公开(公告)号：US08125790B2

公开(公告)日：2012-02-28

申请号：US12197309

申请日：2008-08-24

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H05K7/10

CPC classification number: B23K1/0016 ,  B23K2101/40 ,  H01L23/49555 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00013 ,  H05K1/111 ,  H05K3/3426 ,  H05K3/3436 ,  H05K2201/09418 ,  H05K2201/09781 ,  H05K2201/10234 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/2036 ,  H05K2203/0182 ,  H05K2203/0415 ,  H05K2203/0465 ,  H05K2203/048 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2224/29099 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: The invention discloses design concepts and means and methods that can be used for enhancing the reliability and extending the operating life of electronic devices, and assemblies incorporating such devices, and substrates and/or PCBs, especially if such assemblies are exposed to severe environmental conditions such as thermal cycling or power cycling. The main thrust of the invention is to provide flexible joints, such as columns, between the attached components, and preferably to orient such joints, so that they would present their softest bending direction towards the thermal center or fixation point of the assemblies. Joints with rectangular or elongated cross-section are preferred, and they should be oriented so that the wide face of each joint would be facing the thermal center, perpendicular to the thermal deformation ray emanating from the thermal center towards the center of each respective joint. The concepts apply equally to leadless packages as well as to leaded packages.

Abstract translation: 本发明公开了可用于增强电子设备的可靠性和延长使用寿命的设计概念和方法和方法，以及包含这种设备的组件以及衬底和/或PCB，特别是如果这样的组件暴露于恶劣的环境条件 作为热循环或动力循环。 本发明的主要目的是在附接的部件之间提供诸如柱之类的柔性接头，并且优选地定向这些接头，使得它们向组件的热中心或固定点呈现其最柔软的弯曲方向。 具有矩形或细长横截面的接头是优选的，并且它们应该被定向成使得每个接头的宽面将面向热中心，垂直于从热中心朝向每个相应接头的中心发出的热变形射线。 这些概念同样适用于无引线封装以及引线封装。

公开(公告)号：US07838987B2

公开(公告)日：2010-11-23

申请号：US11132193

申请日：2005-05-19

Applicant: Tsuyoshi So

Inventor： Tsuyoshi So

IPC: H01L23/34

CPC classification number: H05K3/303 ,  H01L23/40 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/167 ,  Y02P70/613 ,  H01L2224/0401

Abstract: An electronic device comprises a semiconductor device having a package substrate with bumps. The semiconductor device is bonded to a mounting substrate by flip-chip bonding. A standoff member supports the package substrate on the mounting substrate with a predetermined standoff between the package substrate and the mounting substrate. The standoff member comprises a hole provided in the mounting substrate, an insertion portion provided to be contained in the hole, and a standoff portion provided to contact and support the package substrate such that the standoff portion has a height, equivalent to the predetermined standoff, on the mounting substrate and enables relative displacement of the package substrate to the mounting substrate.

Abstract translation: 电子器件包括具有带凸起的封装衬底的半导体器件。 半导体器件通过倒装芯片接合而结合到安装基板。 支架构件在封装基板和安装基板之间具有预定的间隙，在安装基板上支撑封装基板。 支架构件包括设置在安装基板中的孔，设置成容纳在孔中的插入部分和设置成接触并支撑封装基板的支架部分，使得支架部分具有与预定间隔相当的高度， 并且能够使封装基板相对于安装基板相对移动。

公开(公告)号：US07791901B2

公开(公告)日：2010-09-07

申请号：US11805603

申请日：2007-05-24

Applicant: Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

Inventor： Steven L. Sailor ,  Hugh R. Hunkeler ,  Lee R. Hinze

IPC: H05K7/02 ,  H05K7/04

CPC classification number: H05K3/301 ,  H01G2/04 ,  H01G4/38 ,  H05K1/141 ,  H05K3/308 ,  H05K7/12 ,  H05K2201/10015 ,  H05K2201/10303 ,  H05K2201/10325 ,  H05K2201/10462 ,  H05K2201/10515 ,  H05K2201/10568 ,  H05K2201/10583 ,  H05K2201/10606 ,  H05K2201/2036

Abstract: A stand-off mounting apparatus includes an insulative carrier for off-board mounting of leaded or surface-mount components, particularly large temperature-sensitive discrete components such as capacitors. The carrier has a component-mounting surface that is elevated relative to the circuit board, and is positioned with respect to the circuit board such that the circuit board area under the mounting surface of the carrier is available for the placement of smaller non-temperature-sensitive components. The off-board components are mounted on the component-mounting surface of the carrier, and the carrier may include support features for providing additional mechanical support for the components. Electrical leads for electrically coupling the elevated components to the circuit board may be insert-molded in the carrier, or may be inserted into plated through-holes in the carrier.

