公开(公告)号：US20120193139A1

公开(公告)日：2012-08-02

申请号：US13356791

申请日：2012-01-24

Applicant: Takeshi Okuyama ,  Toshihiro KUSAGAYA ,  Tohru YAMAKAMI

Inventor： Takeshi Okuyama ,  Toshihiro KUSAGAYA ,  Tohru YAMAKAMI

IPC: H05K5/02 ,  H05K3/00 ,  H01R9/00

CPC classification number: H05K3/3426 ,  H01R4/028 ,  H01R12/57 ,  H01R12/724 ,  H01R13/6587 ,  H05K1/025 ,  H05K3/3494 ,  H05K2201/10189 ,  H05K2201/10757 ,  H05K2201/10803 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/04 ,  Y02P70/613

Abstract: Disclosed is a surface mount device to be mounted on a base member, including plural lead units, each of the plural lead units including, a lead including a body portion and a foot formed at an end of the lead; a solder portion formed at the foot of the lead to protrude toward the direction of the base member to have a summit portion, and a diffusion prevention portion provided on the lead for preventing a diffusion of a solder along the body portion of the lead.

Abstract translation: 公开了一种表面安装装置，其安装在基座构件上，包括多个引线单元，所述多个引线单元中的每一个包括：引线，其包括形成在引线端部的主体部分和脚部; 形成在引脚的脚部处的焊料部分朝向基部构件的方向突出以具有顶部部分，以及设置在引线上的防止扩散部分，用于防止焊料沿引线的主体部分扩散。

公开(公告)号：US20120169448A1

公开(公告)日：2012-07-05

申请号：US13286234

申请日：2011-11-01

Applicant: Hsiang-Yi TSENG ,  Ching-Hsiang TIEN ,  Yi-Lin CHEN ,  Hsin-Wei TSAI ,  Chun-Song MING

Inventor： Hsiang-Yi TSENG ,  Ching-Hsiang TIEN ,  Yi-Lin CHEN ,  Hsin-Wei TSAI ,  Chun-Song MING

IPC: H01F27/30

CPC classification number: H05K1/182 ,  H01F27/306 ,  H05K3/306 ,  H05K2201/1003 ,  H05K2201/10409 ,  H05K2201/10757

Abstract: A transformer capable of adjusting its height is provided. The transformer is formed on a circuit board having a receiving hole. The transformer comprises a winding module, two magnetic core modules, a plurality of pins and a plurality of supporting bulges. The winding module comprises a winding baseboard and a winding pillar where a winding structure is formed thereon. The winding pillar is received in the receiving hole. The winding baseboard further comprises a corresponding surface heading to the circuit board. The magnetic core modules contact and hold the winding module. The pins are formed on the edge of the to winding baseboard to be connected to the circuit board around the receiving hole. The supporting bulges are formed between the corresponding surface and the circuit board, wherein the height of the corresponding surface relative to the circuit board is adjusted according to the supporting bulges.

Abstract translation: 提供了能够调节其高度的变压器。 变压器形成在具有接收孔的电路板上。 变压器包括绕组模块，两个磁芯模块，多个销和多个支撑凸起。 绕组模块包括绕组基板和在其上形成绕组结构的绕组柱。 卷绕柱被容纳在接收孔中。 绕组基板还包括朝向电路板的相应表面。 磁芯模块接触并保持绕组模块。 引脚形成在绕组基板的边缘上，以在接收孔周围连接到电路板。 支撑凸起形成在相应的表面和电路板之间，其中相对于电路板的对应表面的高度根据支撑凸起来调节。

公开(公告)号：US20120026705A1

公开(公告)日：2012-02-02

申请号：US13193422

申请日：2011-07-28

Applicant: Karl Geisler ,  Jason Klassen ,  Michael Woizeschke

Inventor： Karl Geisler ,  Jason Klassen ,  Michael Woizeschke

IPC: H05K1/18 ,  H01B5/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H05K3/32 ,  H05K3/3421 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10757 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00

Abstract: An interposer lead provides a connection between an integrated circuit and a circuit board. The interposer lead includes a first leg for interfacing with the circuit board. The interposer lead also includes a second leg disposed generally parallel to the first leg for interfacing with an IC electrical lead extending from the integrated circuit. A connecting portion operatively connects the first leg and the second leg. The interposer lead further includes a lip extending non-parallel from the second leg for limiting movement of the IC electrical lead on the second leg.

