公开(公告)号：US20040016913A1

公开(公告)日：2004-01-29

申请号：US10358071

申请日：2003-02-04

Inventor： Peter W. Sognefest ,  S. Kumar Khanna ,  Fernando A. Ferraro

IPC: H01B001/00 ,  H01C001/00

CPC classification number: H01L27/14636 ,  H01B1/22 ,  H01C17/06526 ,  H01C17/06586 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L24/83 ,  H01L27/14618 ,  H01L27/14634 ,  H01L2224/05568 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2224/83951 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/0781 ,  H01L2924/14 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/10727 ,  H05K2203/104 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A semiconductor radiation detection crystal converts incident radiation or an incident particle into an electrical signal. A first substrate for conveying the electrical signal to processing electronics is bonded to the crystal via an anisotropic conductive material sandwiched therebetween. The crystal can include can array of pixels which are positioned in opposition with an array of conductive pads formed on the first substrate. The anisotropic conductive material forms between each pixel and its corresponding conductive pad an electrical path, with each electrical path isolated from other electrical paths.

Abstract translation: 半导体辐射检测晶体将入射辐射或入射粒子转换为电信号。 用于将电信号传送到处理电子器件的第一基板经夹在其间的各向异性导电材料结合到晶体。 晶体可以包括位于与形成在第一衬底上的导电焊盘的阵列相对置的像素阵列。 各向异性导电材料在每个像素与其对应的导电焊盘之间形成电路，其中每条电路与其它电路隔离。

公开(公告)号：US20020158515A1

公开(公告)日：2002-10-31

申请号：US10115159

申请日：2002-04-02

Inventor： Anthony A. Anthony JR. ,  William M. Anthony

IPC: H02J001/00

CPC classification number: H05K1/0231 ,  H01G4/35 ,  H01L23/642 ,  H01L2924/0002 ,  H05K1/162 ,  H05K2201/083 ,  H05K2201/09672 ,  Y10T307/492 ,  H01L2924/00

Abstract: An amalgamation of selected energy pathways and other elements formed at least in-part by sequential manufacturing operations and made operable to be coupled and/or formed as part of a predetermined assembly and/or assemblies and/or assembly variations practicable and/or operable for sustaining electrically opposing and/or complementary energy portion confluences that can be themselves made operable by the arrangement amalgam to undergo portions of energy conditioning as a portion of an energized circuit.

Abstract translation: 通过顺序制造操作至少部分地形成所选择的能量通路和其它元件的合并，并且可操作地联接和/或形成为可行的和/或可操作的预定组件和/或组件和/或组件变型的一部分 维持电相对和/或互补的能量部分汇合，其本身可以通过排列汞齐操作，以经受部分能量调节作为通电电路的一部分。

公开(公告)号：US06391082B1

公开(公告)日：2002-05-21

申请号：US09345813

申请日：1999-07-02

Applicant: Richard A. Holl

Inventor： Richard A. Holl

IPC: C22C105

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐减弱，因此这些内容必须受到限制。 在获得尽可能完整的组分分散体的方法中，它们分别分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每个混合物被研磨以获得所需的粒度，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

公开(公告)号：US20020038582A1

公开(公告)日：2002-04-04

申请号：US09345813

申请日：1999-07-02

Inventor： RICHARD A. HOLL

IPC: C22C029/00

CPC classification number: B22F3/227 ,  B01F2013/1086 ,  B01J2219/00094 ,  B22F1/0074 ,  B22F1/02 ,  B22F3/20 ,  B22F7/04 ,  B22F2998/00 ,  B29B7/401 ,  B29B7/603 ,  B29B7/82 ,  B29B7/845 ,  B29B7/90 ,  B29B13/10 ,  B29C47/00 ,  B29C47/0019 ,  B29C47/50 ,  B29C67/242 ,  B29C70/58 ,  B29K2021/00 ,  B29K2071/00 ,  B29K2105/16 ,  B29K2503/04 ,  C08J3/212 ,  C08J2371/12 ,  C08K3/01 ,  C08L71/12 ,  C22C32/0094 ,  H01L21/4882 ,  H01L23/145 ,  H01L23/293 ,  H01L23/3737 ,  H01L2924/0002 ,  H01L2924/12044 ,  H05K1/0373 ,  H05K3/022 ,  H05K3/14 ,  H05K3/381 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0215 ,  H05K2201/0227 ,  H05K2201/0254 ,  H05K2201/068 ,  H05K2201/0792 ,  H05K2201/083 ,  H05K2203/0278 ,  H05K2203/068 ,  H05K2203/1194 ,  Y10T428/12028 ,  H01L2924/00

