公开(公告)号：US20170290167A1

公开(公告)日：2017-10-05

申请号：US15090703

申请日：2016-04-05

Applicant: Compass Technology Company Limited

Inventor： Kelvin Po Leung Pun ,  Chee Wah Cheung

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K3/0041 ,  G06F3/041 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/144 ,  H05K3/0064 ,  H05K3/025 ,  H05K3/027 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/042 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/095 ,  H05K2203/1545

Abstract: A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween.

公开(公告)号：US20170273179A1

公开(公告)日：2017-09-21

申请号：US15430604

申请日：2017-02-13

Applicant: Ticona LLC

Inventor： Young Shin Kim

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  B32B15/09 ,  B32B15/20

CPC classification number: B32B15/20 ,  B32B15/09 ,  B32B2307/202 ,  B32B2457/08 ,  H05K1/0298 ,  H05K1/0326 ,  H05K1/0393 ,  H05K3/022 ,  H05K2201/0145

Abstract: A laminate for use in a printed circuit board is provided. The laminate comprises a conductive layer and a film that is positioned adjacent to the conductive layer. The film contains a thermoset polymer formed by reacting an aromatic polyester with a crosslinking agent that includes a maleimide compound. The aromatic polyester includes repeating units derived from an aromatic hydroxycarboxylic acid, aromatic dicarboxycarboxylic acid, aromatic diol, aromatic amide, aromatic amine, or a combination thereof.

公开(公告)号：US20170223827A1

公开(公告)日：2017-08-03

申请号：US15489945

申请日：2017-04-18

Applicant: YAZAKI Corporation

Inventor： Maki YAMADA ,  Hiroki KONDO ,  Makoto KAMBE

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/18 ,  H05K3/12 ,  H05K3/32

CPC classification number: H05K1/0353 ,  H05K1/09 ,  H05K1/095 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/12 ,  H05K3/1208 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/10272 ,  H05K2203/095

Abstract: A film-like printed circuit board includes: a low-melting-point resin film substrate composed of a low-melting-point resin in which a melting point is 370° C. or less; a circuit formed in a manner that a circuit-forming conductive paste applied onto the low-melting-point resin film substrate is subjected to plasma baking; an electronic component bonding layer formed in a manner that a mounting conductive paste applied onto the circuit is subjected to the plasma baking; and an electronic component mounted on the circuit via the electronic component bonding layer.

公开(公告)号：US20170158854A1

公开(公告)日：2017-06-08

申请号：US15118302

申请日：2015-02-19

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC.

Inventor： Yoshitaka UENO ,  Masataka KUDO ,  Michio YAGINUMA

IPC: C08L71/12 ,  C08J5/24 ,  B32B27/06 ,  H05K1/03 ,  B32B15/08 ,  B32B27/20

CPC classification number: C08L71/126 ,  B32B5/02 ,  B32B15/08 ,  B32B27/06 ,  B32B27/20 ,  B32B2262/101 ,  B32B2307/202 ,  B32B2307/3065 ,  B32B2457/00 ,  B32B2457/08 ,  C08G73/0655 ,  C08J5/24 ,  C08J2371/12 ,  C08K3/36 ,  C08K5/5399 ,  C08K7/18 ,  C08L63/00 ,  C08L71/12 ,  C08L79/04 ,  C08L2203/20 ,  H05K1/0346 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209

Abstract: A resin composition comprising a polyphenylene ether (A) having a number average molecular weight of 500 to 5000; a cyclophosphazene compound (B); a non-halogen-based epoxy resin (C); a cyanate compound (D); and a filler (E).

公开(公告)号：US09595501B1

公开(公告)日：2017-03-14

申请号：US14928289

申请日：2015-10-30

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Robert Neuman

IPC: H01L23/31 ,  H01L23/49 ,  H01L33/48 ,  H01L33/54 ,  H01L33/62 ,  H01L23/00 ,  H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K1/11 ,  H05K3/20 ,  H05K1/03 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

CPC classification number: H05K3/32 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/563 ,  H01L23/3135 ,  H01L23/3157 ,  H01L23/4985 ,  H01L23/49883 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L33/486 ,  H01L33/54 ,  H01L33/62 ,  H01L2224/32225 ,  H01L2224/45147 ,  H01L2224/48106 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/8385 ,  H01L2224/85201 ,  H01L2224/85423 ,  H01L2224/85447 ,  H01L2224/85801 ,  H01L2224/92147 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1205 ,  H01L2924/1207 ,  H01L2924/1421 ,  H01L2933/005 ,  H01L2933/0066 ,  H05K1/189 ,  H05K3/284 ,  H05K3/321 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/32245 ,  H01L2224/48247

Abstract: A disclosed circuit arrangement includes a flexible substrate. A layer of pressure sensitive adhesive (PSA) is directly adhered to a first major surface of the substrate. One or more metal foil pads and electrically conductive wire are attached directly on a surface of the PSA layer. The wire has a round cross-section and one or more portions directly connected to the one or more metal foil pads with one or more weld joints, respectively. An electronic device is attached directly on the surface of the layer of PSA and is electrically connected to the one or more portions of the round wire by one or more bond wires, respectively.

