公开(公告)号：US20160242295A1

公开(公告)日：2016-08-18

申请号：US14862549

申请日：2015-09-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dong-Ho KIM

IPC: H05K1/18 ,  H01L27/32 ,  H05K1/11 ,  H01L51/52 ,  H05K1/14

CPC classification number: H05K1/189 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/147 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10128 ,  Y02P70/611

Abstract: A display device including a flexible circuit board including an insulation film, the insulation film including an input pad part and an output pad part on a first side thereof; a printed circuit board including a first pad part, the first pad part being connected to the input pad part; and a display panel including a second pad part, the second pad part being connected to the output pad part, wherein the input pad part includes a plurality of input pads that are arranged in at least two pad columns, and the flexible circuit board includes a plurality of dummy layers aligned with the plurality of input pads on a second side of the insulation film, the second side being an opposite side to the first side.

Abstract translation: 一种显示装置，包括：包括绝缘膜的柔性电路板，所述绝缘膜包括输入焊盘部分和在其第一侧上的输出焊盘部分; 印刷电路板，包括第一焊盘部分，所述第一焊盘部分连接到所述输入焊盘部分; 以及包括第二焊盘部分的显示面板，所述第二焊盘部分连接到所述输出焊盘部分，其中所述输入焊盘部分包括布置在至少两个焊盘列中的多个输入焊盘，并且所述柔性电路板包括： 多个虚设层与绝缘膜的第二侧上的多个输入焊盘对准，第二侧与第一侧相反。

公开(公告)号：US20160204532A1

公开(公告)日：2016-07-14

申请号：US14915826

申请日：2014-09-04

Applicant: FUJIKURA LTD. ,  DDK LTD.

Inventor： Yuki ISHIDA ,  Masayuki SUZUKI ,  Yuki NAKANO ,  Harunori URAI ,  Norifumi NAGAE

IPC: H01R12/73 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/732 ,  H01R12/592 ,  H01R12/77 ,  H01R12/772 ,  H01R12/88 ,  H05K1/028 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09709

Abstract: A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The wirings (9, 11) are disposed at the other surface side of the base substrate (3). The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the one surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the pads (15a).

Abstract translation: 印刷电路板（1）包括：基底（3）; 多个用于电连接的焊盘（15a，17a），其设置在所述基底基板（3）的一个表面侧和连接端部（13）处以与另一个电子部件（50）连接; 与焊盘（15a，17a）连接的布线（9,11）; 以及形成在连接端部（13）的侧边缘部分处并且沿着断开方向与另一个电子部件（50）的接合部分（58）接合的可接合部分（28,29）。 布线（9,11）设置在基底（3）的另一个表面侧。 柔性印刷电路板（1）还包括加强层（31,32），其被设置在基底基板（3）的一个表面侧，并且当观察时相对于可接合部分（28,29）在前侧 在与其他电子部件连接的方向上，与焊盘（15a）一体地形成。

公开(公告)号：US20160156114A1

公开(公告)日：2016-06-02

申请号：US14946807

申请日：2015-11-20

Applicant: Advanced-Connectek Inc.

Inventor： Ya-Fen KAO ,  Yu-Lun TSAI ,  Pin-Yuan HOU ,  Chung-Fu LIAO ,  Yang-Yang ZHOU

IPC: H01R12/57 ,  H05K1/11

CPC classification number: H05K1/111 ,  H01R12/724 ,  H01R12/725 ,  H01R24/60 ,  H05K1/115 ,  H05K1/117 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/10295 ,  H05K2201/1034

Abstract: An electrical plug connector assembly has an insulative housing, a first terminal set, a second terminal set and a circuit board. The first and second terminal sets are mounted in the insulative housing. The first terminal set has multiple first conductive terminals each including a first soldering section. The second terminal set has multiple second conductive terminals each including a second soldering section. The first and second soldering sections are soldered on an identical surface of the circuit board such that only one single soldering process is required to solder all of the first and second conductive terminals to the circuit board. The production rate of the electrical plug connector assembly is therefore improved.

Abstract translation: 电插头连接器组件具有绝缘壳体，第一端子组，第二端子组和电路板。 第一和第二端子组安装在绝缘壳体中。 第一端子组具有多个第一导电端子，每个包括第一焊接部分。 第二端子组具有多个第二导电端子，每个第二导电端子包括第二焊接部分。 第一和第二焊接部分焊接在电路板的相同表面上，使得仅需要一个单一焊接工艺来将所有第一和第二导电端子焊接到电路板。 因此，电插头连接器组件的生产率得到改善。

公开(公告)号：US09306334B2

公开(公告)日：2016-04-05

申请号：US14287573

申请日：2014-05-27

Applicant: HON HAI PRECISION INDUSTRY CO., LTD.