Abstract translation: 插入器引线提供集成电路和电路板之间的连接。 插入器引线包括用于与电路板接口的第一支脚。 插入器引线还包括大致平行于第一支腿设置的第二支脚，用于与从集成电路延伸的IC电引线对接。 连接部分可操作地连接第一腿部和第二腿部。 插入器引线还包括从第二支腿不平行地延伸的唇缘，用于限制IC电引线在第二支腿上的移动。

公开(公告)号：US20110299250A1

公开(公告)日：2011-12-08

申请号：US13152419

申请日：2011-06-03

Applicant: Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

Inventor： Akira HARAO ,  Mototatsu MATSUNAGA ,  Yasuhiro SUGIURA ,  Minoru KUBOTA

IPC: H05K7/20 ,  H05K3/10

CPC classification number: H05K1/0204 ,  H01L23/49861 ,  H01L2224/05571 ,  H01L2224/48091 ,  H01L2225/1094 ,  H01R12/728 ,  H05K1/0203 ,  H05K1/05 ,  H05K1/056 ,  H05K1/11 ,  H05K1/14 ,  H05K3/10 ,  H05K3/202 ,  H05K3/3447 ,  H05K3/368 ,  H05K7/1046 ,  H05K2201/09009 ,  H05K2201/09063 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2203/025 ,  Y10T29/49147 ,  Y10T29/49155

Abstract: A wiring substrate 11A includes a high heat radiation substrate 21 which has a high thermal conductive layer in which at least one of a front surface and a rear surface thereof is a mounting surface 21a for a variety of components; a connection terminal 31 which is extended from the high heat radiation substrate 21 and bent in a direction perpendicular to a surface of the high heat radiation substrate 21; and a heat radiation piece section 35 which is integrally installed to the connection terminal 31.

Abstract translation: 布线基板11A包括高散热基板21，其具有高导热层，其中前表面和后表面中的至少一个是用于各种部件的安装表面21a; 连接端子31，其从高散热基板21延伸并且在垂直于高散热基板21的表面的方向上弯曲; 以及一体地安装在连接端子31上的散热片部35。

公开(公告)号：US07990001B2

公开(公告)日：2011-08-02

申请号：US12524386

申请日：2007-10-30

Applicant: Kenta Hatano ,  Naoki Miyamoto ,  Toshiyuki Umemoto ,  Hirofumi Doi

Inventor： Kenta Hatano ,  Naoki Miyamoto ,  Toshiyuki Umemoto ,  Hirofumi Doi

IPC: H02K11/00

CPC classification number: H05K3/308 ,  H02K5/225 ,  H02K11/33 ,  H02K2211/03 ,  H05K3/3447 ,  H05K2201/1003 ,  H05K2201/10295 ,  H05K2201/10333 ,  H05K2201/10446 ,  H05K2201/10757

Abstract: A terminal structure for a vehicle-mounted motor includes a motor body having a motor terminal 28 connected to a coil, and a circuit body 5 holding a circuit board 18 for controlling a rotation of the motor body and is assembled in the motor body, wherein a stress relaxation section 35 is provided in an intermediate of an intermediate conductor 34, in order to reduce stress acting on the intermediate conductor 34 connecting the motor terminal 28 and the circuit board 18 and to thereby improve the conductive reliability of electrical joint.

Abstract translation: 一种用于车载电动机的端子结构，包括具有连接到线圈的电动机端子28的电动机主体和保持用于控制电动机主体的旋转并组装在电动机主体中的电路板18的电路体5，其中， 在中间导体34的中间设置有应力缓和部35，以便减小作用在连接电动机端子28和电路基板18的中间导体34上的应力，从而提高电接头的导电可靠性。

公开(公告)号：US20110124208A1

公开(公告)日：2011-05-26

申请号：US12949824

申请日：2010-11-19

Applicant: XUE-FENG ZHANG ,  FENG-HAO KU ,  YU-FENG XIA

Inventor： XUE-FENG ZHANG ,  FENG-HAO KU ,  YU-FENG XIA

IPC: H01R12/70

CPC classification number: H05K3/301 ,  H05K2201/0311 ,  H05K2201/10325 ,  H05K2201/10689 ,  H05K2201/10757

