公开(公告)号：US20050128894A1

公开(公告)日：2005-06-16

申请号：US10791601

申请日：2004-03-02

Applicant: Sung-Hong Won ,  Dong-Woohn Kim ,  Chang-Hwan Choi

Inventor： Sung-Hong Won ,  Dong-Woohn Kim ,  Chang-Hwan Choi

IPC: G11B7/08 ,  G11B7/00 ,  G11B7/085 ,  G11B7/09 ,  G11B7/22 ,  H05K1/02 ,  H05K3/34

CPC classification number: G11B7/0932 ,  G11B7/0933 ,  G11B7/0946 ,  G11B7/22 ,  H05K1/0271 ,  H05K3/3447 ,  H05K2201/09018 ,  H05K2201/09063 ,  H05K2201/1003 ,  H05K2201/10409 ,  H05K2201/10424 ,  H05K2201/10598 ,  H05K2201/10977 ,  H05K2201/2045

Abstract: The present invention relates, in general, to an optical pickup actuator and, more particularly, to an optical pickup actuator, in which a depression (120) is formed in a center portion of a rear surface of a wire holder (100) to be depressed, and the position of a bobbin (20) is adjusted by straining wires (30) while a center portion of a printed circuit board (200), closely attached to the rear surface of the wire holder, is pressurized using a control screw (300) to allow the printed circuit board to be arcuately deformed.

Abstract translation: 本发明一般涉及一种光学拾取器致动器，更具体地，涉及一种光学拾取器致动器，其中在电线保持器（100）的后表面的中心部分形成有凹部（120） 并且通过应变丝（30）调节线轴（20）的位置，同时使用控制螺钉将紧贴在线夹的后表面上的印刷电路板（200）的中心部分加压 300）以允许印刷电路板弧形变形。

公开(公告)号：US20050086985A1

公开(公告)日：2005-04-28

申请号：US10975868

申请日：2004-10-28

Applicant: Tommaso Rosi ,  Claudio Michetti

Inventor： Tommaso Rosi ,  Claudio Michetti

IPC: B60R25/04 ,  H05K3/20 ,  E05B15/00

CPC classification number: B60R25/04 ,  E05B81/54 ,  E05B85/02 ,  H05K3/202 ,  H05K2201/09118 ,  H05K2201/10424 ,  H05K2201/10598 ,  Y10T70/7667 ,  Y10T70/80

Abstract: A method for making a supporting body (1) for the lock of a motor vehicle, comprises the steps of: forming an intermediate element (8) made of electrically insulating material provided with conductive paths (3); setting the intermediate element (8) inside a mold (23) for forming the supporting body (1); and injecting electrically insulating material in the mold (23) for carrying out co-molding of the supporting body (1). The intermediate element (8) and the conductive paths (3) are made independently, and the conductive paths (3) are fixed on opposite faces (9, 10) of the intermediate element (8) by constraint means (15, 16) of a mechanical type.

Abstract translation: 一种用于制造用于机动车辆的锁定的支撑体（1）的方法，包括以下步骤：形成由设置有导电路径（3）的电绝缘材料制成的中间元件（8）; 将中间元件（8）设置在用于形成支撑体（1）的模具（23）内; 以及在所述模具（23）中注入电绝缘材料，以进行所述支撑体（1）的共模塑。 中间元件（8）和导电路径（3）独立制成，并且导电路径（3）通过约束装置（15,16）固定在中间元件（8）的相对面（9,10）上 机械式。