Abstract translation: 一种悬挂式安装装置包括一个绝缘载体，用于使板状或表面安装部件脱离安装，特别是大的温度敏感的分立元件如电容器。 载体具有相对于电路板升高的部件安装表面，并且相对于电路板定位，使得载体安装表面下方的电路板区域可用于放置较小的非温度 - 敏感组件。 脱离板部件安装在载体的部件安装表面上，并且载体可以包括用于为部件提供额外的机械支撑的支撑特征。 用于将升高的部件电耦合到电路板的电引线可以嵌入成型在载体中，或者可以插入载体中的电镀通孔中。

公开(公告)号：US20100171192A1

公开(公告)日：2010-07-08

申请号：US12724928

申请日：2010-03-16

Applicant: Jari Hiltunen ,  Ian Montandon

Inventor： Jari Hiltunen ,  Ian Montandon

IPC: H01L31/02 ,  H01L21/60

CPC classification number: H04N5/2253 ,  H04N5/2257 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/09781 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613

Abstract: A reflowable camera module has a set of solder joints formed on a bottom surface of the camera module that provide electrical signal and power connections between the camera module and a printed circuit substrate. The solder joints are susceptible to failure caused by shear forces, particularly in corner regions. Additional localized mechanical supports are provided to protect those solder joints carrying power and electrical signals for the camera module. The localized mechanical supports are formed outside of a region containing the solder joints carrying power and electrical signals. The localized mechanical supports may include dummy solder joints formed in corner regions and/or dummy leads used to support the camera module. Solder joint reliability is enhanced without requiring the use of an underfill encapsulant.

Abstract translation: 可回流相机模块具有形成在相机模块的底表面上的一组焊接接头，其提供相机模块和印刷电路基板之间的电信号和电源连接。 焊点易受剪切力引起的故障，特别是在拐角区域。 提供了额外的局部机械支撑以保护承载相机模块的功率和电信号的焊点。 局部的机械支撑件形成在包含携带电力和电信号的焊点的区域的外部。 局部机械支撑件可以包括形成在拐角区域中的虚拟焊点和/或用于支撑相机模块的虚拟引线。 焊接可靠性得到提高，而不需要使用底部填充密封剂。

公开(公告)号：US20090218120A1

公开(公告)日：2009-09-03

申请号：US12345359

申请日：2008-12-29

Applicant: Toshiki OOOKA

Inventor： Toshiki OOOKA

IPC: H05K1/16 ,  G06F1/16 ,  H01R13/62

CPC classification number: H01R12/57 ,  H01R12/721 ,  H01R12/88 ,  H05K1/182 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10568 ,  Y02P70/613

Abstract: According to one embodiment, a printed circuit board includes a printed wiring board and a connector. The connector includes a housing, a lead received inside the housing, an insertion section which is provided in the housing and to which the printed wiring board is inserted, and a rotating mechanism. The rotating mechanism moves the lead to a first position in which the lead is separated from the printed wiring board by abutting the lead and moves the lead to a second position in which the lead is connected to the pad of the printed wiring board via the solder by rotating and separating from the lead when the printed wiring board is inserted into the insertion section.

