公开(公告)号：US20160297921A1

公开(公告)日：2016-10-13

申请号：US14777910

申请日：2014-03-19

Applicant: ZEON CORPORATION

Inventor： Natsuko Shindo ,  Makoto Fujimura

IPC: C08G59/42 ,  H05K1/03 ,  C08J5/24 ,  C08L63/08 ,  C08G59/38 ,  C08J5/18

CPC classification number: C08G59/42 ,  B32B27/38 ,  C08G59/38 ,  C08J5/18 ,  C08J5/24 ,  C08J2363/08 ,  C08L63/08 ,  C08L2203/20 ,  H05K1/0326 ,  H05K1/0353 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/46 ,  H05K2201/0145

Abstract: A curable epoxy composition comprising a polyvalent epoxy compound (A) which has a condensed polycyclic structure and/or biphenyl structure, an aromatic and/or alicyclic polyvalent glycidyl ester compound (B), and an active ester compound (C) is provided. According to the present invention, a curable epoxy composition which can form an electrical insulating layer which is excellent in desmearing ability, electrical characteristics, and heat resistance can be provided.

Abstract translation: 提供了包含具有缩合多环结构和/或联苯结构的多价环氧化合物（A），芳族和/或脂环族多价缩水甘油酯化合物（B）和活性酯化合物（C）的可固化环氧组合物。 根据本发明，可以提供一种可以形成具有优异的除尘能力，电特性和耐热性的电绝缘层的可固化环氧组合物。

公开(公告)号：US09445502B2

公开(公告)日：2016-09-13

申请号：US13968347

申请日：2013-08-15

Applicant: NANCHANG O-FILM TECH CO., LTD. ,  SUZHOU O-FILM TECH CO., LTD. ,  SHENZHEN O-FILM TECH CO., LTD.

Inventor： Sheng Zhang ,  Ying Gu ,  Shengbo Guo ,  Peiting Ma ,  Yunliang Yang

IPC: H01R12/77 ,  H05K1/11 ,  H05K3/10

CPC classification number: H05K1/118 ,  H05K3/107 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0376

Abstract: A flexible circuit connecting device is disclosed, including a base layer having a first surface and a second surface, and conductive traces having a grid-like structure and formed on the first surface and/or the second surface. The conductive traces of the above flexible circuit connecting device are nearly aligned with the base layer, and thus the probability of damage under a stress is reduced. Designed to be a grid-like structure, the conductive traces become more transparent, while satisfying a function of a connector. Besides, the above flexible circuit connecting device has a high density circuit trace, so that the size of the connector can be reduced and the interior space of the electronic components can be saved. In a manufacture process of the above flexible circuit connecting device, the manufacture process can be simplified, manufacture efficiency and production yield can be improved, and manufacture cost can be efficiently reduced.

Abstract translation: 公开了一种柔性电路连接装置，包括具有第一表面和第二表面的基底层和形成在第一表面和/或第二表面上的格栅状结构的导电迹线。 上述柔性电路连接装置的导电迹线几乎与基层对准，因此在应力下的损伤概率降低。 设计成栅格状结构，导电迹线变得更加透明，同时满足连接器的功能。 此外，上述柔性电路连接装置具有高密度电路迹线，从而可以减小连接器的尺寸，并且可以节省电子部件的内部空间。 在上述柔性电路连接装置的制造过程中，可以简化制造工艺，可以提高制造效率和生产成品率，并且可以有效地降低制造成本。

公开(公告)号：US20160244471A1

公开(公告)日：2016-08-25

申请号：US15027369

申请日：2014-06-13

Applicant: Shengyi Technology Co., Ltd.