公开(公告)号：US20040090760A1

公开(公告)日：2004-05-13

申请号：US10239732

申请日：2002-11-13

Inventor： Walter Schmidt

IPC: H05K001/11 ,  H05K001/14

CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0263 ,  H05K1/0268 ,  H05K1/0272 ,  H05K1/0274 ,  H05K1/113 ,  H05K1/115 ,  H05K1/141 ,  H05K1/144 ,  H05K1/162 ,  H05K1/185 ,  H05K3/005 ,  H05K3/0055 ,  H05K3/0061 ,  H05K3/041 ,  H05K3/046 ,  H05K3/3436 ,  H05K3/368 ,  H05K3/4084 ,  H05K3/4602 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K3/4652 ,  H05K2201/0379 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/09636 ,  H05K2201/0969 ,  H05K2201/09827 ,  H05K2201/10378 ,  H05K2201/10598 ,  H05K2203/0108 ,  H05K2203/0195 ,  H05K2203/0285 ,  H05K2203/095 ,  H05K2203/1189 ,  H05K2203/163 ,  Y02P70/613 ,  H01L2924/00

Abstract: The electrical connecting element includes an essentially stiff core, essentially mechanically stiff and printed circuit boards and/or high density interconnects with conductor paths serving as interconnects. The core includes two parts (1, 3) that can be fixed to each other. Between the two parts, a cavity (101) can be formed. Components (103) producing a lot of heat or requiring protection from environmental influences can be placed in the cavity.

Abstract translation: 电连接元件包括基本上刚性的芯，基本上机械刚性的印刷电路板和/或具有用作互连的导体路径的高密度互连。 核心包括可以彼此固定的两个部分（1,3）。 在两个部分之间，可以形成空腔（101）。 产生大量热量或需要防止环境影响的部件（103）可以放置在空腔中。

公开(公告)号：US20040042179A1

公开(公告)日：2004-03-04

申请号：US10229788

申请日：2002-08-27

Inventor： Patrick Kevin Murphy

IPC: H05K007/20

CPC classification number: H05K7/20509 ,  H05K3/0061 ,  H05K3/3447 ,  H05K2201/0133 ,  H05K2201/09745 ,  H05K2201/10598

Abstract: A heatsink for a printed circuit board (PCB) overlies most or all of the board. It is clamped tightly to the board with its board-facing surface in close proximity to the heat-generating components on the board. A pliant, thermally-conductive dielectric layer is sandwiched between the PCB and the facing surface of the heatsink. Lands at various heights are formed on the heatsink surface facing the PCB to be in good heat-conducting proximity to the surfaces of heat-generating circuit components of various heights on the PCB.

Abstract translation: 印刷电路板（PCB）的散热片覆盖了大部分或全部电路板。 它被紧紧地夹在板上，其面板表面靠近板上的发热部件。 一个柔韧的导热介电层夹在PCB和散热片的相对表面之间。 在面对PCB的散热器表面上形成各种高度的地面，以使其与PCB上各种高度的发热电路部件的表面接近良好的导热性。

公开(公告)号：US06607939B2

公开(公告)日：2003-08-19

申请号：US10028261

申请日：2001-12-18

Applicant: Richard Pommer ,  Simon McElrea ,  Brad Banister

Inventor： Richard Pommer ,  Simon McElrea ,  Brad Banister

IPC: H01L2144

CPC classification number: H01L22/20 ,  H01L21/4846 ,  H01L21/4857 ,  H01L23/49833 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2924/0002 ,  H01L2924/014 ,  H05K1/0268 ,  H05K1/142 ,  H05K3/0097 ,  H05K3/225 ,  H05K3/4611 ,  H05K2201/10598 ,  H05K2203/0165 ,  Y10T29/49126 ,  H01L2924/00

Abstract: Methods and apparatus for increasing the yield achieved during high density interconnect (HDI) production. In particular, processes in which panels are tested to identify good cells/parts, good cells are removed from the panels, and new panels created entirely of identified/known good cells allow increases in the number of layers used in a HDI without incurring the decrease in yield normally associated with such a layering process.