Abstract translation: 根据一个实施例，印刷电路板包括印刷线路板和连接器。 连接器包括壳体，容纳在壳体内的引线，设置在壳体中并且印刷线路板插入其中的插入部分和旋转机构。 旋转机构将引线移动到第一位置，在该第一位置，引线通过邻接引线而与印刷线路板分离，并且将引线移动到第二位置，其中引线经由焊料连接到印刷线路板的焊盘 当印刷线路板插入到插入部分中时，通过旋转并与引线分离。

公开(公告)号：US20090085227A1

公开(公告)日：2009-04-02

申请号：US11914581

申请日：2006-05-09

Applicant: Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

Inventor： Tsukasa Shiraishi ,  Seiichi Nakatani ,  Seiji Karashima ,  Koichi Hirano ,  Takashi Kitae ,  Yoshihisa Yamashita ,  Takashi Ichiryu

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L21/563 ,  H01L23/552 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/06505 ,  H01L2224/13099 ,  H01L2224/1403 ,  H01L2224/14505 ,  H01L2224/16225 ,  H01L2224/27013 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75 ,  H01L2224/83007 ,  H01L2224/83051 ,  H01L2224/83101 ,  H01L2224/83136 ,  H01L2224/83139 ,  H01L2224/83205 ,  H01L2224/83801 ,  H01L2224/83888 ,  H01L2224/9201 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01009 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01056 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/303 ,  H05K3/323 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/10568 ,  H05K2201/10977 ,  H05K2201/2036 ,  H05K2203/083 ,  H05K2203/087 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/01047 ,  H01L2924/00014 ,  H01L2224/13111

Abstract: A flip chip mounting body in which a circuit substrate having a plurality of connection terminals and an electronic part (semiconductor chip) having a plurality of electrode terminals are aligned face to face with each other, with a resin composition composed of solder powder, a resin and a convection additive being sandwiched in between, while a means such as spacers is interposed in between so as to provide a uniform gap between the two parts, or the electronic part (semiconductor chip) is placed inside a plate-shaped member having two or more protruding portions, so that the solder powder is allowed to move through boiling of the convection additive and to be self-aggregated to form a solder layer, thereby electrically connecting the connection terminals and the electrode terminals; and a mounting method for such a mounting body.

Abstract translation: 一种倒装芯片安装体，其中具有多个连接端子的电路基板和具有多个电极端子的电子部件（半导体芯片）彼此面对面地对准，其中树脂组合物由焊料粉末，树脂 并且夹在其间的对流添加剂，同时诸如间隔物的装置插入其间，以便在两个部件之间提供均匀的间隙，或者将电子部件（半导体芯片）放置在具有两个或 更多的突出部分，使得焊料粉末能够通过对流添加剂的沸腾而移动并且自聚集形成焊料层，从而电连接连接端子和电极端子; 以及这种安装体的安装方法。

公开(公告)号：US07268414B2

公开(公告)日：2007-09-11

申请号：US10379979

申请日：2003-03-04

Applicant: Seung-yong Choi ,  Seung-han Paek

Inventor： Seung-yong Choi ,  Seung-han Paek

IPC: H01L23/495

CPC classification number: H05K3/303 ,  H01L23/3107 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H05K2201/10568 ,  H05K2201/10689 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00

Abstract: A semiconductor package mounted on a printed circuit board using improved-reliability solder joints is described. The semiconductor package includes a lead frame pad and lead frame lead attached to the solder joints, a semiconductor chip mounted on top of the lead frame pad, wires electrically connecting the semiconductor chip and the lead frame lead, an epoxy molding compound that exposes the lower portion surface of the lead frame pad and part of the lead frame lead, and protrusions fixed to the lower portion surface of the epoxy molding compound and positioned between the solder joints, with the protrusions supporting the semiconductor package when the epoxy molding compound is mounted on the printed circuit board.

Abstract translation: 描述了使用改进的可靠性焊接接头安装在印刷电路板上的半导体封装。 半导体封装包括引线框架焊盘和附接到焊接点的引线框架引线，安装在引线框架焊盘顶部的半导体芯片，电连接半导体芯片和引线框架引线的导线，暴露下部的环氧树脂模塑料 引线框架衬垫的部分表面和引线框架引线的一部分，以及固定到环氧树脂模制化合物的下部表面并位于焊料接头之间的凸起，当环氧模塑料安装在其上时，凸起支撑半导体封装 印刷电路板。

