中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

1336 records (took 0.023 seconds)

    ELECTRIC POWER SOURCE DEVICE
    101.
    发明申请
    ELECTRIC POWER SOURCE DEVICE 有权
    电源设备

    公开(公告)号：US20150029759A1

    公开(公告)日：2015-01-29

    申请号：US14339859

    申请日：2014-07-24

    Applicant: DENSO CORPORATION

    Inventor： Yuuki TAKEMOTO ,  Katsutoyo MISAWA ,  Yuuichi HANDA ,  Syotarou YAMASAKI ,  Syuji KURAUCHI ,  Kenta HATAKENAKA

    IPC: H02M3/335

    CPC classification number: H02M3/33507 ,  B60L11/00 ,  B60L15/007 ,  B60L2210/10 ,  H01F5/00 ,  H02M3/00 ,  H02M3/337 ,  H05K1/0263 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10515 ,  Y02T10/645 ,  Y02T10/7216

    Abstract: An electric power source device has a transformer, a primary-side semiconductor module, a secondary-side semiconductor module, a secondary-side electrical component, a base plate and a circuit substrate on which substrate-side electrical components are mounted. The primary-side semiconductor module has a larger exterior size than the secondary-side electrical component. The primary-side semiconductor module and the secondary-side electrical component form a stacked section. In the stacked section, the secondary-side electrical component is stacked, in a vertical direction, i.e. a direction of a normal line of a mounting surface of the base plate, on the primary-side semiconductor module. The primary-side semiconductor module is directly mounted on the mounting surface. At least a part of the substrate-side electrical components is arranged inside of the primary-side semiconductor module in a horizontal direction, and inside of a second surface of the stacked section toward the mounting surface along the normal line.

    Abstract translation: 电源装置具有安装有基板侧电气部件的变压器，初级侧半导体模块，二次侧半导体模块，二次侧电气部件，基板以及电路基板。 初级侧半导体模块具有比次级侧电气部件更大的外部尺寸。 初级侧半导体模块和次级侧电气部件形成堆叠部。 在堆叠部分中，次级侧电气元件在初级侧半导体模块上沿垂直方向，即基板的安装表面的法线方向堆叠。 初级侧半导体模块直接安装在安装面上。 基板侧电气部件的至少一部分在水平方向配置在一次侧半导体模块的内部，在堆叠部的第二面的内侧沿着法线配置在安装面上。

    Semiconductor device
    102.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08917522B2

    公开(公告)日：2014-12-23

    申请号：US13576225

    申请日：2011-01-20

    Applicant: Takahiro Nakamura ,  Haruei Kokuho ,  Takahiro Yamada ,  Koichi Kimura

    Inventor： Takahiro Nakamura ,  Haruei Kokuho ,  Takahiro Yamada ,  Koichi Kimura

    IPC: H01L25/16 ,  H01L23/528 ,  H05K1/02 ,  H01L25/18

    CPC classification number: H01L25/162 ,  H01L23/5286 ,  H01L25/18 ,  H01L2924/0002 ,  H05K1/0216 ,  H05K1/0227 ,  H05K1/0262 ,  H05K2201/10166 ,  H01L2924/00

    Abstract: A semiconductor device that can suppress variation of GND potential of a control board and prevent malfunction of IC without restricting a mounting direction of the IC of the control board is provided. In a power module 10 as a semiconductor device in which an insulating board 31 having a power switching element 24 and a control board 22 having IC 50 for controlling the power switching element 24 are vertically provided in a case body 19, GND pins 61 are provided at both the sides of the IC 50, a GND pattern 51 to which the GND pins 61 of the IC 50 are connected is provided in the control board 22, and a GND loop breaking slit 70 as a breaking portion for breaking a GND loop formed by electrical connection of the IC 50, the GND pins 61 at both the sides of the IC 50 and the GND pattern 51 is provided to the GND pattern 51.

    Abstract translation: 提供一种可以抑制控制板的GND电位的变化并防止IC的故障而不限制控制板的IC的安装方向的半导体器件。 在作为半导体装置的功率模块10中，具有功率开关元件24的绝缘板31和具有用于控制功率开关元件24的IC 50的控制板22垂直设置在壳体主体19中，设置有GND引脚61 在IC 50的两侧，在控制板22上设置有连接有IC 50的GND引脚61的GND图形51，作为断开形成的GND环的断路部的GND环断路缝隙70 通过IC 50的电连接，将IC 50的两侧的GND引脚61和GND图案51提供给GND图案51。

    Integration of current measurement in wiring structure of an electronic circuit
    103.
    发明申请
    Integration of current measurement in wiring structure of an electronic circuit 有权
    电流测量在电子电路布线结构中的集成