Abstract: Composite materials comprising at least 60 volume %, preferably 70 volume %, of particles of finely powdered filler material in a matrix of poly(arylene ether) polymer material are made by forming a mixture of the components, forming the required bodies therefrom, and then heating and pressing the bodies to a temperature sufficient to melt the polymer and to a pressure sufficient to disperse the melted polymer into the interstices between the filler particles. Surprisingly these polymer materials can only be effective as bonding materials when the solids content is as high as that specified, since with lower contents the resultant bodies are too friable. This is completely contrary to accepted prior art practice which considers that composites are progressivly weakened as the solids content is increased, so that such content must be limited. In processes to obtain as complete a dispersion of the components as possible they are individually dispersed in a liquid dispersion medium containing the polymer together with necessary additives, each mixture being ground if required to obtain a desired particle size, the mixtures are mixed, again ground to produce thorough dispersion, are separated from the liquid dispersion medium and green articles formed from the resulting pasty mixture. The green articles are then heated and pressed as described above. Mixtures of different filler materials may be used to tailor the electrical and physical properties of the final materials. The articles preferably comprise substrates for use in electronic circuits.

Abstract translation: 在聚（亚芳基醚）聚合物材料的基体中包含至少60体积％，优选70体积％的细粉末状填料的颗粒的复合材料通过形成组分的混合物制成，从而形成所需体，然后 将物体加热和压制到足以熔化聚合物的温度和足以将熔融的聚合物分散到填料颗粒之间的空隙中的压力。 令人惊讶的是，当固体含量高达规定值时，这些聚合物材料只能作为粘合材料有效，因为所得物体的含量较低，因此太脆。 这完全违背了接受的现有技术实践，认为随着固体含量增加，复合材料逐渐减弱，因此这些内容必须受到限制。 在获得尽可能完整的组分分散体的方法中，它们分别分散在含有聚合物的液体分散介质中以及必要的添加剂，如果需要，每个混合物被研磨以获得所需的粒度，混合物再次混合 从液体分散介质和由所得糊状混合物形成的绿色物品分离，以产生彻底的分散。 然后如上所述加热和按压绿色制品。 可以使用不同填料材料的混合物来定制最终材料的电学和物理性能。 物品优选地包括用于电子电路的基底。

公开(公告)号：US06186392B1

公开(公告)日：2001-02-13

申请号：US09489272

申请日：2000-01-21

Applicant: Michael Ball

Inventor： Michael Ball

IPC: B23K3524

CPC classification number: B23K35/0244 ,  B23K3/0623 ,  B23K2101/40 ,  H01L24/11 ,  H01L24/13 ,  H01L24/742 ,  H01L2224/0401 ,  H01L2224/05568 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/11823 ,  H01L2224/11849 ,  H01L2224/13124 ,  H01L2224/13155 ,  H01L2224/13157 ,  H01L2224/1316 ,  H01L2224/13166 ,  H01L2224/1329 ,  H01L2224/13324 ,  H01L2224/13355 ,  H01L2224/13357 ,  H01L2224/1336 ,  H01L2224/13366 ,  H01L2224/13561 ,  H01L2224/13611 ,  H01L2224/13616 ,  H01L2224/1379 ,  H01L2224/13839 ,  H01L2224/13844 ,  H01L2224/48091 ,  H01L2224/4824 ,  H01L2224/81024 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01072 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H05K3/3436 ,  H05K3/3478 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/10234 ,  H05K2203/041 ,  H05K2203/104 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.

