公开(公告)号：US20030168512A1

公开(公告)日：2003-09-11

申请号：US10339281

申请日：2003-01-09

Applicant: Hand Held Products, Inc.

Inventor： Andrew Longacre JR. ,  William H. Havens ,  Robert J. Hennick ,  Vivian L. Hunter ,  John Izzo ,  Michael D. Robinson

IPC: G06K007/10 ,  G06K007/14

CPC classification number: G06K7/10861 ,  G06K7/10584 ,  G06K7/10722 ,  G06K7/10801 ,  G06K7/14 ,  H05K1/18 ,  H05K3/244 ,  H05K2201/09072 ,  H05K2201/09463 ,  H05K2201/0949 ,  H05K2201/09645 ,  H05K2201/09809 ,  H05K2201/10121

Abstract: A one-dimensional optical reader which senses a position of a decodable symbol representation in captured image data and which utilizes the sensed position information to determine whether to launch a decoding algorithm to decode the symbol representation.

Abstract translation: 感测捕获的图像数据中的可解码符号表示的位置并且利用所感测的位置信息来确定是否启动解码算法以解码符号表示的一维光学读取器。

公开(公告)号：US06599617B2

公开(公告)日：2003-07-29

申请号：US09891841

申请日：2001-06-26

Applicant: Yoshinari Matsuda

Inventor： Yoshinari Matsuda

IPC: B32B300

CPC classification number: H05K3/4069 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/0949 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09981 ,  H05K2203/1453 ,  Y10T428/24917

Abstract: Copper foil lands provided with a through-hole filled with a copper paste are provided with ring-formed hollow portions in the periphery of the through-hole where exfoliation between the copper paste and the copper foil lands normally occurs to obtain a copper-plated through-hole in both sides of a printed wiring board using a paper-phenol substrate, wherein adhesion strength between the copper foil lands and the copper paste is enhanced.

Abstract translation: 设置有填充有铜膏的通孔的铜箔焊盘在通孔的周围设置有环形中空部分，其中铜膏和铜箔焊盘之间的剥离通常发生，以获得镀铜的通孔 在使用纸 - 酚基板的印刷线路板的两侧的孔中，铜箔焊盘和铜浆之间的粘合强度增强。

公开(公告)号：US20030072140A1

公开(公告)日：2003-04-17

申请号：US09977124

申请日：2001-10-12

Applicant: Intel Corporation

Inventor： Chee-Yee Chung ,  Robert L. Sankman ,  Alex Waizman

IPC: H05K007/06 ,  H05K003/30

CPC classification number: H05K1/167 ,  H01L23/50 ,  H01L23/647 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0231 ,  H05K1/095 ,  H05K1/115 ,  H05K3/429 ,  H05K2201/0317 ,  H05K2201/09309 ,  H05K2201/0949 ,  H05K2201/0979 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49155 ,  H01L2924/00

Abstract: A resistive element, a circuit board, and a circuit package, as well as a method of adding a resistive element to a circuit board are described. The resistive element includes a first contact point connected to a capacitor terminal, a second contact point connected to a circuit board plane, and resistive material connected to the first and second contact points. The invention may also include a circuit board with one or more resistive elements, as well as a circuit package, such as an integrated circuit or a discrete bypass capacitor, including one or more resistive elements, applied to an outside surface. The value of resistance for the resistive element can be selected by design to have a predetermined relationship with the equivalent resistance of an associated circuit board and connecting circuitry.

Abstract translation: 描述了电阻元件，电路板和电路封装以及将电阻元件添加到电路板的方法。 电阻元件包括连接到电容器端子的第一接触点，连接到电路板平面的第二接触点和连接到第一和第二接触点的电阻材料。 本发明还可以包括具有一个或多个电阻元件的电路板，以及包括施加到外表面的一个或多个电阻元件的电路封装，例如集成电路或分立旁路电容器。 可以通过设计来选择电阻元件的电阻值以与相关联的电路板和连接电路的等效电阻具有预定的关系。

公开(公告)号：US20030067074A1

公开(公告)日：2003-04-10

申请号：US09974947

申请日：2001-10-10

Inventor： Larry D. Kinsman

IPC: H01L023/52

CPC classification number: H05K1/115 ,  H01L23/49827 ,  H01L2924/0002 ,  H05K3/4602 ,  H05K2201/0949 ,  H05K2201/09609 ,  H05K2201/09836 ,  H05K2201/09945 ,  H01L2924/00

Abstract: The present invention is directed to an apparatus and method for connecting integrated circuits placed on opposite sides of a circuit board through utilization of conduction elements embedded in the circuit board and extending from one surface of the board to the other. Conductive traces extend along the surface of the circuit board from the conduction elements to the integrated circuits. The conductive traces may be formed from multiple conductive layers.