Inventor： Jian-Jun Zhu ,  Jerry Wu

IPC: H01R3/00 ,  H01R13/6471 ,  H05K1/02 ,  H01R9/03 ,  H01R13/6585 ,  H05K1/11

CPC classification number: H01R13/6471 ,  H01R9/034 ,  H01R13/6585 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/09336 ,  H05K2201/09409 ,  H05K2201/10356

Abstract: A plug connector (100) includes a shell (10) and a printed circuit board (20) received in the shell. The printed circuit board includes a grounding layer (22), a conductive layer (21) disposed at a first side of the grounding layer, and an insulative layer (23) disposed therebetween. The conductive layer includes a pair of grounding traces (210), and a signal channel disposed between and isolated with the grounding traces. The signal channel includes a signal mating portion (221) disposed at a front portion. Each of the grounding traces includes a grounding mating portion (211) disposed at a front portion. Each of the grounding mating portions has a front end extending beyond the signal mating portion. The printed circuit board includes a pair of connecting traces (214). Each of the front ends of the grounding mating portions directly connects with the grounding layer by corresponding one of the connecting traces.

Abstract translation: 插头连接器（100）包括壳体（10）和容纳在外壳中的印刷电路板（20）。 印刷电路板包括接地层（22），设置在接地层的第一侧的导电层（21）和设置在其间的绝缘层（23）。 导电层包括一对接地迹线（210），以及设置在接地迹线之间并与接地迹线隔离的信号通道。 信号通道包括设置在前部的信号配合部分（221）。 每个接地迹线包括设置在前部的接地配合部分（211）。 每个接地配合部分具有延伸超过信号配合部分的前端。 印刷电路板包括一对连接迹线（214）。 接地配合部分的每个前端通过相应的一个连接迹线与接地层直接连接。

公开(公告)号：US20160050745A1

公开(公告)日：2016-02-18

申请号：US14460357

申请日：2014-08-15

Applicant: HTC Corporation

Inventor： Hsin-Chih Liu ,  Ying-Yen Cheng ,  Yu-Jing Liao

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/118 ,  H05K1/095 ,  H05K1/11 ,  H05K1/147 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/058 ,  H05K2201/09409

Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.

Abstract translation: 电子组件包括电子模块，刚性板，第一柔性板，第二柔性板和导电粘合剂层。 第一柔性板从电子模块延伸，并且在第一连接端具有第一连接端和第一焊盘装置。 第一垫排列具有多个第一垫。 第二柔性板连接到刚性板，并且在第二连接端具有第二连接端和第二垫布置。 第二垫布置具有多个第二垫。 第一焊盘通过导电粘合剂层在结构上和电连接到第二焊盘。

公开(公告)号：US09257763B2

公开(公告)日：2016-02-09

申请号：US13933145

申请日：2013-07-02

Applicant: GYRUS ACMI, INC.

Inventor： Shai Finkman ,  Adi Navve

IPC: H05K7/10 ,  H05K7/12 ,  H01R12/71 ,  H01L23/00 ,  H01L27/146 ,  A61B1/00 ,  H05K1/11 ,  H05K3/36

CPC classification number: H01R12/712 ,  A61B1/00124 ,  A61B1/00131 ,  A61B1/051 ,  H01L24/81 ,  H01L27/1469 ,  H01R12/718 ,  H04N2005/2255 ,  H05K1/117 ,  H05K3/368 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/10151 ,  H05K2203/041 ,  H05K2203/049

Abstract: A connector for connection to terminals of an integrated circuit. The connector consists of a dielectric substrate having a first side and a second side. The connector has wire bond terminals which are attached to the first side of the substrate and configured to receive wire bonds connected to a first set of the terminals of the integrated circuit. The connector also has solder bump terminals, attached to the second side of the substrate so as to be insulated from the wire bond terminals, the solder bump terminals being configured to be coupled via solder balls with a second set of the terminals of the integrated circuit.

Abstract translation: 用于连接到集成电路的端子的连接器。 连接器由具有第一侧和第二侧的电介质基底构成。 连接器具有连接到基板的第一侧并且被配置为接收连接到集成电路的第一组端子的引线键合的引线接合端子。 连接器还具有焊料凸块端子，附接到基板的第二面以与引线接合端子绝缘，焊料凸块端子被配置为通过焊球与集成电路的第二组端子耦合 。

公开(公告)号：US09257354B2

公开(公告)日：2016-02-09

申请号：US13655802

申请日：2012-10-19

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Hiroshi Shimizu ,  Yasuyuki Kimura ,  Tadashi Arai

IPC: H01L33/62 ,  H01L23/14 ,  H01L25/075 ,  H01L23/498 ,  H01L23/00 ,  H01L33/60

CPC classification number: H01L23/142 ,  H01L23/49894 ,  H01L23/562 ,  H01L24/45 ,  H01L25/0753 ,  H01L33/60 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48227 ,  H01L2924/01047 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/181 ,  H05K2201/09409 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A wiring substrate includes a substrate, a first insulating layer formed on the substrate, wiring patterns formed on a first surface of the first insulating layer, and a second insulating layer formed on the first surface of the first insulating layer. The second insulating layer covers the wiring patterns and includes a first opening that partially exposes adjacent wiring patterns as a pad. A projection is formed in an outer portion of the substrate located outward from where the first opening is arranged. The projection rises in a thickness direction of the substrate.