Abstract translation: 提供了一种用于在半导体部件上形成接触的方法和系统，例如晶片，芯片和封装。 该方法采用磁体来对准和保持组件衬底的结合位置上的铁磁性球。 该系统包括用于保持组件衬底的保持器，并且保持器上的磁体与构件上的结合位置对准。 该系统还包括用于将铁磁球放置在接合位置上的球放置机构，以及用于将铁磁球结合到接合位置的接合机构，例如烘箱或聚焦能量源。 铁磁球可以作为具有外部焊料层的铁磁芯提供，作为具有导电粘合剂外层的固体铁磁材料，或者作为嵌入可结合基质材料中的铁磁性颗粒。 替代实施例系统包括用于将铁磁球动态对准到结合位置的聚焦磁源。

公开(公告)号：US5846366A

公开(公告)日：1998-12-08

申请号：US698284

申请日：1996-08-14

Applicant: Sungho Jin ,  Mark Thomas McCormack

Inventor： Sungho Jin ,  Mark Thomas McCormack

IPC: B23K1/20 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34 ,  B23K31/02

CPC classification number: H01L24/81 ,  H01L21/4853 ,  H01L21/6835 ,  H01L24/11 ,  H05K3/3484 ,  H01L2224/11003 ,  H01L2224/1111 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01105 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/0133 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2203/0156 ,  H05K2203/0338 ,  H05K2203/0425 ,  H05K2203/0528 ,  H05K2203/104 ,  Y10T156/1089 ,  Y10T156/1093

Abstract: In accordance with the invention, an electronic device having one or more contact pads is placed in contact with a carrier sheet bearing an array of transferable solder particles. Heat is applied to adhere the solder to the contact pads, and solder is selectively transferred onto the contact pads. In a preferred embodiment the solder-carrying medium comprises elastomeric material and the solder particles comprise solder-coated magnetic particles. Application of a magnetic field while the elastomer is curing produces a regular array of solder coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract translation: 根据本发明，具有一个或多个接触垫的电子设备被放置成与承载有可转移焊料颗粒阵列的载体片接触。 施加热量以将焊料粘附到接触焊盘，并且将焊料选择性地转移到接触焊盘上。 在优选实施例中，焊料载体介质包括弹性材料，焊料颗粒包括焊料涂覆的磁性颗粒。 在弹性体固化时施加磁场产生规则的焊料涂覆颗粒阵列。 使用这种方法，具有小于常规接触结构的装置可以容易地相互连接。

公开(公告)号：US5769996A

公开(公告)日：1998-06-23

申请号：US464733

申请日：1995-06-29

Applicant: Ciaran Bernard McArdle ,  Joseph Burke

Inventor： Ciaran Bernard McArdle ,  Joseph Burke

IPC: H05K1/09 ,  C09J5/06 ,  C09J9/02 ,  C09J11/04 ,  C09J201/00 ,  H01B1/00 ,  H01B1/20 ,  H01B5/00 ,  H01B5/16 ,  H01F1/44 ,  H01F41/16 ,  H01L21/60 ,  H01R4/04 ,  H05K3/32 ,  B32B31/20

CPC classification number: H05K3/323 ,  H01F1/44 ,  H01F41/16 ,  H01R4/04 ,  H01L2224/293 ,  H01L2924/01019 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01R12/57 ,  H05K2201/0221 ,  H05K2201/023 ,  H05K2201/0233 ,  H05K2201/083 ,  H05K2203/104 ,  Y10T428/12069 ,  Y10T428/12347

Abstract: The invention provides a composition comprising: (i) a ferrofluid comprising a colloidal suspension of ferromagnetic particles in a non-magnetic carrier liquid, and (ii) a plurality of electrically-conductive particles having substantially uniform sizes and shapes, dispersed in the ferrofluid. Various types of substantially non-magnetic electrically-conductive particles are described. Application of a substantially uniform magnetic field by magnet means to the composition causes the electrically-conductive particles to form a regular pattern. The composition is used for providing anisotropic conductive pathways between two sets of conductors in the electronics industry. The composition may be a curable adhesive composition which bonds the conductors. Alternatively or in addition the electrically-conductive particles may have a latent adhesive property e.g. the particles may be solder particles. The ferrofluid may be a colloidal suspension of ferromagnetic particles in a liquid monomer.

