公开(公告)号：US20090145634A1

公开(公告)日：2009-06-11

申请号：US12276681

申请日：2008-11-24

Applicant: FU-MIN HSU

Inventor： FU-MIN HSU

IPC: H05K1/00

CPC classification number: H05K1/0281 ,  H05K3/0064 ,  H05K2201/053 ,  H05K2201/2009

Abstract: A flexible printed circuitboard (FPC) with reinforcement structure is disclosed, which comprises: a flexible printed circuitboard (FPC), configured with an extended part at a side thereof; and an a stiffener, stacking on a surface of the FPC on the area excepting the extended part while configuring a recess on the stiffener at the position thereof corresponding to the extending direction of the extended part. With the aforesaid structure, it can reduce the shear stress from concentrating at the joint between the extended part and the FPC and thus prevent the FPC from breaking so that the strength of the FPC can be enhanced.

Abstract translation: 公开了一种具有加强结构的柔性印刷电路板（FPC），其包括：柔性印刷电路板（FPC），其在其一侧配置有延伸部分; 以及加强件，在对应于延伸部的延伸方向的位置上构成加强件上的凹部的同时，在FPC的外表面堆叠在除了延伸部之外的区域上。 通过上述结构，能够减小聚集在延伸部与FPC之间的接合部处的剪切应力，防止FPC断裂，能够提高FPC的强度。

公开(公告)号：US07538420B2

公开(公告)日：2009-05-26

申请号：US11832978

申请日：2007-08-02

Applicant: Yoshihiro Morita

Inventor： Yoshihiro Morita

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K3/0058 ,  H05K2201/10409 ,  H05K2201/10734 ,  H05K2201/2009 ,  H01L2224/0401

Abstract: A package mounted module wherein a package board on the topside surface of which a semiconductor chip such as an LSI is mounted is further mounted on the topside surface of the motherboard of a large-scale computing machine such as a large-sized computer, and a stiffener is provided on the underside surface of the motherboard. In order to improve the reliability of solder bonding, a stiffener is fixed to the motherboard with screws at plural locations on the periphery of the stiffener and is also fixed to the motherboard with a screw in the central part of the stiffener.

Abstract translation: 一种封装安装模块，其中安装有诸如LSI的半导体芯片的顶表面上的封装板进一步安装在大型计算机例如大型计算机的主板的顶侧表面上，并且 加强件设置在母板的下表面上。 为了提高焊接的可靠性，在加强件的周围的多个位置处用螺钉将加强件固定在母板上，并且还在加强件的中心部分用螺钉固定在母板上。

公开(公告)号：US20090116201A1

公开(公告)日：2009-05-07

申请号：US12140592

申请日：2008-06-17

Applicant: Shin-Chung HSIEH

Inventor： Shin-Chung HSIEH

IPC: H05K1/14 ,  H05K3/32

CPC classification number: H05K1/0218 ,  H05K1/0271 ,  H05K1/181 ,  H05K2201/2009 ,  H05K2201/2018 ,  Y10T29/49144

Abstract: A circuit board module includes a circuit board and a reinforcing substrate. At least one electronic element is disposed on one surface of the circuit board. The reinforcing substrate is connected to a portion of the surface and disposed around the electronic element. A method for reinforcing the structure of the circuit board module is also disclosed.

Abstract translation: 电路板模块包括电路板和加强基板。 至少一个电子元件设置在电路板的一个表面上。 加强基板连接到表面的一部分并且设置在电子元件周围。 还公开了一种用于加强电路板模块的结构的方法。

公开(公告)号：US20090097209A1

公开(公告)日：2009-04-16

申请号：US12335057

申请日：2008-12-15

Applicant: Hiroyuki FUKUSAKO ,  Kazunori SENO

Inventor： Hiroyuki FUKUSAKO ,  Kazunori SENO

IPC: H05K7/20

CPC classification number: H01L23/50 ,  G02F1/13452 ,  H01L23/3677 ,  H01L23/4985 ,  H01L23/552 ,  H01L2224/73253 ,  H01L2924/16152 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K1/0393 ,  H05K3/0061 ,  H05K2201/0382 ,  H05K2201/09054 ,  H05K2201/10598 ,  H05K2201/2009

Abstract: A driver module structure includes a flexible circuit board (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible circuit board (2), and an electrically conductive heat-radiating member (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8). The flexible circuit board (2) has a cavity (9) that exposes a portion of the ground wiring pattern (8). The exposed portion of the ground wiring pattern (8) and the heat-radiating member (4) are connected to establish electrical continuity via a member (11) that is fitted into the cavity (9).

