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    Formation of narrow conductive paths on a substrate
    111.
    发明授权
    Formation of narrow conductive paths on a substrate 失效
    在基板上形成窄导电路径

    公开(公告)号：US4519877A

    公开(公告)日：1985-05-28

    申请号：US665535

    申请日：1984-10-26

    Applicant: Raymond E. Wiech, Jr.

    Inventor： Raymond E. Wiech, Jr.

    IPC: H05K1/03 ,  H05K1/09 ,  H05K3/04 ,  H05K3/06 ,  H05K3/07 ,  H05K3/10 ,  H05K3/12 ,  C25D5/02 ,  C25D5/48 ,  C25D5/50

    CPC classification number: H05K3/1258 ,  H05K3/045 ,  H05K3/07 ,  H05K3/107 ,  H05K1/0306 ,  H05K1/092 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/098 ,  H05K2201/09863 ,  H05K2201/2072 ,  H05K2203/0353 ,  H05K3/06 ,  H05K3/108

    Abstract: A method of forming electrically conductive paths within grooves formed in a substrate wherein the width of the grooves is of the same order of magnitude as the thickness of an electrically conductive layer deposited on the substrate and in the grooves. The substrate with grooves therein is exposed to a medium whereby electrically conductive material from the medium deposits substantially uniformly on all surfaces of the substrate which are exposed to the medium. In this way, the build-up of conductive material in grooves will take place along the side walls as well as the bottom of the grooves. If the layer is of substantially the same order of magnitude as the width of the groove (about one half the groove width or greater), the grooves will fill up with conductive material. The remainder of the substrate will ultimately provide a substantially flat conductive layer on the substrate surface. The conductive material is then removed by an action which removes exposed conductor along the entire substrate surface at a uniform rate whereby the conductor will be substantially entirely removed from the substrate except for the portion thereof within the grooves. In this way an electrically conductive path of predetermined geometry is provided.

    Abstract translation: 在衬底中形成的沟槽内形成导电路径的方法，其中沟槽的宽度与沉积在衬底和凹槽中的导电层的厚度相同数量级。 其中具有凹槽的衬底暴露于介质，由此来自介质的导电材料基本均匀地沉积在暴露于介质的衬底的所有表面上。 以这种方式，导电材料在槽中的积聚将沿着侧壁以及凹槽的底部发生。 如果该层与凹槽的宽度（槽宽度的大约一半）大致相同的数量级，则凹槽将填充导电材料。 衬底的其余部分将最终在衬底表面上提供基本平坦的导电层。 然后通过以均匀速率沿着整个基板表面去除暴露的导体的动作去除导电材料，由此导体将基本上完全从衬底除去，除了其中的凹槽内的部分。 以这种方式提供预定几何形状的导电路径。

    Molded circuit board substrate
    112.
    发明授权
    Molded circuit board substrate 失效
    模压电路板基板

    公开(公告)号：US4080513A

    公开(公告)日：1978-03-21

    申请号：US628086

    申请日：1975-11-03

    Applicant: Edward A. Cuneo ,  Makoto Kato ,  Michael S. Wilson ,  Aaron L. Pinkerton

    Inventor： Edward A. Cuneo ,  Makoto Kato ,  Michael S. Wilson ,  Aaron L. Pinkerton

    IPC: H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  H05K3/18 ,  H05K3/38 ,  H05K1/00

    CPC classification number: H05K3/107 ,  H05K3/381 ,  H05K1/0373 ,  H05K2201/012 ,  H05K2201/0209 ,  H05K2201/0376 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2203/0565 ,  H05K3/002 ,  H05K3/108 ,  H05K3/181 ,  H05K3/184

    Abstract: The present invention is directed to a method of preparing a substrate to improve the adherence of a metallic coating to the substrate and the product thereof. More particularly, a method of manufactiring a molded circuit board and unique circuit board produced thereby, is disclosed. A molding compound, such as an epoxy resin is blended with a plating additive, such as calcium carbonate that is relatively inert to the molding compound. The blended mix can then be molded into a desired shape which, for a printed circuit board, can be a relatively flat plate configuration with a recessed groove and hole formation pattern. The high relief areas of the circuit board can be masked with a protective material. The plating additive can then be chemically etched from the grooved recessed area and holes, for example, by a hydrochloric acid bath. Appropriate catalyst and accelerators can be applied to the recessed groove pattern before the protective mask material is removed. In one embodiment, an electroless plating nickel material can be deposited to permit it to penetrate the interstices or cavity pattern, left in the recessed groove and hole pattern by the etching of the plating additive. Copper can then be applied to the nickel pattern in the recessed grooves, for example, by dipping the substrate in an electroless plating copper solution. The substrate is heated to cure the epoxy resin for mechanically locking the metallic coating in the interstices, or cavities, left by the etching of the plating additive.