Abstract translation: PCT No.PCT / IE95 / 00009 Sec。 371日期：1995年6月29日 102（e）1995年6月29日PCT PCT 1995年1月26日PCT公布。 公开号WO95 / 20820 PCT 日期1995年8月3日本发明提供一种组合物，其包含：（i）包含非磁性载体液体中的铁磁颗粒的胶态悬浮液的铁磁流体，和（ii）具有基本均匀尺寸和形状的多个导电颗粒， 分散在铁磁流体中。 描述了各种类型的基本上非磁性的导电颗粒。 通过磁体将施加大致均匀的磁场的组合物导致导电颗粒形成规则图案。 该组合物用于在电子工业中的两组导体之间提供各向异性导电通路。 组合物可以是结合导体的可固化粘合剂组合物。 或者或另外，导电颗粒可以具有潜在的粘合性，例如 颗粒可以是焊料颗粒。 铁磁流体可以是液体单体中的铁磁颗粒的胶态悬浮液。

公开(公告)号：US5673480A

公开(公告)日：1997-10-07

申请号：US693710

申请日：1996-08-07

Applicant: Raymond Robert Buchheister, Jr. ,  Robert Scata

Inventor： Raymond Robert Buchheister, Jr. ,  Robert Scata

IPC: B23K1/00 ,  H01R4/02 ,  H01R13/66 ,  H01R43/02 ,  H05K1/02 ,  H05K3/34 ,  H01R9/00

CPC classification number: H01R13/6658 ,  B23K1/0016 ,  H01R4/025 ,  H01R43/0242 ,  H05K1/0212 ,  B23K2201/38 ,  H01R43/0207 ,  H05K1/0242 ,  H05K2201/083 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10924 ,  H05K2203/1115 ,  H05K3/3421 ,  H05K3/3494 ,  Y10T29/49149 ,  Y10T29/49179

Abstract: An SCSI cable assembly (30) with a termination circuit included within one of the connector housings (44) is disclosed. The termination circuit is on a circuit board (52) that is retained within a cavity (68) between two solder nest halves (50). The solder nest halves (50) have a plurality of openings (70) that are in alignment with contact pads (54) on a surface of the circuit board (52). Solder segments (100) are arranged within the openings (70), and conductors (48) of a cable (32) are individually inserted into the openings in thermal engagement with the solder segments to form a solder nest assembly (40). An electrical connector having a plurality of contact leads (58) spaced similarly to the spacing of the openings (70) is assembled to the solder nest assembly so that each lead (58) is in thermal engagement with a respective conductor (48) in a respective opening (70). Each lead (58) is attached to a common carrier strip (104) which is a self regulating temperature heater. The heater is activated by application of an RF current to reflow the solder segment (100) thereby electrically connecting the leads (58) to their respective conductors (48) and contact pads (54).

Abstract translation: 公开了一种具有包括在连接器壳体（44）之一内的终端电路的SCSI电缆组件（30）。 终端电路在电路板（52）上，该电路板（52）保持在两个焊料半盒（50）之间的空腔（68）内。 焊料半部（50）具有与电路板（52）的表面上的接触焊盘（54）对准的多个开口（70）。 焊接段（100）布置在开口（70）内，并且电缆（32）的导体（48）被单独地插入到与焊料段热接合的开口中以形成焊料嵌套组件（40）。 具有与开口（70）的间隔相似的多个接触引线（58）的电连接器被组装到焊料嵌套组件，使得每个引线（58）与相应的导体（48）热接合， 相应的开口（70）。 每个引线（58）连接到作为自调节温度加热器的公共载体条（104）。 通过施加RF电流来激活加热器以回流焊料段（100），从而将引线（58）电连接到它们各自的导体（48）和接触焊盘（54）。

