公开(公告)号：US20140264658A1

公开(公告)日：2014-09-18

申请号：US14207433

申请日：2014-03-12

Applicant: BISHNU PRASANNA GOGOI

Inventor： BISHNU PRASANNA GOGOI

IPC: H01L27/02 ,  H01L27/16

CPC classification number: B81B7/02 ,  B81B2201/0207 ,  B81B2201/0214 ,  B81B2201/0228 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2207/012 ,  B81B2207/05 ,  B81B2207/09 ,  H01L27/14 ,  H01L27/16 ,  H01L27/22 ,  H01L41/1132 ,  H01L41/1138 ,  H01L2924/00 ,  H05K7/02

Abstract: A cell phone is provided having multiple sensors configured to detect and measure different parameters of interest. The cell phone includes at least one monolithic integrated multi-sensor (MIMS) device. The MIMS device comprises at least two sensors of different types formed on a common semiconductor substrate. For example, the MIMS device can comprise an indirect sensor and a direct sensor. The cell phone couples a first parameter to be measured directly to the direct sensor. Conversely, the cell phone can couple a second parameter to be measured to the indirect sensor indirectly. Other sensors can be added to the cell phone by stacking a sensor to the MIMS device or to another substrate coupled to the MIMS device. This supports integrating multiple sensors such as a microphone, an accelerometer, and a temperature sensor to reduce cost, complexity, simplify assembly, while increasing performance.

Abstract translation: 提供了具有多个传感器的蜂窝电话，该传感器被配置为检测和测量不同的感兴趣的参数。 手机包括至少一个单片集成多传感器（MIMS）装置。 MIMS器件包括形成在公共半导体衬底上的至少两种不同类型的传感器。 例如，MIMS装置可以包括间接传感器和直接传感器。 手机将要直接测量的第一个参数耦合到直接传感器。 相反，手机可以间接地将待测量的第二参数耦合到间接传感器。 可以通过将传感器堆叠到MIMS装置或耦合到MIMS装置的另一基板上而将其它传感器添加到手机。 这支持集成多个传感器，如麦克风，加速度计和温度传感器，以降低成本，复杂性，简化组装，同时提高性能。

公开(公告)号：US08749013B2

公开(公告)日：2014-06-10

申请号：US12302677

申请日：2007-04-23

Applicant: Hubert Benzel ,  Simon Armbruster ,  Arnim Hoechst ,  Christoph Schelling ,  Ando Feyh

Inventor： Hubert Benzel ,  Simon Armbruster ,  Arnim Hoechst ,  Christoph Schelling ,  Ando Feyh

IPC: H01L31/058

CPC classification number: B81B3/0081 ,  B81B2201/0278 ,  B81B2203/0109 ,  B81B2207/015 ,  B81C2201/0109 ,  G01J5/06 ,  G01J5/20

Abstract: A sensor, in particular for the spatially resolved detection, includes a substrate, at least one micropatterned sensor element having an electric characteristic whose value varies as a function of the temperature, and at least one diaphragm above a cavity, the sensor element being disposed on the underside of the at least one diaphragm, and the sensor element being contacted via connecting lines, which extend within, on top of or underneath the diaphragm. In particular, a plurality of sensor elements may be formed as diode pixels within a monocrystalline layer formed by epitaxy. Suspension springs, which accommodate the individual sensor elements in elastic and insulating fashion, may be formed within the diaphragm.

Abstract translation: 特别是用于空间分辨检测的传感器包括基板，至少一个微图案化的传感器元件，其具有值随温度变化的电特性，以及在空腔上方的至少一个隔膜，传感器元件设置在 所述至少一个隔膜的下侧，并且所述传感器元件经由连接线接触，所述连接线在隔膜的顶部或下方延伸。 特别地，多个传感器元件可以形成为通过外延形成的单晶层内的二极管像素。 可以在隔膜内形成以弹性和绝缘方式容纳各个传感器元件的悬挂弹簧。

公开(公告)号：US08618481B2

公开(公告)日：2013-12-31

申请号：US12623318

申请日：2009-11-20

Applicant: Babak Nikoobakht

Inventor： Babak Nikoobakht

IPC: G01J5/20 ,  G01J5/08

CPC classification number: G01J5/02 ,  B81B3/0081 ,  B81B2201/0278 ,  G01J5/023 ,  G01J5/08 ,  G01J5/0853

Abstract: This disclosure provides methods to integrate heat generating nanoparticles to microelectromechanical (MEMs) and photonic devices such as microbolometers and thermopiles for better photodetection and electrical energy generation. Nanoparticles include noble metal and semiconductor nanocrystals of different shapes, as light sensing and heat generating materials.

