公开(公告)号：US20050035832A1

公开(公告)日：2005-02-17

申请号：US10945096

申请日：2004-09-21

Applicant: Olli Salmela ,  Ilpo Kokkonen

Inventor： Olli Salmela ,  Ilpo Kokkonen

IPC: H01P3/06 ,  H05K1/00 ,  H05K1/02 ,  H01P7/04

CPC classification number: H01P3/06 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/09618 ,  H05K2201/09845

Abstract: The idea of the invention is to fabricate a multilayer coaxial transmission line into a printed circuit. The outermost conductor is fabricated by conductive strips in different layers, using conductive via posts in isolation layers connecting the strips. The innermost conductor can be a single conductive strip or multi strips in different layers connected together through conductive via posts.

Abstract translation: 本发明的思想是将多层同轴传输线制造成印刷电路。 最外面的导体由不同层的导电条制成，使用连接条带的隔离层中的导电通孔。 最内侧的导体可以是单个导电带或者通过导电通孔连接在一起的不同层的多条导线。

公开(公告)号：US06833513B1

公开(公告)日：2004-12-21

申请号：US10279191

申请日：2002-10-22

Applicant: Bilal Ahmad

Inventor： Bilal Ahmad

IPC: H05K706

CPC classification number: H05K1/0219 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/09618 ,  H05K2201/10189 ,  H05K2201/10704

Abstract: A modified connector footprint on a PWB includes a row of ground vias disposed outside a standard connector footprint that do not mate to pins in the connector. The extra ground vias provide additional shielding and reduce cross-talk in the connector/PWB interface.

Abstract translation: PWB上的改进的连接器占用面积包括一排布置在不与连接器中的引脚匹配的标准连接器覆盖区之外的接地通孔。 额外的接地通孔在连接器/ PWB接口中提供额外的屏蔽和减少串扰。

公开(公告)号：US20040226744A1

公开(公告)日：2004-11-18

申请号：US10844823

申请日：2004-05-12

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Toshiyuki Asahi ,  Yutaka Taguchi ,  Yasuhiro Sugaya ,  Seiichi Nakatani ,  Toshio Fujii

IPC: H05K007/06

CPC classification number: H05K1/186 ,  H01L25/165 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/73204 ,  H01L2224/97 ,  H01L2924/19105 ,  H05K1/115 ,  H05K3/20 ,  H05K3/4614 ,  H05K2201/09609 ,  H05K2201/09618 ,  H05K2201/10378 ,  H05K2203/061 ,  H01L2224/81 ,  H01L2224/83

Abstract: A module with a built-in circuit component of the present invention includes an electric insulating layer, a pair of wiring layers provided on both principal planes of the electric insulating layer, a plurality of via conductors electrically connecting the pair of wiring layers and passing through the electric insulating layer in a thickness direction thereof, and a circuit component buried in the electric insulating layer, wherein the plurality of via conductors are disposed in a circumferential portion of the electric insulating layer in accordance with a predetermined rule. The plurality of via conductors are placed at an interval, for example, so as to form at least one straight line, in a cut surface of the electric insulating layer in a direction parallel to a principal plane thereof.

Abstract translation: 具有本发明的内置电路部件的模块包括电绝缘层，设置在电绝缘层的两个主平面上的一对布线层，多个通孔导体，电连接该对布线层并通过 所述电绝缘层的厚度方向以及埋设在所述电绝缘层中的电路部件，其中，所述多个通孔导体按照规定的规则配置在所述电绝缘层的周向部分。 多个通孔导体例如在与绝缘层的主平面平行的方向上在电绝缘层的切割面上形成至少一条直线的间隔。

公开(公告)号：US06812411B2

公开(公告)日：2004-11-02

申请号：US09804323

申请日：2001-03-12

Applicant: Horst Belau ,  Joachim Held ,  Wolfram Meyer ,  Hartwig Reindl

Inventor： Horst Belau ,  Joachim Held ,  Wolfram Meyer ,  Hartwig Reindl

IPC: H01R1204

CPC classification number: H01R12/526 ,  H01R12/523 ,  H01R13/6625 ,  H01R13/719 ,  H05K1/0219 ,  H05K1/0231 ,  H05K1/117 ,  H05K2201/09618 ,  H05K2201/10189

Abstract: A printed circuit board configuration with a multipole plug-in connector has plug pins fixed parallel to the board layer on respective signal conductor tracks. The signal conductor tracks are configured essentially parallel and alternately side-to-side with ground conductor tracks. Furthermore, a ground shielding surface is provided on an adjacent board layer.