Abstract translation: 布线基板包括基板，形成在基板上的第一绝缘层，形成在第一绝缘层的第一表面上的布线图案和形成在第一绝缘层的第一表面上的第二绝缘层。 第二绝缘层覆盖布线图案，并且包括将相邻布线图案部分地暴露为垫的第一开口。 在位于布置第一开口的外侧的基板的外部形成突起。 突起在基板的厚度方向上升。

公开(公告)号：US09253877B2

公开(公告)日：2016-02-02

申请号：US14633342

申请日：2015-02-27

Applicant: Shinko Electric Industries Co., Ltd.

Inventor： Takashi Sato ,  Ruofan Tang

IPC: H01L23/544 ,  H01L23/12 ,  H05K1/02 ,  H01L23/498 ,  H05K1/11

CPC classification number: H05K1/0269 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/544 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/115 ,  H05K3/4682 ,  H05K2201/09409 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/09936 ,  H01L2924/00

Abstract: A wiring substrate includes wiring layers and insulation layers alternately stacked. Via holes are formed in the insulation layers. First via wirings are formed in the via holes to electrically connect the wiring layers to one another. Through holes extend through a lowermost one of the insulation layers in a thickness direction. The lowermost insulation layer covers a lowermost one of the wiring layers. Second via wirings are formed in the through holes to define an identification mark that is identifiable as a specific shape including a character, a symbol, or a combination thereof. A lower surface of each of the second via wirings is exposed from a lower surface of the lowermost insulation layer and is flush with a lower surface of the lowermost wiring layer.

Abstract translation: 布线基板包括交替堆叠的布线层和绝缘层。 在绝缘层中形成通孔。 首先通过布线形成通孔，以将布线层彼此电连接。 通孔在厚度方向上延伸穿过绝缘层中的最下面一个。 最下面的绝缘层覆盖最下面的一个布线层。 第二通孔布线形成在通孔中以形成可识别为包括字符，符号或其组合的特定形状的识别标记。 每个第二通孔布线的下表面从最下层绝缘层的下表面露出，并且与最下布线层的下表面齐平。

公开(公告)号：US20150354999A1

公开(公告)日：2015-12-10

申请号：US14299563

申请日：2014-06-09

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01D11/30

CPC classification number: G01R33/09 ,  G01D5/142 ,  G01D5/24442 ,  G01D11/305 ,  G01R33/0023 ,  G01R33/0047 ,  H01L43/02 ,  H01L43/08 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48245 ,  H01L2924/00014 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10151 ,  H05K2201/10522 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A sensor arrangement according to an embodiment includes a board with a plurality of conductive lines of a first type, and a plurality of conductive lines of a second type different from the conductive lines of the first type, and a recess. The sensor arrangement further includes a plurality of sensor devices mechanically accommodated on a main surface of the board and arranged around the recess, each sensor device being electrically coupled to the conductive lines of the first type and at least to one of the conductive lines of the second type, wherein each conductive line of the second type electrically couples a sensor device with at least one other item different from the sensor devices of the plurality of sensor devices. A projection of the conductive lines of the first and second types perpendicular to the main surface is crossing-free. Each conductive line of the first type electrically couples at least all of the plurality of sensor devices.

Abstract translation: 根据实施例的传感器装置包括具有第一类型的多条导电线的多个导线和与第一类型的导电线不同的第二类型的多条导线，以及一个凹部。 所述传感器装置还包括机械地容纳在所述板的主表面上并且布置在所述凹部周围的多个传感器装置，每个传感器装置电耦合到所述第一类型的导线和至少一个所述导线 第二类型，其中第二类型的每条导线将传感器装置与不同于多个传感器装置的传感器装置的至少一个其它物品电耦合。 垂直于主表面的第一和第二类型的导线的突出是无交叉的。 第一类型的每个导电线至少电连接多个传感器装置的全部。

公开(公告)号：US20150223323A1

公开(公告)日：2015-08-06

申请号：US14173106

申请日：2014-02-05

Applicant: Colin Patrick O'Flynn

Inventor： Colin Patrick O'Flynn

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0253 ,  H05K1/111 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09427 ,  Y02P70/611

Abstract: A PCB footprint consisting of a plurality of pads, positioned such that many different electronic components can be mounted which would otherwise require a custom circuit board. One or more of the leads can be connected via a low-impedance path to a ground plane, making a suitable platform for prototyping high-frequency designs.

Abstract translation: 由多个焊盘组成的PCB封装，定位成使得可以安装许多不同的电子部件，否则其将需要定制的电路板。 一个或多个引线可以通过低阻抗路径连接到接地平面，为高频设计的原型设计提供了一个合适的平台。