Inventor： Yueshan HE

IPC: C07F9/6581 ,  C08L79/02 ,  C08L75/00 ,  H05K1/03 ,  C08L63/08 ,  C08J5/24 ,  C08J5/04 ,  C09K21/14 ,  C08G59/30 ,  C08L71/00

CPC classification number: C07F9/65812 ,  C07F9/65815 ,  C08G59/304 ,  C08J5/043 ,  C08J5/24 ,  C08J2363/00 ,  C08J2363/08 ,  C08J2371/00 ,  C08J2375/00 ,  C08J2379/00 ,  C08J2379/02 ,  C08J2435/06 ,  C08J2463/08 ,  C08K5/5399 ,  C08L63/08 ,  C08L71/00 ,  C08L75/00 ,  C08L79/02 ,  C08L2201/02 ,  C08L2201/22 ,  C08L2203/20 ,  C08L2205/03 ,  C09K21/12 ,  C09K21/14 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209

Abstract: The present invention discloses a phenoxycyclotriphosphazene active ester, a halogen-free resin composition and uses thereof. The phenoxycyclotriphosphazene active ester comprises at least 65 mol. % of a substance having the following structural formula. The halogen-free resin composition comprises 5-50 parts by weight of a phenoxycyclotriphosphazene active ester, 15-85 parts by weight of a thermosetting resin, 1-35 parts by weight of a curing agent, 0-5 parts by weight of a curing accelerator and 0-100 parts by weight of an inorganic filler. The present invention discloses introducing phenoxycyclotriphosphazene active ester into a thermosetting resin, reacting active esters with thermosetting resins, such as epoxy resin, without producing hydroxy groups, which not only satisfies the requirements on being halogen-free and flame retardancy, but also improves the electrical properties (decreasing and stabilizing Dk and Df) of the system, so as to make non-halogenation of high frequency and high speed substrate materials possible.

Abstract translation: 本发明公开了一种苯氧基环三磷腈活性酯，一种无卤树脂组合物及其应用。 苯氧基环三磷腈活性酯包含至少65mol。 ％具有以下结构式的物质。 无卤素树脂组合物包含5-50重量份苯氧基环三磷腈活性酯，15-85重量份热固性树脂，1-35重量份固化剂，0-5重量份固化剂 促进剂和0-100重量份的无机填料。 本发明公开了将苯氧基环三磷腈活性酯引入热固性树脂中，使活性酯与环氧树脂等热固性树脂反应而不产生羟基，不仅满足无卤素和阻燃性的要求，而且改善了电 性能（降低和稳定Dk和Df），从而使高频和高速基板材料的非卤化成为可能。

公开(公告)号：US20160174390A1

公开(公告)日：2016-06-16

申请号：US15052885

申请日：2016-02-25

Applicant: Subtron Technology Co., Ltd.

Inventor： Chao-Min Wang

IPC: H05K3/46 ,  H05K1/02 ,  H05K3/06 ,  H05K1/09

CPC classification number: H01L23/49822 ,  H01L21/4857 ,  H01L21/6835 ,  H01L23/13 ,  H01L23/49838 ,  H01L23/49866 ,  H01L2221/68345 ,  H01L2221/68381 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/09 ,  H05K3/0058 ,  H05K3/0061 ,  H05K3/048 ,  H05K3/06 ,  H05K3/064 ,  H05K3/14 ,  H05K3/4652 ,  H05K3/4682 ,  H05K2201/0145 ,  H05K2203/0152 ,  H05K2203/0502 ,  H05K2203/0548 ,  H05K2203/066

Abstract: A substrate structure includes a dielectric layer, a metal foil, a patterned metal layer, a first patterned solder-resist layer and a second patterned solder-resist layer. The dielectric layer includes a first surface and a second surface, and the first surface has a plurality of recesses. The metal foil is disposed on the second surface. The patterned metal layer is disposed on the first surface, the patterned metal layer has a plurality of openings, and the openings are respectively corresponding to and expose the recesses. The first patterned solder-resist layer is filled in each of the recesses and corresponding to each of the openings. A top surface of the first patterned solder-resist layer is substantially coplanar with a top surface of the patterned metal layer. The second patterned solder-resist layer is disposed on the first patterned solder-resist layer and in the openings, and covers a portion of the patterned metal layer.

