并且通过焊料粘合，其中每个突起的末端侧被推入并咬入设置在槽中的金属膜。

公开(公告)号：US20100071942A1

公开(公告)日：2010-03-25

申请号：US12327950

申请日：2008-12-04

Applicant: MING-FENG LEE

Inventor： MING-FENG LEE

IPC: H05K1/18

CPC classification number: H05K1/0216 ,  H05K1/0243 ,  H05K2201/09318 ,  H05K2201/09972 ,  H05K2201/10083 ,  H05K2201/10371

Abstract: A circuit board includes an analog area and a digital area. The analog area includes an analog ground layer and an analog wiring layer formed on the analog ground layer. The digital area includes a digital ground layer and a digital wiring layer formed on the digital ground layer. The digital ground layer is connected with the analog ground layer to form a main ground layer. The digital wiring layer is separate from the analog wiring layer.

Abstract translation: 电路板包括模拟区域和数字区域。 模拟区域包括形成在模拟地层上的模拟接地层和模拟布线层。 数字区域包括形成在数字地层上的数字接地层和数字布线层。 数字接地层与模拟接地层连接形成主接地层。 数字布线层与模拟布线层分开。

公开(公告)号：US20100047970A1

公开(公告)日：2010-02-25

申请号：US12611412

申请日：2009-11-03

Applicant: Charles W. EICHELBERGER ,  James E. KOHL

Inventor： Charles W. EICHELBERGER ,  James E. KOHL

IPC: H01L21/50

CPC classification number: H05K3/30 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/29 ,  H01L23/3128 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/19 ,  H01L24/82 ,  H01L24/96 ,  H01L25/0652 ,  H01L2221/68345 ,  H01L2223/6677 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/20 ,  H01L2224/211 ,  H01L2224/24137 ,  H01L2224/2518 ,  H01L2224/96 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/185 ,  H05K3/4644 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10371 ,  H05K2201/10674 ,  H05K2203/0733 ,  Y10T29/49121 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  H01L2924/00

Abstract: Circuit structures and methods of fabrication are provided for facilitating implementing a complete electronic system in a compact package. The circuit structure includes, in one embodiment, a chips-first multichip base layer with conductive structures extending therethrough. An interconnect layer is disposed over the front surface of the multichip layer and includes interconnect metallization electrically connected to contact pads of the chips and to conductive structures extending through the structural material. A redistribution layer, disposed over the back surface of the multichip layer, includes a redistribution metallization also electrically connected to conductive structures extending through the structural material. Input/output contacts are arrayed over the redistribution layer, including over the lower surfaces of at least some integrated circuit chips within the multichip layer, and are electrically connected through the redistribution metallization, conductive structures, and interconnect metallization to contact pads of the integrated circuit chips of the multichip layer.

Abstract translation: 提供了电路结构和制造方法，以便于以紧凑的封装实现完整的电子系统。 在一个实施例中，电路结构包括具有延伸穿过其中的导电结构的芯片 - 第一多芯片基底层。 互连层设置在多芯层的前表面上，并且包括电连接到芯片的接触焊盘和延伸穿过结构材料的导电结构的互连金属化。 设置在多芯层的后表面上的再分配层包括还电连接到延伸穿过结构材料的导电结构的再分布金属化。 输入/输出触点排列在再分配层上，包括在多芯层内的至少一些集成电路芯片的下表面上，并且通过再分布金属化，导电结构和互连金属化电连接到集成电路的接触焊盘 多芯片层的芯片。

公开(公告)号：US07637778B2

公开(公告)日：2009-12-29

申请号：US11671707

申请日：2007-02-06

Applicant: Shuhei Sakai

Inventor： Shuhei Sakai

IPC: H01R13/648

CPC classification number: H01R12/7011 ,  H01R12/58 ,  H01R12/712 ,  H01R13/6594 ,  H05K1/0243 ,  H05K3/308 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10446 ,  H05K2201/1059 ,  H05K2201/10757 ,  H05K2203/0195 ,  H05K2203/1446