Abstract translation: 所公开的电路装置包括柔性基板。 压敏粘合剂层（PSA）直接粘附到基材的第一主表面。 一个或多个金属箔垫和导电线直接附着在PSA层的表面上。 导线具有圆形横截面，并且一个或多个部分分别直接连接到具有一个或多个焊接接头的一个或多个金属箔垫。 电子器件直接附着在PSA层的表面上，并分别通过一根或多根接合线与圆形线的一个或多个部分电连接。

公开(公告)号：US09565752B1

公开(公告)日：2017-02-07

申请号：US14737268

申请日：2015-06-11

Applicant: AUTOMATED ASSEMBLY CORPORATION

Inventor： Robert Neuman ,  Scott Lindblad

IPC: H01Q1/00 ,  H05K1/02 ,  H01Q1/50 ,  F21V23/00 ,  H05K1/03 ,  H05K1/09 ,  F21K99/00 ,  H05K3/10 ,  H05K3/32 ,  F21Y101/02

CPC classification number: H05K1/028 ,  F21Y2115/10 ,  H01Q1/2208 ,  H01Q7/00 ,  H05K1/032 ,  H05K1/0386 ,  H05K1/0393 ,  H05K1/09 ,  H05K3/103 ,  H05K3/32 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2203/049

Abstract: A disclosed circuit arrangement includes a substrate, an integrated circuit (IC) component attached to the substrate, first and second cross wires attached to the substrate and disposed proximate the electronic device, and one or more wire segments attached to the substrate. The one or more wire segments have first and second portions attached at a third portion of the first cross wire and at a fourth portion of the second cross wire, respectively. The first and second cross wires and the one or more wire segments are round wires having round cross sections. The first portion and the third portion have flat areas of contact, and the second and fourth portions have flat areas of contact. A first bond wire is connected to the electronic device and to the first portion of the one or more wire segments, and a second bond wire is connected to the electronic device and to the second portion of the one or more wire segments.

Abstract translation: 所公开的电路装置包括衬底，附着到衬底的集成电路（IC）部件，附接到衬底并设置在电子器件附近的第一和第二交叉线以及附接到衬底的一个或多个线段。 一个或多个线段具有分别在第一十字线的第三部分和第二十字线的第四部分附接的第一和第二部分。 第一和第二十字线和一个或多个线段是具有圆形横截面的圆形线。 第一部分和第三部分具有平坦的接触区域，并且第二和第四部分具有平坦的接触区域。 第一接合线连接到电子设备和一个或多个线段的第一部分，并且第二接合线连接到电子设备和一个或多个线段的第二部分。

公开(公告)号：US09538647B2

公开(公告)日：2017-01-03

申请号：US14450297

申请日：2014-08-04

Applicant: Chao-Min Wang

Inventor： Chao-Min Wang

IPC: H01L21/84 ,  H05K1/03 ,  H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H01L23/498 ,  H01L21/48 ,  H05K3/00

CPC classification number: H05K1/0313 ,  H01L21/48 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/498 ,  H01L23/49827 ,  H01L2221/68318 ,  H01L2924/15151 ,  H05K1/0298 ,  H05K1/114 ,  H05K1/115 ,  H05K3/007 ,  H05K3/46 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/035 ,  H05K2201/0355 ,  H05K2201/09063 ,  H05K2203/0214 ,  H05K2203/1178 ,  Y10T156/10

Abstract: A substrate structure is provided. The substrate structure includes a substrate and a carrier. The substrate includes a first through hole, a first surface and a second surface opposite to the first surface. The first through hole penetrates the substrate for connecting the first surface and the second surface. The carrier includes a second through hole, a release layer, an insulating paste layer and a metal layer. The insulating paste layer is disposed between the release layer and the metal layer. The carrier is attached to the second surface with the release layer thereof. The second through hole corresponds to the first through hole and penetrates the carrier for exposing the first through hole.