Abstract translation: 本发明涉及一种用于连接放置在电路板的相对侧上的集成电路的装置和方法，该集成电路通过利用嵌入电路板中的导电元件并从板的一个表面延伸到另一个表面。 导电迹线沿着电路板的表面从导电元件延伸到集成电路。 导电迹线可以由多个导电层形成。

公开(公告)号：US06515372B1

公开(公告)日：2003-02-04

申请号：US09913975

申请日：2001-08-20

Applicant: Yasumori Narizuka ,  Mitsuko Itou ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei

Inventor： Yasumori Narizuka ,  Mitsuko Itou ,  Yoshihide Yamaguchi ,  Hiroyuki Tenmei

IPC: H01L2348

CPC classification number: H05K3/3463 ,  H01L21/4853 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49866 ,  H01L23/53238 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05548 ,  H01L2224/05671 ,  H01L2224/11 ,  H01L2224/11334 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01047 ,  H01L2924/01056 ,  H01L2924/01058 ,  H01L2924/0106 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/12044 ,  H05K3/388 ,  H05K3/4644 ,  H05K2201/0949 ,  Y10T428/24917 ,  H01L2924/00 ,  H01L2924/00014

Abstract: There are provided a high density and low manufacturing cost wiring board with high reliability in connection, a semiconductor device and a producing method therefor.The invention relates to a wiring board comprising a board having an electrode and being coated with an insulation layer with a hole for exposing the electrode; a wiring consisting of a Cr or Ti layer, which is connected to the electrode and closely contacts with the insulation layer, and of a Cu layer which is closely contacts with the Cr or Ti layer; a protective film which covers the wiring and is provided with another hole for soldering; and a solder for the outer connection which is mounted in the both holes and brought to diffuse into the Cu layer to produce an alloy, and brought to reach the Cr or Ti layer thereby connecting the solder to the Cr or Ti layer.

Abstract translation: 提供了具有高可靠性的高密度和低制造成本的布线板，半导体器件及其制造方法。本发明涉及一种布线板，其包括具有电极的板，并且涂覆有具有孔的绝缘层 用于暴露电极; 由连接到电极并与绝缘层紧密接触的Cr或Ti层构成的布线和与Cr或Ti层紧密接触的Cu层; 覆盖布线的保护膜，并设置有另一个用于焊接的孔; 以及用于外部连接的焊料，其被安装在两个孔中并且扩散到Cu层中以产生合金，并且到达Cr或Ti层，从而将焊料连接到Cr或​​Ti层。

公开(公告)号：US20020180027A1

公开(公告)日：2002-12-05

申请号：US09995772

申请日：2001-11-29

Inventor： Yoshihide Yamaguchi ,  Takao Terabayashi ,  Hiroyuki Tenmei ,  Hiroshi Hozoji ,  Naoya Kanda

IPC: H01L023/15 ,  H01L029/43

CPC classification number: H05K3/0044 ,  H01L21/486 ,  H01L23/147 ,  H01L23/15 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/48 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05655 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19105 ,  H05K1/0271 ,  H05K1/0306 ,  H05K1/115 ,  H05K3/4605 ,  H05K3/4688 ,  H05K2201/0154 ,  H05K2201/068 ,  H05K2201/0949 ,  H05K2201/09518 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2203/025 ,  H05K2203/1581 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A multi-chip module including semiconductor devices and a wiring substrate for mounting the semiconductor devices in which the wiring substrate comprises a glass substrate having holes formed by sand blasting and a wiring layer formed on the surface of the glass substrate and having wiring and an insulation layer.

Abstract translation: 一种包括半导体器件的多芯片模块和用于安装半导体器件的布线基板，其中布线基板包括具有通过喷砂形成的孔的玻璃基板和形成在玻璃基板的表面上并具有布线和绝缘体的布线层 层。

公开(公告)号：US06423904B1

公开(公告)日：2002-07-23

申请号：US08760510

申请日：1996-12-05

Applicant: Keiko Hayami

Inventor： Keiko Hayami

IPC: H05K103

CPC classification number: H05K3/242 ,  H05K1/117 ,  H05K1/162 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0919 ,  H05K2201/09318 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2201/10159 ,  H05K2203/175

Abstract: A laminate printed circuit board of the present invention includes wirings respectively extending from terminals provided on the front and rear of the board. The wirings are each connected to an intermediate layer via a respective blind through hole. A wiring provided on the intermediate layer plays the role of a lead for plating. The circuit is capable of reducing a wiring area and noise.

Abstract translation: 本发明的层叠印刷电路板包括分别从设置在基板的前后的端子延伸的布线。 布线各自经由相应的盲孔连接到中间层。 设置在中间层上的布线起镀层的作用。 该电路能够减少接线面积和噪音。

公开(公告)号：US06192580B1

公开(公告)日：2001-02-27

申请号：US09376065

申请日：1999-08-17

Applicant: Keiko Hayami

Inventor： Keiko Hayami

IPC: H05K302

CPC classification number: H05K3/242 ,  H05K1/117 ,  H05K3/0047 ,  H05K3/0052 ,  H05K3/429 ,  H05K3/4623 ,  H05K2201/0919 ,  H05K2201/0949 ,  H05K2201/09536 ,  H05K2203/175 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A laminate printed circuit board of the present invention includes wirings respectively extending from terminals provided on the front and rear of the board. The wirings are each connected to an intermediate layer via a respective blind through hole. A wiring provided on the intermediate layer plays the role of a lead for plating. The circuit is capable of reducing a wiring area and noise.