Abstract translation: 本公开提供了将发热纳米颗粒与微机电（MEM）和光子器件（例如微量热探测器和热电堆）相集成的方法，以获得更好的光电检测和电能产生。 纳米颗粒包括不同形状的贵金属和半导体纳米晶体，作为光感测和发热材料。

公开(公告)号：US20120230364A1

公开(公告)日：2012-09-13

申请号：US13499170

申请日：2009-09-29

Applicant: Takanori Maeda ,  Kenjiro Fujimoto ,  Takahiro Kawano ,  Atsushi Onoe

Inventor： Takanori Maeda ,  Kenjiro Fujimoto ,  Takahiro Kawano ,  Atsushi Onoe

IPC: G01J5/02

CPC classification number: G01J5/02 ,  B81B3/007 ,  B81B2201/0264 ,  B81B2201/0278 ,  B81B2203/0127 ,  B81B2207/053 ,  G01J5/024 ,  H01L27/14603 ,  H01L27/14669

Abstract: A sensor array has a plurality of sensor elements, each of which has a rectangular frame shaped frame portion formed by connecting a plurality of frame pieces and a membrane that is constructed within the frame portion and has sensitivity as sensor, and the plurality of sensor elements are disposed in a planar shape in a state that the frame pieces in adjacent sensor elements are shared. The membrane has covexoconcave shape in which rectangular concave portions and rectangular convex portions are disposed in a web shape.

Abstract translation: 传感器阵列具有多个传感器元件，每个传感器元件具有矩形框架形框架部分，该框架部分通过连接多个框架件和构成在框架部分内的膜并且具有作为传感器的灵敏度而形成，并且多个传感器元件 在相邻的传感器元件中的框架片共享的状态下被布置成平面形状。 膜具有凸起形状，其中矩形凹部和矩形凸部以网状形状设置。

公开(公告)号：US07872432B2

公开(公告)日：2011-01-18

申请号：US11378340

申请日：2006-03-20

Applicant: Alok Paranjpye ,  Jeffery F. Summers

Inventor： Alok Paranjpye ,  Jeffery F. Summers

IPC: H02N11/00

CPC classification number: B81B3/0024 ,  B81B2201/018 ,  B81B2201/0278 ,  H01H2037/008 ,  H01H2061/008 ,  Y10T29/49105 ,  Y10T29/49147 ,  Y10T29/49204 ,  Y10T29/53248

Abstract: A MEMS thermal switch is disclosed which couples a hot, expanding beam to a cool flexor beam using a slideably engaged tether, and bends the cool, flexor beam by the expansion of the hot beam. A rigidly engaged tether ties the distal ends of the hot, expanding beam and the cool, flexor beam together, whereas the slideably engaged tether allows the hot, expanding beam to elongate with respect to the cool, flexor beam, without loading the slideably engaged tether with a large shear force. As a result, the material of the tether can be made stiffer, and therefore transmit the bending force of the hot, expanding beam more efficiently to the cool, flexor beam.

Abstract translation: 公开了一种MEMS热开关，其使用可滑动接合的系绳将热膨胀梁耦合到冷弯头梁，并且通过热束的膨胀来弯曲冷弯曲梁。 刚性接合的系绳将热的，扩张的梁和冷的弯曲梁的远端连接在一起，而可滑动地接合的系绳允许热的，膨胀的梁相对于冷的屈肌梁而伸长，而不加载可滑动地接合的系绳 具有很大的剪切力。 结果，系链的材料可以变得更硬，并且因此将热膨胀梁的弯曲力更有效地传递到凉爽的弯曲梁。

公开(公告)号：US07748272B2

公开(公告)日：2010-07-06

申请号：US12051905

申请日：2008-03-20

Applicant: Michael Scott Kranz ,  Robert Faye Elliot ,  Michael Ray Whitley ,  Marty Ray Williams ,  Philip John Reiner

Inventor： Michael Scott Kranz ,  Robert Faye Elliot ,  Michael Ray Whitley ,  Marty Ray Williams ,  Philip John Reiner