Abstract translation: 基板结构包括电介质层，金属箔，图案化金属层，第一图案化阻焊层和第二图案化阻焊层。 电介质层包括第一表面和第二表面，并且第一表面具有多个凹部。 金属箔设置在第二表面上。 图案化金属层设置在第一表面上，图案化金属层具有多个开口，并且开口分别对应于并露出凹部。 第一图案化阻焊层填充在每个凹部中并对应于每个开口。 第一图案化阻焊层的顶表面与图案化金属层的顶表面基本共面。 第二图案化阻焊层设置在第一图案化阻焊层和开口中，并且覆盖图案化金属层的一部分。

公开(公告)号：US20160174364A1

公开(公告)日：2016-06-16

申请号：US14970479

申请日：2015-12-15

Applicant: Amphenol Corporation

Inventor： Arthur E. Harkness, JR. ,  Eva M. Kenny-McDermott ,  Paul W. Farineau ,  Raymond A. Lavallee ,  Michael Fancher

IPC: H05K1/02 ,  H05K1/09 ,  H05K3/38 ,  H05K3/46 ,  H05K3/00 ,  H05K3/22 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K3/4632 ,  H05K1/0242 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/111 ,  H05K1/115 ,  H05K1/116 ,  H05K3/0073 ,  H05K3/202 ,  H05K3/22 ,  H05K3/38 ,  H05K3/382 ,  H05K3/383 ,  H05K3/384 ,  H05K3/385 ,  H05K3/388 ,  H05K3/389 ,  H05K3/4658 ,  H05K3/4685 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2203/1194

Abstract: High-speed interconnects for printed circuit boards and methods for forming the high-speed interconnects are described. A high-speed interconnect may comprise a region of a conductive film having a reduced surface roughness and one or more regions that have been treated for improved bonding with an adjacent insulating layer. Regions of reduced roughness may be used to carry high data rate signals within PCBs. Regions treated for bonding may include a roughened surface, adhesion-promoting chemical treatment, and/or material deposited to improve wettability of the surface and/or adhesion to a cured insulator.

Abstract translation: 描述了用于印刷电路板的高速互连以及用于形成高速互连的方法。 高速互连可以包括具有减小的表面粗糙度的导电膜的区域和已经被处理以改善与相邻绝缘层的接合的一个或多个区域。 粗糙度降低的区域可用于在PCB内携带高数据速率信号。 用于粘合处理的区域可以包括粗糙表面，促进粘附的化学处理和/或沉积以提高表面的润湿性和/或对固化的绝缘体的粘附的材料。

公开(公告)号：US20160134327A1

公开(公告)日：2016-05-12

申请号：US14538219

申请日：2014-11-11

Applicant: UT-Battelle, LLC

Inventor： Pooran C. JOSHI ,  Stephen M. KILLOUGH ,  Phani Teja KURUGANTI

IPC: H04B1/707 ,  H05K3/12 ,  H05K3/32 ,  H04L27/20 ,  H05K3/30

CPC classification number: H04B1/707 ,  H04L23/02 ,  H05K1/097 ,  H05K1/118 ,  H05K1/165 ,  H05K3/125 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/09263 ,  H05K2201/10098

Abstract: A wireless sensor platform and methods of manufacture are provided. The platform involves providing a plurality of wireless sensors, where each of the sensors is fabricated on flexible substrates using printing techniques and low temperature curing. Each of the sensors can include planar sensor elements and planar antennas defined using the printing and curing. Further, each of the sensors can include a communications system configured to encode the data from the sensors into a spread spectrum code sequence that is transmitted to a central computer(s) for use in monitoring an area associated with the sensors.

Abstract translation: 提供无线传感器平台和制造方法。 该平台涉及提供多个无线传感器，其中每个传感器使用印刷技术和低温固化在柔性基板上制造。 每个传感器可以包括使用印刷和固化限定的平面传感器元件和平面天线。 此外，每个传感器可以包括被配置为将来自传感器的数据编码为扩展频谱代码序列的通信系统，该扩展频谱码序列被发送到中央计算机以用于监视与传感器相关联的区域。

公开(公告)号：US09338891B2

公开(公告)日：2016-05-10

申请号：US14713064

申请日：2015-05-15

Applicant: IBIDEN CO., LTD.