Abstract: An exemplary socket assembly includes a circuit plate and a socket mounted on the circuit plate for fixing an IC. The socket includes a first fixing member and a second fixing member. The first fixing member includes installed portions, elastic connecting portions, and a first buckling portion, the elastic connecting portions interconnects the electric portions and the first buckling portion. The second fixing member includes electric portions, elastic connecting portions, and a second buckling portion, and the elastic connecting portions interconnect the electric portions and the second buckling portion. Wherein when the IC is attached to the socket, the first buckling portion and the second buckling portion are initially disengaged from each other, pins of the IC is electrically connected with the electric portions, the first buckling portion and the second buckling portion are brought together with the elastic connecting portions elastically deforming, and the first buckling portion and the second buckling portion are locked together and hold the IC in the socket.

Abstract translation: 示例性插座组件包括电路板和安装在电路板上用于固定IC的插座。 插座包括第一固定构件和第二固定构件。 第一固定构件包括安装部分，弹性连接部分和第一弯曲部分，弹性连接部分将电气部分和第一屈曲部分互连。 第二固定构件包括电气部分，弹性连接部分和第二弯曲部分，并且弹性连接部分将电气部分和第二屈曲部分互连。 其中当IC连接到插座时，第一屈曲部分和第二弯曲部分最初彼此分离，IC的引脚与电气部分电连接，第一弯曲部分和第二弯曲部分被聚集在一起 其中弹性连接部分弹性变形，并且第一弯曲部分和第二弯曲部分被锁定在一起并将IC保持在插座中。

公开(公告)号：US07944711B2

公开(公告)日：2011-05-17

申请号：US12396108

申请日：2009-03-02

Applicant: Elio Marioni

Inventor： Elio Marioni

IPC: H05K7/02

CPC classification number: H05K1/0209 ,  H05K1/145 ,  H05K3/3426 ,  H05K3/3447 ,  H05K2201/09781 ,  H05K2201/10166 ,  H05K2201/10204 ,  H05K2201/10522 ,  H05K2201/1056 ,  H05K2201/10757 ,  Y10T29/4913

Abstract: The present invention relates to a substantially package-like discrete electronic component of the type comprising a power electronic circuit, a body or casing, substantially parallelepiped, and electric connecting pins connected inside the body with said circuit and projecting from said body for an electric connection on the electronic printed circuit board. The body has a heat dissipating header having at least one surface emerging from the body and laying on a plane whereas the pins project from the body for a first section initially extended parallel to the plane. Advantageously a pair of pins has a substantially U-shaped bending, after the first section parallel to the plane for allowing a more stable bearing of the component during the step of welding to a heat dissipating intermediate die.

Abstract translation: 本发明涉及一种基本上包装状的分立电子部件，其类型包括主电源电路，主体或壳体，基本上平行六面体的电连接销和连接在主体内的所述电路的电连接销，并从所述主体突出以进行电连接 在电子印刷电路板上。 主体具有散热头部，其具有至少一个从主体出来并放置在平面上的表面，而销从主体突出出来，第一部分最初平行于平面延伸。 有利的是，在第一部分平行于平面之后，一对销具有基本上U形的弯曲，以便在焊接到散热中间管芯的步骤期间允许部件的更稳定的轴承。

公开(公告)号：US07777308B2

公开(公告)日：2010-08-17

申请号：US12259824

申请日：2008-10-28

Applicant: Se-Young Yang ,  Sun-Won Kang ,  Yeo-Hoon Yoon

Inventor： Se-Young Yang ,  Sun-Won Kang ,  Yeo-Hoon Yoon

IPC: H01L23/495

CPC classification number: H01L23/49555 ,  H01L23/49575 ,  H01L25/105 ,  H01L2225/1029 ,  H01L2225/107 ,  H01L2924/0002 ,  H05K1/182 ,  H05K1/183 ,  H05K3/3426 ,  H05K2201/09845 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10689 ,  H05K2201/10757 ,  Y02P70/613 ,  H01L2924/00

Abstract: Integrated circuit packages include an integrated circuit mounting substrate having a hole that defines an inner wall of the integrated circuit mounting substrate. An integrated circuit is provided in the hole. A sinuous lead frame extends from the integrated circuit and is connected to the inner wall. The sinuous lead frame extends back and forth along a given direction, and may include a U- and/or V-shape, and round and/or jagged portions. Related packaging methods are also disclosed.