公开(公告)号：US5618189A

公开(公告)日：1997-04-08

申请号：US588193

申请日：1996-01-18

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B23K35/02 ,  B23K35/14 ,  H05K3/34 ,  H05K3/36 ,  H01R9/09

CPC classification number: B23K35/0222 ,  H05K3/3436 ,  B23K35/0227 ,  B23K35/0244 ,  H01L2924/0002 ,  H05K2201/0215 ,  H05K2201/083 ,  H05K2201/09945 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2203/0235 ,  H05K2203/0769 ,  H05K2203/104 ,  Y02P70/613

Abstract: Electronic devices having at least two components with mating contact pads are provided with high-aspect-ratio solder joints between the mating pads. These joints ar formed by placing a composite solder medium containing solder wires in an electrically insulating matrix such that at least two solder wires are in contact with the mating pads, and fusing the wires to the pads. The insulating matrix with remainder of solder wires is then optionally removed from between the said at least two components. The composite solder medium is formed by preparing an elongated body of solder wires in an insulating matrix and cutting off slices of the composite solder medium, the solder wires having a high-aspect-ratio of length to their diameter. Alternatively sheets of the composite solder medium are prepared by magnetically aligning solder coated magnetic particles into columns arranged transverse of an insulating matrix and heating sufficiently to fuse the solder in each column into a continuously conducting solder path.

Abstract translation: 具有至少两个具有配合接触垫的部件的电子设备在配合焊盘之间设置有高纵横比焊接点。 这些接头通过将包含焊丝的复合焊料介质放置在电绝缘基体中而形成，使得至少两个焊丝与配合焊盘接触，并将焊丝熔合到焊盘。 然后可选地从所述至少两个部件之间移除具有剩余焊丝的绝缘基体。 复合焊料介质通过在绝缘基体中制备细长的焊丝体并且切断复合焊料介质的切片而形成，该焊丝具有与其直径的长宽比的高纵横比。 或者，复合焊料介质的片材通过将焊接涂覆的磁性颗粒磁化地排列成横向于绝缘矩阵布置的列并充分加热以将每个列中的焊料熔合成连续导电的焊接路径来制备。

公开(公告)号：US5591037A

公开(公告)日：1997-01-07

申请号：US251547

申请日：1994-05-31

Applicant: Sungho Jin ,  Mark T. McCormack

Inventor： Sungho Jin ,  Mark T. McCormack

IPC: B23K1/20 ,  B23K3/06 ,  H01L21/48 ,  H01L21/60 ,  H01L21/68 ,  H05K3/34

CPC classification number: H01L21/6835 ,  H01L21/4853 ,  H01L24/81 ,  H05K3/3484 ,  H01L2224/11003 ,  H01L2224/111 ,  H01L2224/11332 ,  H01L2224/11334 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/0106 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K2201/0218 ,  H05K2201/083 ,  H05K2201/10424 ,  H05K2203/0425 ,  H05K2203/0528 ,  H05K2203/0769 ,  H05K2203/104

Abstract: In accordance with the invention, an electronic device having one or more contact pads is adhered to an array of transferable solder particles on a removable carrier sheet. The carrier is removed, as by dissolving, leaving solder selectively adhered to the contact pads. In a preferred embodiment the solder-carrying medium is water soluble, and the solder particles comprise solder-coated magnetic particles. Application of a magnetic material while the medium is drying or curing, produces a regular array of solder-coated particles. Using this method, devices having smaller than conventional contact structures can be readily interconnected.

Abstract translation: 根据本发明，具有一个或多个接触垫的电子器件被粘附到可移动的载体片上的可转移焊料颗粒的阵列上。 通过溶解除去载体，留下焊料选择性地粘附到接触垫上。 在优选的实施方案中，焊料载体介质是水溶性的，焊料颗粒包括焊料涂覆的磁性颗粒。 在介质干燥或固化时应用磁性材料，产生规则的焊料涂覆颗粒阵列。 使用这种方法，具有小于常规接触结构的装置可以容易地相互连接。