    公开(公告)号：US20140327458A1

    公开(公告)日：2014-11-06

    申请号：US13886285

    申请日：2013-05-03

    Applicant: INFINEON TECHNOLOGIES AG

    Inventor： Martin GRUBER ,  Angela Kessler

    IPC: G01R27/14 ,  G01R3/00

    CPC classification number: G01R27/14 ,  G01R1/203 ,  G01R3/00 ,  G01R13/347 ,  G01R15/181 ,  G01R31/2648 ,  G01R31/2884 ,  H05K1/0268 ,  H05K1/167 ,  H05K3/06 ,  H05K2201/09736 ,  H05K2201/10166 ,  H05K2203/092 ,  H05K2203/171

    Abstract: A method of manufacturing an electronic circuit with an integrally formed capability of providing information indicative of a value of a current flowing in the electronic circuit, wherein the method comprises forming an electrically conductive wiring structure on a substrate, configuring a first section of the wiring structure for contributing to a predefined use function of the electronic circuit, and configuring a second section of the wiring structure for providing information indicative of the value of the current flowing in the electronic circuit upon applying a stimulus signal to the second section, wherein at least a part of the configuring of the first section and the configuring of the second section is performed simultaneously.

    Abstract translation: 一种制造电子电路的方法，所述电子电路具有提供表示在所述电子电路中流动的电流的值的信息的整合能力，其中所述方法包括在基板上形成导电布线结构，构成所述布线结构的第一部分 用于对所述电子电路的预定义使用功能作出贡献，以及配置所述布线结构的第二部分，用于在向所述第二部分施加刺激信号时提供指示在所述电子电路中流动的电流的值的信息，其中至少一个 同时执行部分第一部分的配置和第二部分的配置。

    Power transducer
    104.
    发明授权
    Power transducer 有权
    功率传感器

    公开(公告)号：US08848384B2

    公开(公告)日：2014-09-30

    申请号：US13713621

    申请日：2012-12-13

    Applicant: Hitachi Industrial Equipment Systems Co., Ltd.

    Inventor： Satoshi Ibori ,  Yasushi Sasaki ,  Yutaka Maeno ,  Masayuki Hirota ,  Kazuyuki Fukushima

    IPC: H05K7/00 ,  H02M7/00 ,  H05K7/02 ,  H05K7/14 ,  H05K1/14 ,  H05K1/02 ,  H05K3/34

    CPC classification number: H05K7/02 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/0256 ,  H05K1/141 ,  H05K3/3447 ,  H05K7/1432 ,  H05K2201/10015 ,  H05K2201/10166 ,  H01L2924/00

    Abstract: A power transducer is downsized by reducing the size of a power source board and highly reliable. The power source board is provided in the power transducer and for a large-current circuit. The power transducer includes a power semiconductor module having lead terminals. Of the lead terminals provided for the power semiconductor module and connected with the main circuit board, predetermined one or ones of the lead terminals is or are connected with the main circuit board in the vicinity of a main circuit terminal stage and at a position or positions lower than the main circuit terminal stage. Alternatively, predetermined one or ones of the lead terminals is or are connected with the main circuit board at a position or positions lower than a position at which the main circuit terminal stage is provided.

    Abstract translation: 功率传感器通过减小电源板的尺寸来缩小尺寸，并且可靠性高。 电源板设置在功率传感器和大电流电路中。 功率传感器包括具有引线端子的功率半导体模块。 在为功率半导体模块提供并与主电路板连接的引线端子中，预定的一个或多个引线端子与主电路板在主电路端子台附近或位置 低于主电路端子级。 或者，预定的一个或多个引线端子在主电路板上或与设置有主电路端子台的位置比较低的位置处连接。

    DRIVE CIRCUIT DEVICE
    105.
    发明申请
    DRIVE CIRCUIT DEVICE 有权
    驱动电路设备

    公开(公告)号：US20140254105A1

    公开(公告)日：2014-09-11

    申请号：US14195975

    申请日：2014-03-04

    Applicant: JTEKT CORPORATION

    Inventor： Nobuhiro UCHIDA

    IPC: H05K7/20

    CPC classification number: H01L23/367 ,  H01L23/3675 ,  H01L2924/0002 ,  H02M7/003 ,  H05K1/0203 ,  H05K1/0263 ,  H05K2201/10166 ,  H01L2924/00

    Abstract: A drive circuit device includes a circuit board having a multilayer structure, which includes first to fourth circuit conductor layers, and first to third insulating layers; and heat sinks that dissipate heat of the circuit board to an outside. An upper FET state is embedded in the first insulating layer, and a lower FET state is embedded in the second insulating layer. The upper FET and the lower FET are disposed so that a region in which the upper FET is positioned and a region in which the lower FET is positioned overlap each other in a stacking direction. A lead-out portion is formed at a second circuit pattern of the circuit conductor layer, the lead-out portion extending from the circuit board in a direction orthogonal to the stacking direction, and being connected to the heat sinks so that heat is transferred to the heat sinks.