Abstract translation: 驱动器模块结构包括设置有布线图案（7）的柔性电路板（2），安装在柔性电路板（2）上的半导体器件）和接合到半导体器件的导电散热构件 。 布线图案（7）包括接地布线图案（8）。 柔性电路板（2）具有露出接地布线图形（8）的一部分的空腔（9）。 接地布线图案（8）和散热构件（4）的暴露部分被连接以经由装配到空腔（9）中的构件（11）建立电连续性。

公开(公告)号：US07504718B2

公开(公告)日：2009-03-17

申请号：US11125499

申请日：2005-05-10

Applicant: Michael Anthony Gaynes ,  Kathleen Conlon Hinge ,  John Ulrich Knickerbocker

Inventor： Michael Anthony Gaynes ,  Kathleen Conlon Hinge ,  John Ulrich Knickerbocker

IPC: H01L23/02 ,  H01L29/40

CPC classification number: H05K1/0271 ,  H01L23/562 ,  H01L2224/16 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/15311 ,  H05K1/181 ,  H05K3/0058 ,  H05K2201/068 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2201/2009 ,  H01L2924/00 ,  H01L2224/0401

Abstract: Apparatus and methods are provided for constructing balanced semiconductor chip package structures that minimize bowing, in-plane strain and/or other thermally induced mechanical strains that may arise during thermal cycling, to thus prevent structural damage to chip package structures.

Abstract translation: 提供了用于构建平衡的半导体芯片封装结构的装置和方法，其使在热循环期间可能出现的弯曲，面内应变和/或其它热诱导的机械应变最小化，从而防止对芯片封装结构的结构损坏。

公开(公告)号：US20090044967A1

公开(公告)日：2009-02-19

申请号：US12281811

申请日：2007-03-14

Applicant: Hiroki Nakahama ,  Seiji Muraoka

Inventor： Hiroki Nakahama ,  Seiji Muraoka

IPC: H05K1/02

CPC classification number: H05K1/0271 ,  G02F1/13452 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/31 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2929 ,  H01L2224/29344 ,  H01L2224/29355 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/83851 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/14 ,  H05K1/189 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2201/2009 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A circuit board, an electronic circuit device, and a display device, in which generation of an edge short-circuit is prevented, includes wirings that are arranged much more densely. A circuit board includes a substrate having a first main surface on which a semiconductor integrated circuit is mounted and a second main surface; a plurality of first wirings including a bump connecting terminal on the first main surface; and a plurality of second wirings on the second main surface, wherein the plurality of the second wirings are arranged independently from each other and overlap with a region where the semiconductor integrated circuit is mounted, and the circuit board includes a wiring portion on the second main surface in a region overlapping with a region where the bump connecting terminal is arranged.

Abstract translation: 防止边缘短路的产生的电路板，电子电路装置和显示装置包括布置得更密集的布线。 电路板包括具有安装有半导体集成电路的第一主表面和第二主表面的基板; 多个第一布线，包括在所述第一主表面上的凸块连接端子; 以及多个第二布线，其中多个第二布线彼此独立地布置并与安装半导体集成电路的区域重叠，并且电路板包括在第二主表面上的布线部分 在与突起连接端子配置的区域重叠的区域中的表面。

公开(公告)号：US20090025971A1

公开(公告)日：2009-01-29

申请号：US12219355

申请日：2008-07-21

Applicant: Yoshikazu Kanemaru ,  Takaaki Morita ,  Kenichi Kawabata

Inventor： Yoshikazu Kanemaru ,  Takaaki Morita ,  Kenichi Kawabata

IPC: H05K3/30 ,  H05K1/16

CPC classification number: H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L24/82 ,  H01L24/97 ,  H01L25/0655 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2224/97 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/0052 ,  H05K3/0097 ,  H05K3/4602 ,  H05K2201/068 ,  H05K2201/2009 ,  H05K2203/0169 ,  Y10T29/49146 ,  H01L2224/82 ,  H01L2924/00

Abstract: A method of manufacturing an electronic component-embedded board is provided which is capable of suppressing warpage without requiring complicated processes at low cost and which offers high productivity and economic efficiency. A worksheet 100 includes insulating layers 21 and 31 on one surface of an approximately rectangular substrate 11, and an electronic component 41 and a plate-like frame member (member) 51 embedded inside the insulating layer 21, wherein the plate-like frame member 51 satisfying the relationship represented by the following formula (1): α1