公开(公告)号：US20070187842A1

公开(公告)日：2007-08-16

申请号：US11673230

申请日：2007-02-09

Applicant: Sang-chul SHIN ,  Woo-cheol Jeong

Inventor： Sang-chul SHIN ,  Woo-cheol Jeong

IPC: H01L23/48

CPC classification number: H05K3/3452 ,  H05K1/189 ,  H05K3/0023 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3421 ,  H05K2201/0154 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10977 ,  H05K2201/2036 ,  Y02P70/613

Abstract: Provided is a printed circuit. The printed circuit includes a base layer, a plurality of bonding pads formed on the base layer, and an insulation barrier formed between the bonding pads. The insulation barrier prevents a short circuit caused by whisker growth on solder portions electrically connecting the bonding pads to bonding portions of an electronic element.

Abstract translation: 提供了一种印刷电路。 印刷电路包括基底层，形成在基底层上的多个接合焊盘以及形成在接合焊盘之间的绝缘屏障。 绝缘屏障防止了将焊接部分电连接到电子元件的结合部分的焊料部分上的晶须生长引起的短路。

公开(公告)号：US20070158841A1

公开(公告)日：2007-07-12

申请号：US11330253

申请日：2006-01-12

Applicant: Chi-Jang Lo

Inventor： Chi-Jang Lo

IPC: H01L23/48

CPC classification number: H05K3/303 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H05K2201/10568 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A structure of Ball Grid Array package (BGA) is provided. The plurality of bumps are attached on a substrate when processed the surface mount technology (SMT) may get stronger support, avoid the assembly structure disintegration when bearing an external force. When user uses a semi-conductor module, the assembly structure will not be damaged by external force.

Abstract translation: 提供了一种球栅阵列封装（BGA）的结构。 当处理表面贴装技术（SMT）可以获得更强的支撑时，多个凸起附着在基板上，避免在承受外力​​时组装结构的分解。 当用户使用半导体模块时，组装结构不会被外力损坏。

公开(公告)号：US07169646B2

公开(公告)日：2007-01-30

申请号：US11237090

申请日：2005-09-27

Applicant: Benjamin N. Eldridge

Inventor： Benjamin N. Eldridge

IPC: H01L21/44

CPC classification number: G01R1/0466 ,  G01R1/06711 ,  G01R1/07307 ,  G01R1/07342 ,  G01R1/07378 ,  G01R31/2886 ,  H01L21/67005 ,  H01L24/10 ,  H01L24/13 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05024 ,  H01L2224/05026 ,  H01L2224/0508 ,  H01L2224/051 ,  H01L2224/05568 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01R12/57 ,  H01R12/714 ,  H01R12/853 ,  H01R13/2407 ,  H05K3/303 ,  H05K3/325 ,  H05K3/4092 ,  H05K2201/10568 ,  H05K2201/2036 ,  Y10S439/948 ,  H01L2924/00 ,  H01L2924/00014

Abstract: Interconnect assemblies and methods for forming and using them. In one example of the invention, an interconnect assembly comprises a substrate, a resilient contact element and a stop structure. The resilient contact element is disposed on the substrate and has at least a portion thereof which is capable of moving to a first position, which is defined by the stop structure, in which the resilient contact element is in mechanical and electrical contact with another contact element. In another example of the invention, a stop structure is disposed on a first substrate with a first contact element, and this stop structure defines a first position of a resilient contact element, disposed on a second substrate, in which the resilient contact element is in mechanical and electrical contact with the first contact element. The stop structure may be formed as a sheet with openings and applied to an unsingulated semiconductor wafer with resilient contacts located in the openings.

Abstract translation: 互连组件和形成和使用它们的方法。 在本发明的一个示例中，互连组件包括基板，弹性接触元件和止动结构。 弹性接触元件设置在基板上并具有至少一部分能够移动到由止动结构限定的第一位置，其中弹性接触元件与另一个接触元件机械地和电接触 。 在本发明的另一个例子中，止动结构设置在具有第一接触元件的第一基板上，该止动结构限定弹性接触元件的第一位置，该第一位置设置在第二基板上，弹性接触元件位于其中 与第一接触元件机械和电接触。 止动结构可以形成为具有开口的片材，并且被施加到位于开口中的具有弹性接触点的未起伏半导体晶片。