Abstract translation: 提供了基板结构。 衬底结构包括衬底和载体。 基板包括第一通孔，第一表面和与第一表面相对的第二表面。 第一通孔贯穿基板，用于连接第一表面和第二表面。 载体包括第二通孔，释放层，绝缘膏层和金属层。 绝缘膏层设置在剥离层和金属层之间。 载体用其释放层附着到第二表面。 第二通孔对应于第一通孔并穿透载体以暴露第一通孔。

公开(公告)号：US09504148B1

公开(公告)日：2016-11-22

申请号：US14957426

申请日：2015-12-02

Applicant: HONEYWELL FEDERAL MANUFACTURING & TECHNOLOGIES, LLC

Inventor： Jonathan Douglas Hatch ,  Stephen McGarry Hatch

IPC: H05K1/03 ,  H05K3/38 ,  H05K1/02 ,  H05K3/10

CPC classification number: H05K1/0306 ,  H05K1/02 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/115 ,  H05K1/144 ,  H05K3/0023 ,  H05K3/0064 ,  H05K3/007 ,  H05K3/048 ,  H05K3/103 ,  H05K3/125 ,  H05K3/386 ,  H05K3/389 ,  H05K3/4611 ,  H05K3/4644 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/05 ,  H05K2201/09009 ,  H05K2203/0152

Abstract: A PCB page blank includes a flexible substrate, a curable adhesive, a conductive layer, and a conductive layer support. The flexible substrate receives an opaque negative circuit pattern thereon. Portions of the curable adhesive not obscured by the circuit pattern may bond to portions of the conductive layer when exposed to light. The bonded portions of the conductive layer shear or tear from non-bonded portions of the conductive layer such that the bonded portions remain with the flexible substrate and the non-bonded portions remain with the conductive layer support when the flexible substrate and the conductive layer support are separated. The flexible substrate and the bonded portions of the conductive layer thus form a PCB prototype with the bonded portions of the conductive layer forming circuit traces of the circuit pattern.

Abstract translation: PCB页面空白包括柔性基板，可固化粘合剂，导电层和导电层支撑件。 柔性基板在其上接收不透明的负电路图案。 不会被电路图案遮挡的可固化粘合剂的部分可能在暴露于光时粘合到导电层的部分。 导电层的接合部分从导电层的非接合部分剪切或撕裂，使得接合部分保留在柔性基板上，并且当柔性基板和导电层支撑时，非接合部分保留在导电层支撑件 被分开 因此，柔性基板和导电层的接合部分形成PCB原型，其中导电层的接合部分形成电路图案的电路迹线。

公开(公告)号：US09504139B2

公开(公告)日：2016-11-22

申请号：US14626881

申请日：2015-02-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Tetsuyoshi Ogura ,  Daisuke Wakuda ,  Takashi Matsumoto

IPC: H05K1/02 ,  H05K1/03 ,  H05K3/10 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  A41D31/00

CPC classification number: H05K1/0213 ,  A41D31/00 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0326 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49162

Abstract: There is provided an elastic flexible substrate including an insulating film base material which includes a wire. The insulating film base material includes an opening which is formed by opening a slit, and an opened state of the opening is held by an insulating member.

Abstract translation: 提供了一种弹性柔性基底，其包括包括线的绝缘膜基材。 绝缘膜基材包括通过打开狭缝形成的开口，并且开口的打开状态被绝缘构件保持。

公开(公告)号：US20160334927A1

公开(公告)日：2016-11-17

申请号：US15222541

申请日：2016-07-28

Applicant: LG INNOTEK CO., LTD.

Inventor： Byung Soo Kim ,  Keun Sik Lee

IPC: G06F3/041 ,  G06F3/044 ,  H05K1/02

CPC classification number: G06F3/0416 ,  G06F3/044 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04104 ,  G06F2203/04111 ,  H05K1/028 ,  H05K1/0298 ,  H05K2201/0145 ,  H05K2201/05 ,  H05K2201/10128

Abstract: Disclosed are a touch panel and a method for manufacturing the same. A touch panel can include a substrate, a transparent electrode base on the substrate, a first transparent electrode on the transparent electrode base and extending in a first direction, and a second transparent electrode on the transparent electrode base and extending in a second direction. A method of manufacturing a touch panel can include preparing a substrate and a transparent electrode base, forming a transparent electrode over the transparent electrode base, and forming an electrode material over the transparent electrode base.

Abstract translation: 公开了触摸面板及其制造方法。 触摸面板可以包括基板，在基板上的透明电极基体，透明电极基底上的第一透明电极，并且在第一方向上延伸，第二透明电极在第二方向上延伸。 触摸面板的制造方法可以包括准备基板和透明电极基板，在透明电极基板上形成透明电极，在透明电极基板上形成电极材料。