公开(公告)号：US20060226537A1

公开(公告)日：2006-10-12

申请号：US11164791

申请日：2005-12-06

Applicant: Shuichl Okabe ,  Yasumitsu Orii ,  Mitsuya Ishida

Inventor： Shuichl Okabe ,  Yasumitsu Orii ,  Mitsuya Ishida

IPC: H01L23/12

CPC classification number: H05K1/112 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/81 ,  H01L2224/05001 ,  H01L2224/05009 ,  H01L2224/05025 ,  H01L2224/05111 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/13025 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/81193 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H05K1/162 ,  H05K1/167 ,  H05K3/062 ,  H05K3/3436 ,  H05K3/3484 ,  H05K3/427 ,  H05K2201/0394 ,  H05K2201/09472 ,  H05K2201/09509 ,  H05K2201/09518 ,  H05K2201/09572 ,  H05K2201/0969 ,  H05K2201/10674 ,  H05K2203/0361 ,  H05K2203/0384 ,  H05K2203/043 ,  Y10T29/49165 ,  H01L2924/00014

Abstract: A multilayer circuit board is provided that includes at least two insulating layers each sandwiched by circuit layers, thus having at least one internal circuit layer sandwiched by the at least two insulating layers. Via holes are formed in one or more of the insulating layers at the same pitch as bump electrodes of an integrated circuit chip, which permit insertion of the bump electrodes of an integrated circuit chip into the via holes of the multilayer circuit board. Metal films formed within the via holes are electrically connected to at least one of the circuit layers. An internal capacitor may be formed in a predetermined area of an insulating layer and predetermined areas of circuit layers which sandwich the predetermined area of the insulating layer and are opposed to each other. An internal resistor may be formed in an inner circuit layer.

Abstract translation: 提供了多层电路板，其包括至少两个绝缘层，每个绝缘层均被电路层夹在中间，因此至少有一个内部电路层被至少两个绝缘层夹在中间。 在一个或多个绝缘层中以与集成电路芯片的突起电极相同的间距形成通孔，这允许集成电路芯片的凸块电极插入到多层电路板的通孔中。 形成在通孔内的金属膜电连接至至少一个电路层。 可以在绝缘层的预定区域和夹着绝缘层的预定区域并彼此相对的电路层的预定区域上形成内部电容器。 内部电阻可以形成在内部电路层中。

公开(公告)号：US20060033207A1

公开(公告)日：2006-02-16

申请号：US11002636

申请日：2004-12-03

Applicant: Makio Nakamura ,  Shunji Enokuma

Inventor： Makio Nakamura ,  Shunji Enokuma

IPC: H01L23/34

CPC classification number: H01L24/81 ,  H01L23/3677 ,  H01L23/4006 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/19043 ,  H05K1/0206 ,  H05K1/0243 ,  H05K3/0061 ,  H05K3/325 ,  H05K3/3421 ,  H05K2201/0715 ,  H05K2201/09572 ,  H05K2201/10409 ,  H05K2201/10689

Abstract: An MMIC (Microwave Monolithic Integrated Circuit)-mounted substrate includes a double-metal-foil dielectric substrate having a dielectric substrate with a metal foil pattern formed on both sides of the substrate, an MMIC that is a surface-mount high power amplifier mounted on one side of the double-metal-foil dielectric substrate, and a metal chassis attached to the other side of the double-metal-foil dielectric substrate. The double-metal-foil dielectric substrate has a plurality of through holes. A copper foil pattern that is a metal foil pattern continuously extends to cover the inner surfaces of the through holes and both sides of the dielectric substrate, and solder is buried in the through holes.

Abstract translation: 装有MMIC（微波整体集成电路）的基板包括双金属箔电介质基板，该双金属箔电介质基板具有形成在基板两侧的金属箔图案的电介质基板，作为表面安装的高功率放大器的MMIC 双金属箔电介质基板的一侧和附着在双金属箔电介质基板的另一侧的金属底板。 双金属箔电介质基板具有多个通孔。 作为金属箔图案的铜箔图案连续地延伸以覆盖通孔的内表面和电介质基板的两侧，并且焊料被掩埋在通孔中。

公开(公告)号：US20050173152A1

公开(公告)日：2005-08-11

申请号：US10775262

申请日：2004-02-10

Applicant: Scott Post ,  Morris Stillabower ,  Larry Mandel ,  Sim Yong ,  Cheng Cheok ,  Chih Nah

