公开(公告)号：US20060091553A1

公开(公告)日：2006-05-04

申请号：US11302582

申请日：2005-12-13

Applicant: Yasunori Narizuka ,  Mitsuko Itou ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei

Inventor： Yasunori Narizuka ,  Mitsuko Itou ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei

IPC: H01L23/48

CPC classification number: H05K3/3463 ,  H01L21/4853 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L23/53238 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05671 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0949 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00014

Abstract: The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring comprising a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

公开(公告)号：US20060006487A1

公开(公告)日：2006-01-12

申请号：US11188653

申请日：2005-07-26

Applicant: Huei-Jen Chen ,  Evan Liu ,  Yvon Chen

Inventor： Huei-Jen Chen ,  Evan Liu ,  Yvon Chen

IPC: H01L31/0203

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/49171 ,  H05K1/183 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/42 ,  H05K3/4691 ,  H05K2201/09036 ,  H05K2201/0949 ,  H05K2203/049 ,  Y10T29/49117 ,  Y10T29/49121 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A chip package substrate having a soft circuit board jas a multi-layer soft and hard composite PCB, a plurality of conducting components and a plurality of conducting holes. The conducting holes are formed in the multi-layer soft and hard composite PCB. The conducting components are electroplated on the inner edges of the conducting holes on the multi-layer soft and hard composite PCB. An image-sensing chip can thus be packaged on the chip package substrate with the soft circuit board used as external signal connection lines, thereby saving the manufacturing cost and increasing the yield thereof.

公开(公告)号：US20050263501A1

公开(公告)日：2005-12-01

申请号：US11142039

申请日：2005-05-31

Applicant: Tomonari Otsuki ,  Tatsunobu Umezawa

Inventor： Tomonari Otsuki ,  Tatsunobu Umezawa

IPC: B23K26/18 ,  B23K26/38 ,  B23K26/42 ,  B23K101/42 ,  H05K1/11 ,  H05K3/00 ,  H05K3/32 ,  H05K3/38

CPC classification number: H05K3/0032 ,  B23K26/38 ,  B23K26/60 ,  B23K2101/42 ,  H05K1/118 ,  H05K3/326 ,  H05K3/386 ,  H05K2201/09081 ,  H05K2201/0949 ,  H05K2203/1383

Abstract: In a laser beam machining method, after a transparent film of light permeable material has been attached to a workpiece at least on the laser beam incident side, a laser beam is irradiated onto the workpiece. A transparent film of a light permeable material is attached to the side of the workpiece opposite to the laser beam incident side. The laser beam machining method is utilized to machine components. Even if an inexpensive laser beam is used, the laser beam machining method generates perforations with diameters of less than 20 μm., cuts with widths of less than 20 μm., and readily removes carbon particles attached to the workpiece when being machined.

Abstract translation: 在激光束加工方法中，至少在激光束入射侧将可透光材料的透明膜附着到工件之后，将激光束照射到工件上。 透光性材料的透明膜附着在与激光入射侧相反的工件侧。 激光束加工方法用于加工部件。 即使使用廉价的激光束，激光束加工方法产生直径小于20μm的穿孔，宽度小于20μm的切口，并且容易地去除被加工时附着在工件上的碳颗粒。

公开(公告)号：US06818972B2

公开(公告)日：2004-11-16

申请号：US10262023

申请日：2002-09-30

Applicant: Lisa J. Jimarez ,  Miguel A. Jimarez

Inventor： Lisa J. Jimarez ,  Miguel A. Jimarez

IPC: H01L23495

CPC classification number: H01L23/49822 ,  B32B15/08 ,  H01L23/142 ,  H01L2224/16225 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/10734 ,  Y10T428/125 ,  Y10T428/12528 ,  Y10T428/24917 ,  H01L2924/00

Abstract: A method and structure for reducing chip carrier flexing during thermal cycling. A semiconductor chip is coupled to a stiff chip carrier (i.e., a chip carrier having an elastic modulus of at least about 3×105 psi), and there is no stiffener ring on a periphery of the chip carrier. Without the stiffener ring, the chip carrier is able to undergo natural flexing (in contrast with constrained flexing) in response to a temperature change that induces thermal strains due to a mismatch in coefficient of thermal expansion between the chip and the chip carrier. If the temperature at the chip carrier changes from room temperature to a temperature of about −40° C., a maximum thermally induced displacement of a surface of the chip carrier is at least about 25% less if the stiffener ring is absent than if the stiffener ring is present. Since a propensity for cracking of the stiff chip carrier increases as the thermally induced displacement increases, the present invention, which avoids use of the stiffener ring, improves a structural integrity of the chip carrier.