Abstract translation: 在高密度互连（HDI）生产中提高产量的方法和装置。 特别地，其中测试面板以识别良好的细胞/部分的方法，从面板中去除良好的细胞，并且完全由识别的/已知的良好细胞产生的新的面板允许增加在HDI中使用的层数，而不会导致减少 通常与这样的分层过程相关联。

公开(公告)号：US06599135B2

公开(公告)日：2003-07-29

申请号：US09905936

申请日：2001-07-17

Applicant: Shigeki Yamane

Inventor： Shigeki Yamane

IPC: H01R909

CPC classification number: B60R16/0238 ,  H01R12/592 ,  H01R2201/26 ,  H02G3/081 ,  H05K1/144 ,  H05K1/148 ,  H05K3/363 ,  H05K5/0069 ,  H05K2201/0999 ,  H05K2201/10598

Abstract: A power distributor having a power distribution circuit, and a housing 22 in which the power distribution circuit is housed, and a method of connecting a control circuit board 18 to the power distributor. A board support portion 32 for supporting the control circuit board 18 in an erect state is provided in the housing 22. The control circuit board 18 and the power distribution circuit are connected to each other through a wiring material 30 in the condition that the control circuit board 18 is supported by the board support portion 32. Then, the control circuit board 18 is toppled over to thereby be housed in the housing 22.

Abstract translation: 具有配电电路的电力分配器和容纳配电电路的壳体22以及将控制电路基板18连接到电力分配器的方法。 在壳体22内设置有用于将直立状态下支撑控制电路基板18的板支撑部32，控制电路基板18和配电电路通过布线材料30彼此连接，条件是控制电路 板18由板支撑部分32支撑。然后，控制电路板18被推倒，从而被容纳在壳体22中。

公开(公告)号：US20030107876A1

公开(公告)日：2003-06-12

申请号：US10310297

申请日：2002-12-05

Applicant: Alps Electric Co., Ltd.

Inventor： Norio Suzuki

IPC: H05K001/14

CPC classification number: H05K9/006 ,  H05K3/366 ,  H05K7/12 ,  H05K2201/048 ,  H05K2201/09645 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: A structure for highly precisely and easily mounting an electronic circuit unit on a mother board without defective soldering, comprising a circuit board 3 provided with extending portions 3d having terminal patterns 8 formed thereon, a housing 2 for containing the circuit board 3 while permitting the extending portions 3d to protrude, and a mother board 5 having, formed therein, through holes 5a in which the extending portions 3d are to be inserted, having, formed thereon, wiring pattern (not shown) that is to be electrically connected to the terminal patterns 8, and permitting the extending portions 3d to be inserted in the through holes 5a so that the housing 2 is placed thereon. The circuit board 3 is provided with a protruded portion 3e which extends separately from the extending portions 3d and pushes the terminal patterns 8 onto the wiring pattern of the mother board 5. The mother board 5 is provided with an insertion hole 5b in which the protruded portion 3e is to be inserted being slightly deviated from the positions of the through holes 5a in which the extending portions 3d are to be inserted.

Abstract translation: 一种将电子电路单元高精度地且容易地安装在母板上而没有焊接不良的结构，包括：电路板3，其设置有形成有端子图案8的延伸部分3d;容纳电路板3的壳体2，同时允许延伸 在其上形成有通孔5a，其中形成有延伸部3d插入其中的母板5，母板5形成在其上形成有电连接到端子图案的布线图案（未示出） 如图8所示，并且允许延伸部分3d插入到通孔5a中，使得壳体2放置在其上。 电路板3设置有与延伸部3d分开延伸的突出部3e，将端子图案8推压到母板5的布线图案上。母板5设置有插入孔5b，突出部 部分3e将被插入，以从其中插入延伸部分3d的通孔5a的位置稍微偏离。

公开(公告)号：US06575411B1

公开(公告)日：2003-06-10

申请号：US09688218

申请日：2000-10-16

Applicant: Yasuyoshi Serizawa ,  Minoru Kubota

Inventor： Yasuyoshi Serizawa ,  Minoru Kubota

IPC: F16L300

CPC classification number: H05K1/028 ,  B60R16/0215 ,  H02G3/0487 ,  H05K2201/055 ,  H05K2201/10598 ,  Y10T24/44077 ,  Y10T24/44274 ,  Y10T24/44769