Abstract translation: 集成电路封装包括具有限定集成电路安装基板的内壁的孔的集成电路安装基板。 在孔中设置集成电路。 引线框架从集成电路延伸并连接到内壁。 弯曲的引线框架沿着给定的方向来回延伸，并且可以包括U形和/或V形，以及圆形和/或锯齿形部分。 还公开了相关的包装方法。

公开(公告)号：US07677905B2

公开(公告)日：2010-03-16

申请号：US11979968

申请日：2007-11-13

Applicant: Takayoshi Honda

Inventor： Takayoshi Honda

IPC: H01R12/00

CPC classification number: H05K1/116 ,  H01R12/707 ,  H01R43/0256 ,  H05K1/023 ,  H05K3/3405 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09709 ,  H05K2201/09727 ,  H05K2201/0979 ,  H05K2201/10189 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2201/10787 ,  H05K2201/10803 ,  H05K2201/10871 ,  H05K2201/10901 ,  H05K2203/1178 ,  H05K2203/1394

Abstract: An electronic device includes a printed circuit board with multiple lands and through holes and an electronic element with multiple terminals on the board. Each terminal is coupled with the land through a solder. The lands include a surface land on the board and an insertion land on a sidewall of the through hole. The terminals include a branch terminal having an insertion member and a surface member. The insertion member is coupled with the insertion land through the solder. The surface member is coupled with the surface land through the solder. The surface member is parallel to the printed circuit board. The insertion member is perpendicular to the printed circuit board. The insertion member extends from a part of the surface member, which faces the surface land and disposed above the through hole.

Abstract translation: 电子设备包括具有多个焊盘和通孔的印刷电路板以及具有多个端子的电子元件。 每个端子通过焊料与焊盘连接。 焊盘包括板上的表面焊盘和通孔的侧壁上的插入焊盘。 端子包括具有插入部件和表面部件的分支端子。 插入构件通过焊料与插入平台耦合。 表面构件通过焊料与表面焊盘连接。 表面构件平行于印刷电路板。 插入构件垂直于印刷电路板。 所述插入部件从所述表面部件的面向所述表面焊盘并设置在所述通孔的上方的一部分延伸。

公开(公告)号：US20090224394A1

公开(公告)日：2009-09-10

申请号：US12390714

申请日：2009-02-23

Applicant: Hirochika NARITA

Inventor： Hirochika NARITA

IPC: H01L23/48 ,  H04N5/335

CPC classification number: H04N1/03 ,  H01L23/49541 ,  H01L23/49544 ,  H01L23/49555 ,  H01L24/48 ,  H01L27/14618 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/16195 ,  H04N2201/02456 ,  H04N2201/02466 ,  H04N2201/02483 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10689 ,  H05K2201/10757 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Warpage and twist of a solid-state image sensing apparatus is controlled, thereby preventing displacement occurring to the solid-state image sensing apparatus when it is mounted on a printed circuit board. The solid-state image sensing apparatus comprises a plurality of outer leads, and the outer leads each comprises a horizontal portion protruding in the horizontal direction from a side face of a package body for encasing a solid-state image sensing chip therein, an end portion extending in a direction orthogonal to the horizontal portion, and disposed directly below the horizontal portion, a mid portion positioned between the horizontal portion, and the end portion, a first bend formed between the horizontal portion, and the mid portion, and a second bend formed between the mid portion, and the end portion.

Abstract translation: 控制固态图像感测装置的翘曲和扭曲，从而防止固体摄像装置安装在印刷电路板上时产生的位移。 固体摄像装置包括多个外部引线，外部引线各自包括水平部分，该水平部分从封装体的侧面在水平方向上突出，用于将固态图像感测芯片包封在其中，端部 在垂直于水平部分的方向上延伸并且设置在水平部分正下方，位于水平部分和端部之间的中间部分，形成在水平部分和中间部分之间的第一弯曲部分和第二弯曲部分 形成在中间部分和端部之间。