IPC: G01P1/02 ,  G01P15/125

CPC classification number: B81C1/00246 ,  B81B2201/0235 ,  B81B2201/0278 ,  B81B2201/0292 ,  G01P2015/082 ,  G01P2015/084 ,  G01P2015/0842

Abstract: The MEMS Sensor Suite on a Chip provides the capability, monolithically integrated onto one MEMS chip, to sense temperature, humidity, and two axes of acceleration. The device incorporates a MEMS accelerometer, a MEMS humidity sensor, and a MEMS temperature sensor on one chip. These individual devices incorporate proof masses, suspensions, humidity sensitive capacitors, and temperature sensitive resistors (thermistors) all fabricated in a common fabrication process that allows them to be integrated onto one micromachined chip. The device can be fabricated in a simple micromachining process that allows its size to be miniaturized for embedded and portable applications. During operation, the sensor suite chip monitors temperature levels, humidity levels, and acceleration levels in two axes. External circuitry allows sensor readout, range selection, and signal processing.

Abstract translation: 芯片上的MEMS传感器套件提供单一集成到一个MEMS芯片上的能力，以感测温度，湿度和两个加速轴。 该器件在一个芯片上集成了MEMS加速度计，MEMS湿度传感器和MEMS温度传感器。 这些单独的器件包含所有在通用制造工艺中制造的校准质量，悬浮液，湿度敏感电容器和温度敏感电阻器（热敏电阻器），从而允许它们集成到一个微加工芯片上。 该器件可以在简单的微加工工艺中制造，允许其尺寸被小型化以用于嵌入式和便携式应用。 在运行过程中，传感器套件芯片监测两个轴的温度水平，湿度水平和加速度水平。 外部电路允许传感器读数，范围选择和信号处理。

公开(公告)号：US20090283844A1

公开(公告)日：2009-11-19

申请号：US12464426

申请日：2009-05-12

Applicant: Douglas Ray Sparks

Inventor： Douglas Ray Sparks

IPC: H01L23/02 ,  H01L21/50

CPC classification number: B81C1/00119 ,  B01L3/502707 ,  B81B2201/0214 ,  B81B2201/0278 ,  B81B2201/058 ,  G01F1/8445 ,  H01L24/94 ,  H01L2224/48091 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/16152 ,  H01L2924/3025 ,  Y10T137/2191 ,  Y10T137/2224 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A process for fabricating multiple microfluidic device chips. The process includes fabricating multiple micromachined tubes in a semiconductor device wafer. The tubes are fabricated so that each tube has an internal fluidic passage and an inlet and outlet thereto defined in a surface of the device wafer. The device wafer is then bonded to a glass wafer to form a device wafer stack, and so that through-holes in the glass wafer are individually fluidically coupled with the inlets and outlets of the tubes. The glass wafer is then bonded to a metallic wafer to form a package wafer stack, so that through-holes in the metallic wafer are individually fluidically coupled with the through-holes of the glass wafer. Multiple microfluidic device chips are then singulated from the package wafer stack. Each device chip has a continuous flow path for a fluid therethrough that is preferably free of organic materials.

Abstract translation: 一种用于制造多个微流体装置芯片的方法。 该方法包括在半导体器件晶片中制造多个微加工管。 管被制造成使得每个管具有内部流体通道以及限定在器件晶片的表面中的入口和出口。 然后将器件晶片接合到玻璃晶片以形成器件晶片叠层，并且使得玻璃晶片中的通孔与管的入口和出口分别流体耦合。 然后将玻璃晶片接合到金属晶片以形成封装晶片堆叠，使得金属晶片中的通孔与玻璃晶片的通孔独立地流体耦合。 然后从封装晶片堆叠单个多个微流体器件芯片。 每个装置芯片具有用于流过其中的流体的连续流动路径，其优选不含有机材料。

公开(公告)号：US20090213900A1

公开(公告)日：2009-08-27

申请号：US11813308

申请日：2006-01-04

Applicant: Ivo Rangelow ,  Tzvetan Ivanov ,  Katerina Ivanova

Inventor： Ivo Rangelow ,  Tzvetan Ivanov ,  Katerina Ivanova

IPC: G01K5/00

CPC classification number: G01J5/40 ,  B81B3/0018 ,  B81B2201/0278 ,  G01J5/44

Abstract: A microsystem component with a device (3) deformable under the influence of temperature changes is disclosed. The device comprises at least one first (4, 5) and second (8) element with differing thermal expansion coefficients and different thermal conductivities. The elements (4, 5; 8) are physically separate and arranged and connected to each other such that the device (3) assumes flexure states which are dependent on the temperature.