Inventor： Toyotaka Shimabe ,  Ryuichiro Tominaga

IPC: H05K1/18 ,  H05K1/03 ,  H05K1/11 ,  H05K1/02

CPC classification number: H05K1/183 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/3511 ,  H05K1/0298 ,  H05K1/0313 ,  H05K1/115 ,  H05K1/185 ,  H05K3/4602 ,  H05K2201/0145 ,  H05K2201/09854 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10219 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  H01L2924/00

Abstract: A printed wiring board includes a core substrate having a cavity, multiple electronic components accommodated in the cavity, and a build-up layer formed on the substrate and including an insulating interlayer such that the interlayer is covering the cavity. The components include a first component, second component and third component, the core substrate has a first projection structure partitioning the first and second components in the cavity and a second projection structure partitioning the second and third components in the cavity, and the cavity and the first and second structures are formed in the substrate such that T1

Abstract translation: 印刷电路板包括具有空腔的芯基板，容纳在空腔中的多个电子元件，以及形成在基板上并包括绝缘夹层的堆积层，使得中间层覆盖空腔。 所述部件包括第一部件，第二部件和第三部件，所述芯基板具有分隔所述空腔中的所述第一和第二部件的第一突起结构以及将所述腔体中的第二和第三部件分隔开的第二突起结构， 在基板上形成第一和第二结构，使得T1

公开(公告)号：US20160128182A1

公开(公告)日：2016-05-05

申请号：US14930866

申请日：2015-11-03

Applicant: SAMSUNG ELECTRONICS CO., LTD. ,  RESEARCH & BUSINESS FOUNDATION SUNGKYUNKWAN UNIVERSITY

Inventor： Kyung-wan PARK ,  Shi-yun CHO ,  Hyo-young LEE ,  Hyun-jung KIM ,  Mee-ree KIM ,  Ik-joon KIM

IPC: H05K1/02 ,  H05K1/09 ,  C08J7/06 ,  H05K3/46 ,  C08J5/12 ,  H05K1/03 ,  H05K1/11

CPC classification number: H05K1/0283 ,  B32B3/08 ,  B32B7/045 ,  B32B27/08 ,  B32B27/281 ,  B32B27/283 ,  B32B27/32 ,  B32B27/34 ,  B32B27/36 ,  B32B27/365 ,  B32B27/40 ,  B32B2250/24 ,  B32B2255/10 ,  B32B2255/24 ,  B32B2262/103 ,  B32B2270/00 ,  B32B2307/202 ,  B32B2307/51 ,  B32B2307/546 ,  B32B2457/08 ,  H05K1/097 ,  H05K3/389 ,  H05K2201/0133 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0162 ,  H05K2201/026

Abstract: A flexible printed circuit board (PCB) has stretchability and durability. The flexible PCB includes: a first polymer substrate having flexibility, stretchability, or elasticity; a second polymer substrate having flexibility, stretchability, or elasticity; a conductive track disposed between the first and second polymer substrates and including metal nanowires; and a cured silane coupling agent which bonds the conductive track to at least one of the first and second polymer substrates.

Abstract translation: 柔性印刷电路板（PCB）具有拉伸性和耐久性。 柔性PCB包括：具有柔软性，拉伸性或弹性的第一聚合物基材; 具有柔软性，拉伸性或弹性的第二聚合物基材; 导电轨道，设置在所述第一和第二聚合物基底之间并且包括金属纳米线; 以及固化的硅烷偶联剂，其将导电轨道结合到第一和第二聚合物基底中的至少一个。

公开(公告)号：US20160062242A1

公开(公告)日：2016-03-03

申请号：US14888244

申请日：2014-04-15

Applicant: JSR CORPORATION

Inventor： Hitoshi HAMAGUCHI ,  Kenrou TANAKA ,  Kenzou OOKITA ,  Keisuke KURIYAMA