Abstract translation: 用于减少热循环期间芯片载体弯曲的方法和结构。 半导体芯片耦合到刚性芯片载体（即具有至少约3×10 5 psi的弹性模量的芯片载体），并且在芯片载体的外围没有加强环。 没有加强环，芯片载体响应于由于芯片和芯片载体之间的热膨胀系数不匹配而引起热应变的温度变化，能够经受自然弯曲（与受限制的弯曲相反）。 如果芯片载体上的温度从室温变化到约-40℃的温度，如果加强环不存在，则芯片载体的表面的最大热诱导位移比如下 存在加强环。 由于热引起的位移增加，刚性芯片载体的开裂倾向增加，所以避免使用加强环的本发明改善了芯片载体的结构完整性。

公开(公告)号：US06797616B2

公开(公告)日：2004-09-28

申请号：US10225907

申请日：2002-08-21

Applicant: Larry D. Kinsman

Inventor： Larry D. Kinsman

IPC: H01L2144

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

公开(公告)号：US20040132321A1

公开(公告)日：2004-07-08

申请号：US10475606

申请日：2003-10-22

Inventor： Dirk Striebel

IPC: H01R012/00

CPC classification number: H01L23/13 ,  H01L23/055 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15151 ,  H01R13/035 ,  H05K1/119 ,  H05K3/42 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/0949 ,  H01L2924/00014

Abstract: A connection housing includes a base body with lateral walls, which extend around the base body on the top and which enclose the component to be inserted as well as inner contacts that are arranged between the component and at least one lateral wall. Polymer protuberances for forming outer contacts are shaped onto the underside. The connection between the inner contacts of the top and the outer contacts of the underside is effected by micro-boreholes that are located underneath the component in the middle area of the base body. This results in the provision of a housing, which requires little space on a printed circuit board and which can be economically produced preferably while using laser structuring.

Abstract translation: 连接壳体包括具有侧壁的基体，其在顶部上围绕基体延伸并且包围待插入的部件以及布置在部件与至少一个侧壁之间的内部触点。 用于形成外触点的聚合物突起成形在下侧。 顶部的内部触点和下侧的外部触点之间的连接由位于基体的中间区域中的部件下方的微孔来实现。 这导致提供一种外壳，其在印刷电路板上几乎没有空间，并且可以在使用激光结构时优选地经济地制造。

公开(公告)号：US06742247B2

公开(公告)日：2004-06-01

申请号：US10387871

申请日：2003-03-14

Applicant: Deepak K. Pai ,  Ronald R. Denny

Inventor： Deepak K. Pai ,  Ronald R. Denny

IPC: H05K300

CPC classification number: H05K3/462 ,  H01L2224/05548 ,  H05K3/28 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/043 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49213

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract translation: 本发明提供了用于层叠和互连多个高层计数（HLC）衬底以形成多层封装或其它电路部件的多种技术。 可以在两个HLC衬底中的至少一个的导电焊盘上形成焊料凸块。 焊料凸块优选地由焊膏应用于导电焊盘形成。 粘合剂膜可以位于具有导电焊盘的HLC衬底的表面之间，其中粘合剂膜包括基本上位于导电焊盘上方的孔，使得导电焊盘和/或焊料凸块通过孔彼此面对。 然后可以将HLC基底压在一起以经由粘合剂机械地粘合两个基底。 在叠层期间或之后可以回流焊料凸点，以产生焊接段，该焊料段通过粘合膜中的孔提供两个导电焊盘之间的电连接。

公开(公告)号：US06736308B1

公开(公告)日：2004-05-18

申请号：US10083195

申请日：2002-02-26

Applicant: Stuart D. Downes

Inventor： Stuart D. Downes

IPC: B23K3102

CPC classification number: B23K3/0638 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/0949 ,  H05K2201/10734 ,  H05K2203/0545 ,  Y02P70/613

Abstract: The invention is directed to techniques for distributing solder paste using a tool that defines a solder paste aperture having a non-circular cross-sectional shape. When the non-circular shape coincides with a pad and at least a portion of a stringer leading to the pad during a solder paste distribution process, solder paste is deposited over the pad and the stringer portion. Since solder paste now resides on the stringer portion, solder is not drawn from the pad toward the stringer portion during the soldering process as with some conventional situations. Rather, solder within the solder paste that resides on the stringer portion tends to adhere to the stringer portion, while some of the solder volume over the stringer pulls back to join the solder over the pad due to surface tension of the solder. The end result is a robust solder joint between the pad and corresponding component contact. Furthermore, the non-circular shape of the aperture allows for apertures that are larger in size than apertures for stencils that do not implement conventional overprinting approaches thus reducing the likelihood of clogging. One arrangement of the invention is directed to a solder paste distribution system having a base, a tool holder coupled to the base, and a solder paste distribution tool coupled to the tool holder. The solder paste distribution tool includes a support member that couples to the tool holder, a distribution member that defines a solder paste aperture having a non-circular cross-sectional shape, and a fastener that secures the distribution member to the support member.