    Abstract translation: 本发明涉及一种制备基材以改善金属涂层对基材及其产品的粘附性的方法。 更具体地，公开了一种制造模制电路板的方法和由此制造的独特的电路板。 将诸如环氧树脂的模塑料与对模塑料相对惰性的电镀添加剂如碳酸钙混合。 然后将混合的混合物模制成所需的形状，对于印刷电路板，其可以是具有凹槽和孔形成图案的相对平坦的板构造。 电路板的高浮雕区域可以用保护材料掩蔽。 然后可以从凹槽凹槽区域和孔中化学蚀刻电镀添加剂，例如通过盐酸浴。 在保护掩模材料被去除之前，可以将合适的催化剂和促进剂施加到凹槽图案。 在一个实施例中，可以沉积化学镀镍材料，以允许其通过蚀刻电镀添加剂来渗透留在凹槽中的间隙或空腔图案。 然后可以通过将衬底浸入无电镀铜溶液中来将铜施加到凹槽中的镍图案上。 加热衬底以固化环氧树脂，用于通过蚀刻电镀添加剂将金属涂层机械地锁定在间隙或空腔中。

    Dielectric circuit board bonding
    113.
    发明授权
    Dielectric circuit board bonding 失效
    介质电路板接合

    公开(公告)号：US3972755A

    公开(公告)日：1976-08-03

    申请号：US518314

    申请日：1974-10-29

    Applicant: Charles C. Misfeldt

    Inventor： Charles C. Misfeldt

    IPC: H01P11/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/06 ,  H05K3/10 ,  H05K3/38 ,  H05K3/46 ,  C23F1/02 ,  B29D3/00 ,  C09J5/00

    CPC classification number: H05K3/4614 ,  H01P11/003 ,  H05K3/107 ,  H05K3/386 ,  H05K1/0237 ,  H05K1/036 ,  H05K2201/015 ,  H05K2201/0158 ,  H05K2201/0355 ,  H05K2201/0376 ,  H05K2201/0715 ,  H05K2203/0278 ,  H05K3/06

    Abstract: A method and apparatus is disclosed for bonding of dielectric circuit boa for microwave use, the bonding together of several circuit boards to form subassemblies and the bonding of subassemblies together. The finished circuit may include a bonded-in ground plate of copper wire cloth or the like and may include through-plate holes. The technique includes the build-up of thin films to provide strength, toughness and dimensional accuracy. Orthogonal positioning of directional stresses and cooling under pressure have a stabilizing effect. The bonding of copper or other conductive sheet or foil to the substrate is done without the use of a copper oxide or other coating and using only heat and pressure. An etched circuit in the copper sheet or foil, for example, is made flush with the finished surface of the board in the process. A normal bonding cycle comprises (1) loading the parts to be bonded in a confining mold, (2) placing a conforming mold plate within the mold and closing the parts in a press, (3) pressing for a predetermined time at a predetermined elevated temperature and (4) shock cooling the material before removing pressure from the mold.

    Abstract translation: 公开了用于结合微波用介质电路板的方法和装置，将几个电路板结合在一起以形成子组件并将子组件结合在一起。 完成的电路可以包括铜线布等的接合接地板，并且可以包括穿孔孔。 该技术包括建立薄膜以提供强度，韧性和尺寸精度。 定向应力的正交定位和压力下的冷却具有稳定的作用。 在不使用氧化铜或其它涂层并且仅使用热和压力的情况下，将铜或其它导电片或箔与基底的结合完成。 例如，铜片或箔片中的蚀刻电路在该过程中与板的成品表面齐平。 正常的结合循环包括（1）将待粘合的部件装载在限定模具中，（2）将合适的模板放置在模具内并在压力机中关闭零件，（3）在预定的高度压制预定时间 温度和（4）冲击冷却材料，然后从模具中取出压力。

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