IPC: G03F7/38 ,  H05K1/02 ,  G03F7/039 ,  H05K3/28 ,  G03F7/16 ,  G03F7/20

CPC classification number: G03F7/38 ,  G03F7/0046 ,  G03F7/039 ,  G03F7/0392 ,  G03F7/16 ,  G03F7/20 ,  G03F7/36 ,  H05K1/0296 ,  H05K3/107 ,  H05K3/1208 ,  H05K3/287 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0166

Abstract: Provided is a method for manufacturing a substrate having a concave pattern to be used for forming a high-definition pattern while suppressing wet-spreading and bleeding of a film-forming ink, provided is a composition to be used for manufacturing the substrate, and provided are a method for forming a conductive film, an electronic circuit, and an electronic device.The method for manufacturing a substrate having a concave pattern includes: (i) a step of applying, on a substrate 1, a composition containing a polymer having an acid-dissociable group and an acid generator to form a coating film 2 and (ii) a step of irradiating a predetermined portion of the coating film 2 with radiation. The method for forming a conductive film includes applying a conductive film-forming ink on the concave pattern formed in the exposed portion of the coating film 2 and heating the ink to form a pattern 6. The electronic circuit and the electronic device are provided by using the method for forming a conductive film.

Abstract translation: 提供一种用于制造用于形成高清晰度图案的凹形图案的基板的方法，同时抑制成膜油墨的湿扩展和渗色，提供用于制造基板的组合物，并且提供 是形成导电膜，电子电路和电子器件的方法。 具有凹形图案的基板的制造方法包括：（i）在基板1上涂布含有具有酸解离基的聚合物和酸发生剂的组合物以形成涂膜2的步骤，（ii） 用辐射照射涂膜2的预定部分的步骤。 形成导电膜的方法包括在形成在涂膜2的暴露部分中的凹形图案上涂覆导电膜形成油墨并加热油墨以形成图案6.电子电路和电子设备通过使用 形成导电膜的方法。

公开(公告)号：US20160044778A1

公开(公告)日：2016-02-11

申请号：US14780529

申请日：2014-03-03

Applicant: KANEKA CORPORATION

Inventor： Tooru Irie ,  Takahisa Fujimoto ,  Takashi Kuchiyama ,  Hironori Hayakawa ,  Shinya Omoto ,  Kenji Yamamoto

IPC: H05K1/02 ,  H05K3/22 ,  H05K3/06 ,  H05K3/00 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K1/0274 ,  G06F3/044 ,  G06F2203/04103 ,  G06F2203/04112 ,  H05K1/0296 ,  H05K1/0326 ,  H05K1/09 ,  H05K3/0064 ,  H05K3/06 ,  H05K3/067 ,  H05K3/108 ,  H05K3/227 ,  H05K3/388 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0317 ,  H05K2201/09663 ,  H05K2201/0979

Abstract: Provided is a transparent conductive film including a transparent electrode layer composed of a patterned thin metal wire on at least one surface of a transparent film substrate. The line width of the wire is 5 μm or less. The wire includes a first metal layer and a second metal layer that is in contact with the first metal layer, in this order from a transparent film substrate side. Both of the first and second metal layers contain copper in an amount of 90% by weight or more. The total film thickness of the first and second metal layers is 150 to 1000 nm. The diffraction angle 2θ of the (111) plane of the second metal layer is less than 43.400° as measured using a CuKα ray as an X-ray source, and the first metal layer has crystal properties different from those of the second metal layer.

Abstract translation: 提供一种透明导电膜，其包括在透明膜基板的至少一个表面上由图案化的金属细线构成的透明电极层。 线的线宽为5μm以下。 导线包括从透明膜基板一侧依次与第一金属层接触的第一金属层和第二金属层。 第一和第二金属层都含有90重量％以上的铜。 第一和第二金属层的总膜厚度为150〜1000nm。 衍射角2＆thetas; 使用CuKα射线作为X射线源测定的第二金属层的（111）面的面积小于43.400°，第一金属层的结晶特性与第二金属层的晶体性质不同。