Abstract translation: 公开了一种具有在温度变化影响下可变形的装置（3）的微系统部件。 该装置包括具有不同热膨胀系数和不同热导率的至少一个第一（4,5）和第二（8）元件。 元件（4,5; 8）在物理上是分开的并且彼此连接并且连接，使得装置（3）呈现取决于温度的弯曲状态。

公开(公告)号：US20080054382A1

公开(公告)日：2008-03-06

申请号：US11879462

申请日：2007-07-17

Applicant: Joseph Stetter

Inventor： Joseph Stetter

IPC: H01L27/14

CPC classification number: B81B3/0059 ,  B81B2201/0214 ,  B81B2201/0278 ,  B81B2201/0292 ,  B81B2203/0118

Abstract: A universal microelectromechanical MEMS nano-sensor platform having a substrate and conductive layer deposited in a pattern on the surface to make several devices at the same time, a patterned insulation layer, wherein the insulation layer is configured to expose one or more portions of the conductive layer, and one or more functionalization layers deposited on the exposed portions of the conductive layer. The functionalization layers are adapted to provide one or more transducer sensor classes selected from the group consisting of: radiant, electrochemical, electronic, mechanical, magnetic, and thermal sensors for chemical and physical variables.

Abstract translation: 一种通用微机电MEMS纳米传感器平台，其具有在表面上以图案沉积的衬底和导电层，以同时制造多个器件，图案化绝缘层，其中绝缘层被配置为暴露导电的一个或多个部分 层和沉积在导电层的暴露部分上的一个或多个官能化层。 功能化层适于提供从由以下组成的组中选择的一个或多个换能器传感器类：用于化学和物理变量的辐射，电化学，电子，机械，磁性和热传感器。

公开(公告)号：US06828172B2

公开(公告)日：2004-12-07

申请号：US10065448

申请日：2002-10-18

Applicant: Abhijeet V. Chavan ,  James H. Logsdon ,  Dan W. Chilcott ,  John C. Christenson ,  Robert K. Speck

Inventor： Abhijeet V. Chavan ,  James H. Logsdon ,  Dan W. Chilcott ,  John C. Christenson ,  Robert K. Speck

IPC: H01I2100

CPC classification number: B81B3/0072 ,  B81B2201/0278 ,  B81B2203/0127 ,  G01J5/02 ,  G01J5/024 ,  G01J5/12 ,  H01L27/16 ,  H01L2224/48463

Abstract: A process using integrated sensor technology in which a micromachined sensing element and signal processing circuit are combined on a single semiconductor substrate to form, for example, an infrared sensor. The process is based on modifying a CMOS process to produce an improved layered micromachined member, such as a diaphragm, after the circuit fabrication process is completed. The process generally entails forming a circuit device on a substrate by processing steps that include forming multiple dielectric layers and at least one conductive layer on the substrate. The dielectric layers comprise an oxide layer on a surface of the substrate and at least two dielectric layers that are in tension, with the conductive layer being located between the two dielectric layers. The surface of the substrate is then dry etched to form a cavity and delineate the diaphragm and a frame surrounding the diaphragm. The dry etching step terminates at the oxide layer, such that the diaphragm comprises the dielectric layers and conductive layer. A special absorber is preferably fabricated on the diaphragm to promote efficient absorption of incoming infrared radiation.

Abstract translation: 使用集成传感器技术的方法，其中微机械感测元件和信号处理电路组合在单个半导体衬底上以形成例如红外传感器。 该方法基于在电路制造过程完成之后修改CMOS工艺以产生改进的分层微加工构件，例如隔膜。 该方法通常需要通过处理步骤在衬底上形成电路器件，该步骤包括在衬底上形成多个电介质层和至少一个导电层。 电介质层包括在衬底的表面上的氧化物层和处于张力的至少两个电介质层，导电层位于两个电介质层之间。 然后将基板的表面干蚀刻以形成空腔并描绘膜片和围绕隔膜的框架。 干蚀刻步骤终止于氧化物层，使得隔膜包括电介质层和导电层。 优选地在隔膜上制造特殊的吸收体以促进进入的红外辐射的有效吸收。