Abstract: A curved portion 1g of a lead line set 1e is received in a recessed portion 13d that is formed in an inner face 13c of a base piece 13 in the open state. An inner face 17a of a first folded piece 17 is folded on the inner face 13c of the base piece 13, and the curved portion 1g of the lead line set 1e is sandwiched between the base piece 13 and the first folded piece 17. Thereafter, an inner face 21a of a second folded piece 21 is folded on an outer face 17e of the first folded piece 17, and the lead line set 1e portion that is slightly nearer the distal end than the lead line set 1e portion that is folded along a folding line X is sandwiched between the first and the second folded pieces 17 and 21.

Abstract translation: 引线组1e的弯曲部1g被容纳在处于打开状态的基部件13的内表面13c中的凹部13d中。 第一折叠片17的内表面17a折叠在基片13的内表面13c上，引线组1e的弯曲部分1g夹在基片13和第一折叠片17之间。之后， 第二折叠片21的内表面21a折叠在第一折叠片17的外表面17e上，并且引线组1e部分比沿着一个折叠片17折叠的引线组1e部分稍远于远端 折叠线X夹在第一和第二折叠片17和21之间。

公开(公告)号：US06504724B2

公开(公告)日：2003-01-07

申请号：US09984189

申请日：2001-10-29

Applicant: Yasuyoshi Serizawa ,  Takahiko Suzuki ,  Minoru Kubota ,  Kenji Iwasaki

Inventor： Yasuyoshi Serizawa ,  Takahiko Suzuki ,  Minoru Kubota ,  Kenji Iwasaki

IPC: H05K714

CPC classification number: H05K1/028 ,  H01R13/582 ,  H05K5/0247 ,  H05K2201/056 ,  H05K2201/10598 ,  H05K2201/2027

Abstract: A first casing (11, 12)includes a first end (30, 31). A second casing (11, 12) is mated with the first casing (11, 12). The second casing (11, 12) includes a second end (30, 31) facing the first end (30, 31). A flexible circuit member (23) is housed between the first and second casings (11, 12). The circuit member (23) is drawn out from the first and second ends (30, 31). The circuit member (23) is retained between the first and second ends (30, 31) under pressure.

公开(公告)号：US20020176950A1

公开(公告)日：2002-11-28

申请号：US10187964

申请日：2002-07-03

Applicant: NEC CORPORATION

Inventor： Shigeki Nakajima

IPC: B32B001/08 ,  F16L001/00 ,  B65D001/00 ,  B29D022/00 ,  B29D023/00 ,  B32B003/10 ,  B23P017/00 ,  B21K023/00 ,  B21D047/00

CPC classification number: B32B38/1833 ,  B32B2457/08 ,  H05K3/4638 ,  H05K2201/10598 ,  Y10T16/05 ,  Y10T29/49616 ,  Y10T428/13 ,  Y10T428/139 ,  Y10T428/24273

Abstract: A method of manufacturing a laminate obtained by laminating a plurality of plate members such as wiring plates (1) and prepregs (2), comprising: a step of temporarily fixing the plate members by a grommet (3) having plural resin filling holes (9) formed on the side surface thereof to obtain a temporarily-fixed laminate (5); and a step of heating and pressurizing the temporarily-fixed laminate (5) to fill the resin melted from the prepregs (2) of the temporarily-fixed laminate (5) through the resin filling holes (9) of the grommet (3) into the throughhole (6) of the grommet (3).

Abstract translation: 一种制造通过层叠多个板构件（例如布线板）和预浸料（2）而获得的层叠体的方法，包括：通过具有多个树脂填充孔（9）的索环（3）临时固定板构件的步骤 ），以获得临时固定的层压板（5）; 以及将临时固定的层压体（5）加热加压以将从临时固定的层叠体（5）的预浸料（2）熔化的树脂通过索环（3）的树脂填充孔（9）填充到 护环（3）的通孔（6）。