Abstract translation: 本发明的层叠印刷电路板包括分别从设置在基板的前后的端子延伸的布线。 布线各自经由相应的盲孔连接到中间层。 设置在中间层上的布线起镀层的作用。 该电路能够减少接线面积和噪音。

公开(公告)号：US6132543A

公开(公告)日：2000-10-17

申请号：US41666

申请日：1998-03-13

Applicant: Noboru Mohri ,  Hayami Matsunaga ,  Masaaki Hayama ,  Tomitarou Murakami

Inventor： Noboru Mohri ,  Hayami Matsunaga ,  Masaaki Hayama ,  Tomitarou Murakami

IPC: H05K3/40 ,  H01L23/12 ,  H01L23/13 ,  H05K1/03 ,  H05K1/09 ,  H05K1/16 ,  H05K3/12 ,  H05K3/20 ,  H05K3/34 ,  H05K3/38 ,  H05K3/46 ,  B32B31/26

CPC classification number: H05K3/3484 ,  H05K3/207 ,  H05K3/3457 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/01322 ,  H01L2924/15311 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/162 ,  H05K2201/09481 ,  H05K2201/0949 ,  H05K2201/09572 ,  H05K2201/09763 ,  H05K2203/0113 ,  H05K2203/043 ,  H05K2203/0465 ,  H05K3/1216 ,  H05K3/386 ,  H05K3/4061 ,  Y10T29/49163

Abstract: The present invention provides a packaged substrate which has a superior positioning accuracy of wiring formed on a circuit substrate made of ceramics, and a conductive pattern with a thick film and yet a fine pattern. On a surface of flexible base member made of plastic, fine grooves are formed in a pattern corresponding to a first conductive pattern so that a cavity face is produced. Conductive paste is filled and into the grooves on this cavity face, and then dried. The cavity face and a circuit substrate are pasted with each other by applying predetermined heat and pressure. A pattern of the dried conductive paste is transcribed onto the circuit substrate, and then the first conductive pattern is formed by firing. A first ball solder is coupled with a second conductive pattern which is coupled to the first conductive pattern through an electrode in a through-hole of the circuit substrate.

Abstract translation: 本发明提供一种封装基板，其具有优良的定位精度，该布线形成在由陶瓷制成的电路基板上，导电图案具有厚膜，而且精细图案。 在由塑料制成的柔性基材的表面上，以对应于第一导电图案的图案形成微细凹槽，从而产生空腔面。 将导电浆料填充到该空腔面上的凹槽中，然后干燥。 通过施加预定的热和压力将空腔面和电路基板彼此粘贴。 将干燥的导电浆料的图案转印到电路基板上，然后通过烧制形成第一导电图案。 第一球焊与第二导电图案耦合，第二导电图案通过电路基板的通孔中的电极耦合到第一导电图案。

公开(公告)号：US6043990A

公开(公告)日：2000-03-28

申请号：US871085

申请日：1997-06-09

Applicant: Morgan T. Johnson ,  David R. Ekstrom

Inventor： Morgan T. Johnson ,  David R. Ekstrom

IPC: H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  B23K31/02 ,  B23K37/04 ,  H05K1/11

CPC classification number: H05K3/368 ,  H05K3/3436 ,  H05K1/144 ,  H05K2201/09145 ,  H05K2201/0949 ,  H05K2201/10234 ,  H05K2201/10992 ,  H05K2203/0165 ,  H05K2203/0278 ,  H05K2203/041 ,  H05K2203/167 ,  Y02P70/613

Abstract: A multiple circuit board package employing solder balls and method and apparatus for fabricating same is described. Two or more printed circuit boards and a plurality of electronic devices are joined together using solder balls. Alternatively, three or more printed circuit boards are joined together using the solder balls. A novel and improved solder ball connection is disclosed, along with a fixture for aligning and fixing the disposition of the pads and the solder balls during a heating cycle in which the circuit boards are placed under pressure while the solder balls are re-flowed for making an electrical connection.

Abstract translation: 描述了使用焊球的多重电路板封装及其制造方法和装置。 使用焊球将两个或多个印刷电路板和多个电子装置连接在一起。 或者，使用焊球将三个或更多个印刷电路板连接在一起。 公开了一种新颖且改进的焊球连接，以及用于在加热循环期间对准和固定焊盘和焊球的布置的固定装置，其中电路板被放置在压力下，同时焊球被重新流动以制造 电气连接。