Abstract: A shield plate arranged between a connector and a circuit board for covering and shielding parts of metal pins sticking out from the circuit board when a connector provided with a board mounting surface having a plurality of metal pins and a connector connection surface is mounted at an end of the circuit board, provided with an connector-engagement part, a shield part of the metal pins, a mounting part having press-fit pins for insertion, and support parts of the press-fit pins and flexible parts at a part between the shield part and the mounting part, the press-fit pins becoming vertical to the circuit board in the state with the engagement part engaged with the connector and the free end parts of the press-fit pins provisionally inserted into the engagement holes, thereby enabling the press-fit pins to be press-fit into the engagement holes all at once by a pushing action of the support parts.

Abstract translation: 一种屏蔽板，其布置在连接器和电路板之间，用于在设置有具有多个金属销和连接器连接表面的板安装表面的连接器安装在端部的情况下覆盖和屏蔽从电路板伸出的金属销的部分 设置有连接器接合部分，金属销的屏蔽部分，具有用于插入的压配销的安装部分，并且在屏蔽件之间的部分处支撑压配合销和柔性部件的部分 部分和安装部分，压配合销在接合部与连接器接合的状态下变得垂直于电路板，并且压配合销的自由端临时插入到接合孔中，从而使得压配合 - 通过支撑部件的推动动作一次压配合到接合孔中。

公开(公告)号：US07538424B2

公开(公告)日：2009-05-26

申请号：US10888907

申请日：2004-07-08

Applicant: Donald R. Mullen ,  Ming Li

Inventor： Donald R. Mullen ,  Ming Li

IPC: H01L23/34

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L2224/32225 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/10371 ,  H05K2203/1572

Abstract: The system includes a circuit board, a semiconductor module, a heat dissipator, and at least one thermal via. The circuit board has substantially flat opposing first and second sides. The semiconductor module includes multiple semiconductor devices. The semiconductor module is oriented substantially parallel to the circuit board near the first side, while the heat dissipator is disposed near the second side. The thermal via extends through the circuit board to thermally couple the semiconductor module to the heat dissipator, which may be a heat spreader, heat sink, cooling fan, or heat pipe.

Abstract translation: 该系统包括电路板，半导体模块，散热器和至少一个热通孔。 电路板具有基本平坦的相对的第一和第二侧面。 半导体模块包括多个半导体器件。 半导体模块在第一侧附近基本上平行于电路板取向，而散热器设置在第二侧附近。 热通孔延伸穿过电路板，以将半导体模块热耦合到散热器，散热器可以是散热器，散热器，冷却风扇或热管。

公开(公告)号：US20090124126A1

公开(公告)日：2009-05-14

申请号：US12174696

申请日：2008-07-17

Applicant: Shi Yun CHO ,  Shin Hee Cho

Inventor： Shi Yun CHO ,  Shin Hee Cho

IPC: H01R13/648 ,  H01R24/00

CPC classification number: H01R13/6594 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/10189 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/2036 ,  Y02P70/611

Abstract: A SIM card connector of a portable wireless terminal has a structure that forms a space thereunder using its lower edges to place electronic parts of a printed circuit board (PCB) within the space, so that the PCB can increase its space efficiency. The SIM card connector further forms an electromagnetic wave shield around the space, so that the electromagnetic wave shield can block electromagnetic waves generated from the electronic parts.

Abstract translation: 便携式无线终端的SIM卡连接器具有使用其下边缘形成其下方的空间的结构，以将印刷电路板（PCB）的电子部件放置在该空间内，使得PCB可以增加其空间效率。 SIM卡连接器还在该空间周围形成电磁波屏蔽，使得电磁波屏蔽件可以阻挡从电子部件产生的电磁波。

公开(公告)号：US07514765B2

公开(公告)日：2009-04-07

申请号：US11410425

申请日：2006-04-25

Applicant: Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Tsung Lin

Inventor： Wen-Hung Huang ,  Ming-Chu Kuo ,  Hsien Tsung Lin

IPC: H01L23/552

CPC classification number: H05K1/18 ,  H01L2924/0002 ,  H05K2201/086 ,  H05K2201/1003 ,  H05K2201/10371 ,  Y10T29/4902 ,  H01L2924/00

Abstract: For improving efficiency of a power device having an exposed surface capable of radiating energy, a shielding layer is disposed in between the exposed surface and a conductive layer. The shielding layer causes at least a portion of the energy to be directed back into the power device, thereby substantially preventing the energy from inducing eddy currents in the conductive layer. The conductive layer is fabricated from a metal foil for compliance with electromagnetic energy leakage regulations.