Abstract translation: 本发明涉及使用限定具有非圆形横截面形状的焊膏孔的工具来分配焊膏的技术。 当非圆形形状与焊盘和在焊膏分配过程中通向焊盘的桁条的至少一部分重合时，焊膏沉积在焊盘和桁条部分上。 由于焊膏现在位于纵梁部分上，因此在焊接过程中焊料不会从焊盘朝向纵梁部分拉出，如同一些常规情况。 相反，驻留在纵梁部分的焊膏中的焊料倾向于粘附到纵梁部分，同时由于焊料的表面张力，在纵梁上方的焊料体积中的一些焊料体积回拉以将焊料焊接在焊盘上。 最终结果是焊盘和相应的部件接触之间的牢固的焊接接头。 此外，孔的非圆形形状允许尺寸大于不实施常规套印方法的模板的孔的孔，从而降低堵塞的可能性。 本发明的一种布置涉及一种焊膏分配系统，其具有底座，连接到基座的工具架以及耦合到工具架的焊膏分配工具。 焊膏分配工具包括耦合到工具架的支撑构件，限定具有非圆形横截面形状的焊膏孔的分配构件和将分配构件固定到支撑构件的紧固件。

公开(公告)号：US20040032028A1

公开(公告)日：2004-02-19

申请号：US10641037

申请日：2003-08-15

Applicant: General Dynamics Advanced Information Systems, Inc

Inventor： Deepak K. Pai ,  Ronald R. Denny

IPC: H01L023/48 ,  H01L023/52

CPC classification number: H05K3/462 ,  H01L2224/05548 ,  H05K3/28 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/0347 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2203/043 ,  H05K2203/063 ,  H05K2203/0733 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49213

Abstract: The present invention provides a number of techniques for laminating and interconnecting multiple high-layer-count (HLC) substrates to form a multilayer package or other circuit component. A solder bump may be formed on the conductive pad of at least one of two HLC substrates. The solder bump preferably is formed from an application of solder paste to the conductive pad(s). An adhesive film may be positioned between the surfaces of the HLC substrates having the conductive pads, where the adhesive film includes an aperture located substantially over the conductive pads such that the conductive pads and/or solder bumps confront each other through the aperture. The HLC substrates then may be pressed together to mechanically bond the two substrates via the adhesive. The solder bump(s) may be reflowed during or after the lamination to create a solder segment that provides an electrical connection between the two conductive pads through the aperture in the adhesive film.

Abstract translation: 本发明提供了用于层叠和互连多个高层计数（HLC）衬底以形成多层封装或其它电路部件的多种技术。 可以在两个HLC衬底中的至少一个的导电焊盘上形成焊料凸块。 焊料凸块优选地由焊膏应用于导电焊盘形成。 粘合剂膜可以位于具有导电焊盘的HLC衬底的表面之间，其中粘合剂膜包括基本上位于导电焊盘上方的孔，使得导电焊盘和/或焊料凸块通过孔彼此面对。 然后可以将HLC基底压在一起以经由粘合剂机械地粘合两个基底。 在叠层期间或之后可以回流焊料凸点，以产生焊接段，该焊料段通过粘合膜中的孔提供两个导电焊盘之间的电连接。

公开(公告)号：US20040020990A1

公开(公告)日：2004-02-05

申请号：US10453796

申请日：2003-06-03

Inventor： William H. Havens ,  Charles P. Barber ,  Colleen Gannon ,  Robert C. Gardiner ,  Robert J. Hennick ,  John A. Pettinelli

IPC: G06K007/10

CPC classification number: G06K7/10881 ,  G06K7/10574 ,  G06K7/10584 ,  G06K7/10722 ,  G06K7/10801 ,  G06K7/10861 ,  G06K7/1098 ,  G06K7/14 ,  G06K7/1417 ,  H05K1/18 ,  H05K3/244 ,  H05K2201/09072 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10121

Abstract: The invention is an optical reader having a plurality of imaging modules. In one method for operating a multiple imaging module reader of the invention, a second frame of image data captured via actuation of a second imaging module is automatically captured and subjected to decoding in the case an attempt to decode using a frame of image data captured via actuation of a first imaging module fails. In another embodiment, a frame of image data captured via actuation of an image sensor of a first module and actuation of illumination of a second imaging module is subjected to decoding. In another embodiment, frames of image data captured via actuation of image sensors of spaced apart modules are combined. The various modules of a multiple imaging module reader can be adapted to have different best focus positions so that a field depth of the reader is improved.