    Abstract translation: 驱动电路装置包括具有多层结构的电路板，其包括第一至第四电路导体层以及第一至第三绝缘层; 以及将电路板的热量散发到外部的散热器。 第一绝缘层中嵌有上FET状态，第二绝缘层嵌入下FET状态。 上FET和下FET被布置成使得上FET的位置的区域和下FET的位置的区域在层叠方向上彼此重叠。 引出部分形成在电路导体层的第二电路图案处，引出部分从电路板沿垂直于层叠方向的方向延伸，并连接到散热片，从而将热量传递到 散热器。

    SYSTEMS AND METHODS FOR POWER TRAIN ASSEMBLIES
    106.
    发明申请
    SYSTEMS AND METHODS FOR POWER TRAIN ASSEMBLIES 审中-公开
    动力总成组合系统与方法

    公开(公告)号：US20140252541A1

    公开(公告)日：2014-09-11

    申请号：US13792293

    申请日：2013-03-11

    Applicant: GENERAL ELECTRIC COMPANY

    Inventor： Ivan Dimitrov Nanov ,  John Frank Steel

    IPC: H01L23/34 ,  H05K3/32

    CPC classification number: H05K3/32 ,  H01L23/36 ,  H01L23/49555 ,  H01L2924/0002 ,  H05K1/181 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  Y02P70/611 ,  Y10T29/4913 ,  H01L2924/00

    Abstract: A power train assembly is provided. The power train assembly includes a component package including a first transistor having a first gate, a first drain, and a first source, a second transistor having a second gate, a second drain, and a second source, and a thermal pad configured to dissipate heat generated in the component package, wherein the thermal pad is electrically coupled to the first source and the second drain. The power train assembly further includes a printed circuit board (PCB) electrically coupled to the component package, and an electrical component electrically coupled directly to the thermal pad, wherein the electrical component is external to the component package.

    Abstract translation: 提供动力总成组件。 动力传动系组件包括部件封装，其包括具有第一栅极，第一漏极和第一源极的第一晶体管，具有第二栅极，第二漏极和第二源极的第二晶体管，以及散热板 在组件封装中产生的热量，其中散热垫电耦合到第一源极和第二漏极。 动力传动系组件还包括电耦合到部件封装的印刷电路板（PCB），以及直接耦合到散热焊盘的电气部件，其中电组件在组件封装外部。

    SWITCHING CIRCUIT LAYOUT WITH HEATSINK
    108.
    发明申请
    SWITCHING CIRCUIT LAYOUT WITH HEATSINK 审中-公开
    用HEATSINK切换电路布局

    公开(公告)号：US20140185245A1

    公开(公告)日：2014-07-03

    申请号：US14143699

    申请日：2013-12-30

    Applicant: Solaredge Ltd.

    Inventor： Lior Handelsman ,  Tzachi Glovinski ,  Amir Grossberg ,  Sonke Rogalia ,  Heribert Schmidt

    IPC: H05K1/18 ,  H05K1/02

    CPC classification number: H05K1/18 ,  H02M7/003 ,  H05K1/0203 ,  H05K1/021 ,  H05K1/0216 ,  H05K1/182 ,  H05K3/0061 ,  H05K2201/09418 ,  H05K2201/10166 ,  H05K2201/10522

    Abstract: A circuit board adapted for use in an switching converter for connecting a plurality of switches including a first switch, a second switch, a third switch and a fourth switch. The circuit board has a layout for connecting the switches. The layout is adapted for locating the switches substantially at or symmetrically with respect to the endpoints of a right-angle cross. The right-angle cross is formed from two line segments intersecting with a ninety degree angle. The circuit board may offsets the switches perpendicularly to the line segments at the endpoints of the line segments either in a clockwise or a counterclockwise direction.

    Abstract translation: 一种电路板，适用于用于连接包括第一开关，第二开关，第三开关和第四开关的多个开关的开关转换器。 电路板具有用于连接开关的布局。 该布局适于将开关基本上位于或对称地相对于直角十字的端点定位。 直角十字从与九十度角相交的两个线段形成。 电路板可以在线段的端点处以顺时针或逆时针方向垂直于线段偏移开关。

Patent Agency Ranking