Inventor： Scott Post ,  Morris Stillabower ,  Larry Mandel ,  Sim Yong ,  Cheng Cheok ,  Chih Nah

IPC: H05K1/11 ,  H05K3/34 ,  H05K1/18

CPC classification number: H05K1/112 ,  H05K3/3442 ,  H05K2201/09572 ,  H05K2201/0979 ,  H05K2201/10636 ,  H05K2203/0455 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic package is provided having a surface mount electronic device connected to a circuit board. The package includes a circuit board and a surface mount electronic device. A mounting pad is formed on the circuit board. A plurality of vias are formed each having an opening extending into the circuit board and extending through the mounting pad. The package further includes a solder joint connecting a contact terminal of the surface mount device to the mounting pad on the circuit board. The solder joint extends at least partially into the openings in each of the plurality of vias to support the arrangement of the surface mount device on the circuit board.

Abstract translation: 提供具有连接到电路板的表面安装电子装置的电子封装。 该封装包括电路板和表面贴装电子器件。 在电路板上形成安装垫。 形成多个通孔，每个通孔具有延伸到电路板中并延伸穿过安装垫的开口。 该封装还包括将表面安装器件的接触端子连接到电路板上的安装焊盘的焊接接头。 焊接接头至少部分地延伸到多个通孔中的每一个中的开口中，以支撑表面安装器件在电路板上的布置。

公开(公告)号：US06882537B2

公开(公告)日：2005-04-19

申请号：US10327839

申请日：2002-12-23

Applicant: Tina P. Barcley

Inventor： Tina P. Barcley

IPC: H05K1/02 ,  H05K7/20

CPC classification number: H05K7/205 ,  H05K1/0206 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/09781

Abstract: A densely packed electronic assemblage has a substrate media for supporting at least one heat generating component and means for reducing the temperature of the at least one heat generating component. A heat sink cooperates with the heat removing element for reducing heat of the at least one heat generating component by absorbing heat from the at least one heat generating component.

Abstract translation: 密集封装的电子组件具有用于支撑至少一个发热部件的基板介质和用于降低至少一个发热部件的温度的装置。 散热器与除热元件配合，用于通过从至少一个发热部件吸收热量来减少至少一个发热部件的热量。

公开(公告)号：US20040211594A1

公开(公告)日：2004-10-28

申请号：US10737412

申请日：2003-12-15

Inventor： Kwun-Yao Ho ,  Moriss Kung

IPC: H05K001/11 ,  H05K003/42

CPC classification number: H01L23/49827 ,  H01L23/49816 ,  H01L23/49822 ,  H01L2924/0002 ,  H01L2924/15311 ,  H05K3/3436 ,  H05K3/3468 ,  H05K3/4007 ,  H05K3/4069 ,  H05K3/429 ,  H05K2201/0367 ,  H05K2201/09572 ,  H05K2201/0959 ,  H05K2201/09845 ,  H05K2201/10666 ,  Y02P70/613 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A vertical routing structure for a multi-layered substrate having a lamination structure therein. The lamination structure has at least a through hole that links up both surfaces of the lamination structure. The vertical routing structure comprises a conductive rod and a conductive layer. The conductive rod is formed inside the through-hole with the ends protruding above the respective upper and lower surface of the lamination structure. The conductive layer is positioned in the space between the interior sidewall of the through-hole and the conductive rod. The vertical routing structure on the substrate is able to reduce the area for laying the required circuits or increase the wiring density in a given area.

Abstract translation: 一种用于其中具有层压结构的多层基板的垂直布线结构。 层压结构至少具有连接层压结构的两个表面的通孔。 垂直布线结构包括导电棒和导电层。 导电杆形成在通孔的内部，端部突出在层叠结构的相应的上表面和下表面的上方。 导电层位于通孔的内侧壁与导电棒之间的空间中。 基板上的垂直布线结构能够减少放置所需电路的面积或增加给定区域中的布线密度。

公开(公告)号：US06801174B2

公开(公告)日：2004-10-05

申请号：US10005960

申请日：2001-12-03

Applicant: Shun Kayama ,  Shunji Amano ,  Motosuke Ohmi ,  Junichi Ohsako ,  Ryota Odake ,  Hiroshi Ozaki