Abstract translation: 提供一种电子部件嵌入式基板的制造方法，其能够抑制翘曲而不需要以低成本进行复杂的加工，并且提供高生产率和经济效率。 工作片100包括在近似矩形基板11的一个表面上的绝缘层21和31，以及嵌入在绝缘层21内的电子部件41和板状框架部件（部件）51，其中板状框架部件51 满足由下式（1）表示的关系：α1α3和α2α3。 。 。 （1）安装在基板11上的电子部件41的未安装部分上。在该公式中，α1，α2和α3分别表示电子部件41的线性热膨胀系数（ppm / K），板 类框架构件51和基板11，各个布线层或各绝缘层。

公开(公告)号：US07467396B2

公开(公告)日：2008-12-16

申请号：US11169228

申请日：2005-06-27

Applicant: Kuan-Heng Wu

Inventor： Kuan-Heng Wu

IPC: G11B33/12 ,  G11B21/02 ,  G11B7/085

CPC classification number: G11B33/122 ,  H05K1/0281 ,  H05K1/118 ,  H05K3/0058 ,  H05K2201/2009

Abstract: The present invention provides a disc drive and a flexible cable assembly therein. The disc drive includes a circuit board, a flexible cable assembly coupled to the circuit board, and an optical pick-up unit which the flexible cable assembly is electrically connected to. The flexible cable assembly includes a flexible cable and a protector partly attached to the flexible cable. When the optical pick-up unit processes the data on a disc, the protector keeps the flexible cable away from the disc.

Abstract translation: 本发明提供一种盘驱动器及其中的柔性电缆组件。 盘驱动器包括电路板，耦合到电路板的柔性电缆组件和柔性电缆组件电连接到的光学拾取单元。 柔性电缆组件包括柔性电缆和部分地附接到柔性电缆的保护器。 当光学拾取单元处理盘上的数据时，保护器将柔性电缆保持在远离光盘的状态。

公开(公告)号：US20080285303A1

公开(公告)日：2008-11-20

申请号：US12182717

申请日：2008-07-30

Applicant: Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

Inventor： Jun Matsui ,  Koji Terada ,  Hiroyuki Nobuhara

IPC: F21V8/00 ,  H01L33/00

CPC classification number: G02B6/4201 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4292 ,  H05K1/0209 ,  H05K1/0274 ,  H05K1/189 ,  H05K3/0058 ,  H05K2201/066 ,  H05K2201/09072 ,  H05K2201/09781 ,  H05K2201/10121 ,  H05K2201/2009 ,  H05K2201/2018

Abstract: An optical module according to the present invention comprises an electric wiring substrate, a first optical element mounted on the electric wiring substrate so that a heat generation section of the first optical element is positioned relatively close to a substrate surface of the electric wiring substrate and a heat sink mounted on the same plane as the mounting plane of the first optical element on the electric wiring substrate, the heat sink being mounted on the electric wiring substrate so that an area of electric wiring on the electric wiring substrate overlaps the heat sink. This improves the efficiency of heat radiation of the optical module.

Abstract translation: 根据本发明的光学模块包括电布线基板，安装在电布线基板上的第一光学元件，使得第一光学元件的发热部分相对靠近电布线基板的基板表面定位， 散热器安装在与电布线基板上的第一光学元件的安装平面相同的平面上，散热器安装在电布线基板上，使得电布线基板上的电布线的区域与散热器重叠。 这提高了光学模块的散热效率。

公开(公告)号：US20080285241A1

公开(公告)日：2008-11-20

申请号：US11960656

申请日：2007-12-19

Applicant: NING HOU ,  SHING-TZA LIOU

Inventor： NING HOU ,  SHING-TZA LIOU

IPC: H05K1/00 ,  H01R12/00

CPC classification number: H05K1/0281 ,  H05K2201/09263 ,  H05K2201/09781 ,  H05K2201/09909 ,  H05K2201/2009

Abstract: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

Abstract translation: 柔性印刷电路板包括柔性基座，工作迹线区域和至少一个加强迹线。 工作轨迹区域和至少一个加强迹线形成在柔性基座上。 工作痕迹由多条工作痕迹组成。 在柔性基座中，至少一个加强迹线设置在工作轨迹区域的周边。