Abstract translation: 为了提高具有能够辐射能量的暴露表面的功率器件的效率，在暴露表面和导电层之间设置屏蔽层。 屏蔽层使能量的至少一部分被引导回功率器件，从而基本上防止能量在导电层中引起涡流。 导电层由金属箔制成，以符合电磁能量泄漏规定。

公开(公告)号：US20090067147A1

公开(公告)日：2009-03-12

申请号：US11913083

申请日：2006-05-24

Applicant: Hiroyuki Suzuki

Inventor： Hiroyuki Suzuki

IPC: H05K1/14 ,  H05K3/36

CPC classification number: H01L23/49833 ,  H01L23/057 ,  H01L2224/16 ,  H01L2924/07811 ,  H01L2924/3025 ,  H05K3/284 ,  H05K3/361 ,  H05K2201/10371 ,  H05K2201/10977 ,  H05K2203/0173 ,  H05K2203/0195 ,  H05K2203/0278 ,  H05K2203/1572 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A circuit board connection structure and a circuit board connection method, which can extend an area for mounting electronic components and can simplify the manufacturing process, are provided.A circuit board connection structure 30 includes: a reverse face circuit pattern 43 (see FIG. 3), prepared on a reverse face 32B of a first circuit board 31; and a first electronic component 45 and a second electronic component 46, mounted on the reverse face circuit pattern 43. According to this circuit board connection method, during a process for connecting the first and second circuit boards 31 and 35, a pressing jig 55, which includes first and second contact faces 56 and 57 that respectively contact top portions 45A and 46A of the first and second electronic components 45 and 46 and a receiving face 58, which contacts a receiving face 51 and is parallel to the first circuit board 31, is arranged between the top portions 45A and 46A of the first and second electronic components 45 and 46 and the receiving base 51.

Abstract translation: 本发明提供一种电路板连接结构和电路板连接方法，其可以扩展用于安装电子元件的区域并且可以简化制造过程。 电路板连接结构30包括：在第一电路板31的反面32B上制备的反面电路图案43（参见图3）; 以及安装在反面电路图案43上的第一电子部件45和第二电子部件46.根据该电路板连接方法，在连接第一和第二电路板31,35的过程中，具有按压夹具55， 其包括分别接触第一和第二电子部件45和46的顶部45A和46A的第一和第二接触面56和57以及与接收面51接触并平行于第一电路板31的接收面58， 布置在第一和第二电子部件45和46的顶部45A和46A与接收基座51之间。

公开(公告)号：US20090008148A1

公开(公告)日：2009-01-08

申请号：US12165885

申请日：2008-07-01

Applicant: Naohiro Mashino

Inventor： Naohiro Mashino

IPC: H05K9/00

CPC classification number: H05K1/0219 ,  H01F2017/008 ,  H05K1/0218 ,  H05K1/165 ,  H05K2201/09236 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: There is provided a wiring board having a shield function. The wiring board includes: a plurality of conductive shield patterns adapted to surround a circumference of at least one electronic component mounting area on the wiring board, the plurality of conductive shield patterns being adjacent to each other; and at least one inductor formed of a conductive pattern and provided between the conductive shield patterns.

Abstract translation: 提供了具有屏蔽功能的布线板。 所述布线板包括：多个导电屏蔽图形，其适于围绕所述布线板上的至少一个电子部件安装区域的圆周，所述多个导电屏蔽图案彼此相邻; 以及由导电图案形成的至少一个电感器，并设置在导电屏蔽图案之间。