Inventor： Shun Kayama ,  Shunji Amano ,  Motosuke Ohmi ,  Junichi Ohsako ,  Ryota Odake ,  Hiroshi Ozaki

IPC: H01J162

CPC classification number: H05K3/363 ,  H01L27/32 ,  H05K3/305 ,  H05K3/3489 ,  H05K2201/09481 ,  H05K2201/09572 ,  H05K2201/10128 ,  H05K2201/10666 ,  H05K2203/041 ,  H05K2203/107

Abstract: A display device includes an organic electrroluminescence device provided on a first substrate, conductive metallic films provided on the first substrate at such positions as not to overlap with the organic electroluminescence device, a second substrate having a plurality of holes and conductive connection portions which are provided at peripheral portions forming the holes, and solder portions charged in the holes of the second substrate and, by being melted, electrically connecting the conductive metallic films of the first substrate with the conductive connection portions of the second substrate.

Abstract translation: 显示装置包括设置在第一基板上的有机电致发光器件，设置在不与有机电致发光器件重叠的位置处的第一基板上的导电金属膜，具有多个孔的第二基板和设置有导电连接部的导电连接部 在形成孔的周边部分，以及填充在第二基板的孔中的焊料部分，并且通过熔化将第一基板的导电金属膜与第二基板的导电连接部分电连接。

公开(公告)号：US20040173891A1

公开(公告)日：2004-09-09

申请号：US10802782

申请日：2004-03-18

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Ryuji Imai ,  Masao Kuroda ,  Yasuhiro Sugimoto

IPC: H01L023/02

CPC classification number: H01L23/49827 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15313 ,  H05K1/0306 ,  H05K3/3436 ,  H05K3/4076 ,  H05K2201/09572 ,  H05K2201/10378 ,  H05K2201/10674 ,  Y02P70/613 ,  H01L2924/00

Abstract: An intermediate board comprising: an intermediate board body having first and second faces wherein a semiconductor device is to be mounted on at least one of said first and second faces, said semiconductor device having a coefficient of thermal expansion that is equal to or larger than 2.0 ppm/null C. and smaller than 5.0 ppm/null C., and having surface mount terminals, said intermediate board body having a plurality of through holes through which said first and second faces communicate with each other, said intermediate board body containing an inorganic insulating material; and a plurality of conductor columns filling said through holes and containing a conductive metal, said conductor columns being to be connected with said surface mount terminals.

Abstract translation: 一种中间板，包括：具有第一和第二面的中间板体，其中将半导体器件安装在所述第一和第二面中的至少一个面上，所述半导体器件具有等于或大于2.0的热膨胀系数 ppm /℃，小于5.0ppm /℃，并且具有表面贴装端子，所述中间板体具有多个通孔，所述第一和第二表面相互连通，所述中间板主体包含无机 绝缘材料; 以及填充所述通孔并包含导电金属的多个导体柱，所述导体柱将与所述表面安装端子连接。

公开(公告)号：US06743499B2

公开(公告)日：2004-06-01

申请号：US10247264

申请日：2002-09-19

Applicant: Tatsuo Suemasu ,  Takashi Takizawa

Inventor： Tatsuo Suemasu ,  Takashi Takizawa

IPC: B32B1500

CPC classification number: H01L21/76877 ,  C23C2/00 ,  C23C2/02 ,  C23C2/26 ,  H01L21/288 ,  H01L21/76882 ,  H01L21/76898 ,  H01L25/0657 ,  H01L2224/05556 ,  H01L2224/05572 ,  H01L2224/05573 ,  H01L2224/13025 ,  H01L2224/16 ,  H01L2924/00014 ,  H05K3/3468 ,  H05K3/4038 ,  H05K3/4076 ,  H05K3/426 ,  H05K2201/0305 ,  H05K2201/09572 ,  H05K2203/044 ,  H05K2203/085 ,  H05K2203/1394 ,  Y10S428/901 ,  Y10T428/24851 ,  Y10T428/24917 ,  Y10T428/31678 ,  H01L2224/05599

Abstract: In the formation of through wirings in a silicon substrate and so forth, there was a need for the development of a technology that would allow metal to be reliably filled particularly in the vicinity of openings of through holes and other fine holes. This invention provides a metal filling method and member with filled metal sections in which, in the inflow and filling of a plating solution into through holes 11 of a substrate 10 by immersing said substrate 10 in heated and melted conductive metal, filled metal sections are formed by preliminarily forming a metal layer 15 on the inner surface of one of the ends of through holes 11 of this substrate 10 as well as on substrate top surface 13 around those openings, removing substrate 10 on which inflow and filling of the plating solution into through holes 11 has been completed from the plating solution, and then cooling to solidify the plating solution that has been filled into the through holes.

Abstract translation: 在硅衬底等中形成通过布线的方法中，需要开发一种能够使金属被可靠地填充到特别是通孔和其它细孔的开口附近的技术。 本发明提供了一种金属填充方法和具有填充金属部分的部件，其中，通过将所述基板10浸入加热和熔化的导电金属中，在将电镀液流入和填充到基板10的通孔11中时，形成填充的金属部分 通过在该基板10的通孔11的一个端部的内表面以及围绕这些开口的基板顶表面13上预先形成金属层15，去除基板10，电镀液的流入和填充通过 从电镀液中完成孔11，然后冷却固化已经填充到通孔中的电镀液。

公开(公告)号：US06728106B2

公开(公告)日：2004-04-27

申请号：US10095467

申请日：2002-03-13

Applicant: Jong Sik Kim

Inventor： Jong Sik Kim

IPC: H05K720

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K3/341 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09572 ,  H05K2201/10416 ,  H05K2201/10689 ,  H05K2201/2036 ,  H01L2924/00

Abstract: A heat dissipation structure of an IC includes a circuit board provided with through holes perforated thereinto, an IC mounted on the upper surface of the circuit board, a solder filling a space between the circuit board and the IC via the through holes and being cured, and solder lands formed on the circuit board and attached with the solder.

Abstract translation: IC的散热结构包括设置有穿孔的通孔的电路板，安装在电路板的上表面上的IC，经由通孔填充电路板和IC之间的空间并固化的焊料， 以及形成在电路板上并附着有焊料的焊盘。

公开(公告)号：US06462285B2

公开(公告)日：2002-10-08

申请号：US09827111

申请日：2001-04-05

Applicant: Wesley M. Enroth ,  George D. Oxx, Jr. ,  Jenny B. Porter

Inventor： Wesley M. Enroth ,  George D. Oxx, Jr. ,  Jenny B. Porter

IPC: H01R909

CPC classification number: H05K1/114 ,  H05K3/3415 ,  H05K3/3447 ,  H05K3/3468 ,  H05K3/3484 ,  H05K2201/09572 ,  H05K2201/10734 ,  H05K2203/043 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149

Abstract: A method and product for fabricating a printed circuit board assembly comprising a via, wherein the method inhibits the flow of molten solder into the via during a wave soldering step, thereby preventing heat transfer that might otherwise degrade a solder joint at a top pad that is thermally coupled to the via. The method comprises the steps of: (1) fastening a bottom component to the bottom surface of the circuit board by a screening and reflow of solder paste that also generates a solder plug in the via; (2) fastening top components to the top surface of the circuit board by a screening and reflow of solder paste, wherein the top components comprise ball grid arrays and other surface mount devices that are to be affixed to pads which are connected to vias; and (3) wave soldering the bottom surface to affix additional components onto the circuit board, such as pin-in-hole components placed on the top surface. The solder plug formed in the via during the first step prevents molten solder from flowing into the via during the subsequent wave soldering step, thereby inhibiting heat transfer from the molten solder to the solder joint at the top pad.

Abstract translation: 一种用于制造包括通孔的印刷电路板组件的方法和产品，其中所述方法在波峰焊步骤期间抑制熔融焊料流入通孔，从而防止在顶部焊盘处可能会降低焊接接头的热传递， 热耦合到通孔。 该方法包括以下步骤：（1）通过焊膏的筛选和回流将底部部件固定到电路板的底表面，焊膏也在通孔中产生焊料塞; （2）通过焊膏的筛选和回流将顶部部件固定到电路板的顶表面，其中顶部部件包括球栅阵列和其它表面安装装置，其将固定到连接到通孔的焊盘上; 和（3）波峰焊底部表面以将附加部件附加到电路板上，例如放置在顶表面上的针孔组件。 在第一步骤中形成在通孔中的焊料塞在随后的波峰焊步骤期间防止熔融焊料流入通孔，从而阻止从熔融焊料到顶部焊盘处的焊接接头的热传递。