Abstract translation: 具有多极插入式连接器的印刷电路板配置具有在相应的信号导体轨道上平行于板层固定的插头销。 信号导体轨道基本上平行并且与接地导体轨迹交替地配置。 此外，在相邻的基板层上设置有接地屏蔽面。

公开(公告)号：US20040201971A1

公开(公告)日：2004-10-14

申请号：US10408951

申请日：2003-04-08

Inventor： John Thomas Fessler ,  Keith Bryan Hardin ,  Eric Wayne Westerfield

IPC: H05K001/11 ,  H05K007/06

CPC classification number: H05K1/0218 ,  H05K1/0231 ,  H05K1/0298 ,  H05K2201/0715 ,  H05K2201/09345 ,  H05K2201/09618 ,  H05K2201/09772 ,  H05K2201/10689

Abstract: A multi-layer printed circuit board (PCB) routes signal traces on internal signal layer(s) and includes power planes on the two outermost layers. The outer layers are maintained at the same non-ground voltage level, and are electrically connected by a series of vias that circumscribe signal traces on the internal layer(s). With a preferred maximum spacing of one-tenth the wavelength of electromagnetic energy generated by the signal traces, the vias, together with the outer power planes, contain electromagnetic energy within the PCB. One or more of the outer planes may include a second power plane area maintained at a different voltage. The two power plane areas are connected by decoupling capacitors, located proximate underlying signal traces that traverse the two power plane areas.

Abstract translation: 多层印刷电路板（PCB）在内部信号层上传送信号迹线，并且包括两个最外层的电源层。 外层保持在相同的非接地电压电平，并且通过一系列通孔来电连接，这些通孔围绕内层上的信号迹线。 通过由信号迹线产生的电磁能量波长的十分之一的优选最大间距，通孔与外部电源平面在PCB内包含电磁能。 一个或多个外平面可以包括维持在不同电压的第二电源平面区域。 两个电力平面区域通过去耦电容器连接，位于邻近穿过两个电源平面区域的底层信号迹线。

公开(公告)号：US20040090748A1

公开(公告)日：2004-05-13

申请号：US10695463

申请日：2003-10-28

Applicant: KONICA MINOLTA HOLDINGS, INC

Inventor： Tadao Kishimoto ,  Yutaka Igarashi ,  Hironobu Hirayama

IPC: H05K007/20

CPC classification number: H05K1/0234 ,  H05K1/0215 ,  H05K1/0218 ,  H05K1/0231 ,  H05K1/116 ,  H05K3/325 ,  H05K3/429 ,  H05K7/142 ,  H05K9/0039 ,  H05K2201/09354 ,  H05K2201/09618 ,  H05K2201/10022 ,  H05K2201/10409 ,  H05K2201/10446 ,  Y10T29/49155

Abstract: There is described a multi-layer printed circuit board and a method of installing it. The circuit board includes a first signal layer formed on its obverse surface; a ground layer arranged at a position next to the first signal layer; an electronic power source layer arranged at a position next to the ground layer; and a second signal layer formed on its reverse surface. The first and second patterns are formed around peripheral areas of the first and second signal layers, respectively. The first ground pattern and the second ground pattern are electrically coupled to each other by plural through holes, and the multi-layer printed circuit board is installed on an electro-conductive housing in such a manner that a substantially whole area of the second ground pattern electrically contacts a mounting area of the electro-conductive housing, the mounting area being an electro-conductive area continuously coupled to the electro-conductive housing.

Abstract translation: 描述了一种多层印刷电路板及其安装方法。 电路板包括在其正面上形成的第一信号层; 布置在与所述第一信号层相邻的位置处的接地层; 布置在接地层旁边的位置处的电子电源层; 以及形成在其反面上的第二信号层。 第一和第二图案分别形成在第一和第二信号层的周边区域周围。 第一接地图案​​和第二接地图案通过多个通孔彼此电耦合，并且多层印刷电路板以这样的方式安装在导电外壳上，使得第二接地图案的大致整个区域 电接触导电壳体的安装区域，该安装区域是连续耦合到导电壳体的导电区域。

公开(公告)号：US06630627B1

公开(公告)日：2003-10-07

申请号：US09664361

申请日：2000-09-18

Applicant: Youichi Tobita

Inventor： Youichi Tobita

IPC: H05K103

CPC classification number: H05K1/0219 ,  H05K1/023 ,  H05K1/0237 ,  H05K3/429 ,  H05K2201/09236 ,  H05K2201/09618 ,  H05K2201/09781

Abstract: Each wiring layer of a multilayered wiring substrate includes signal wirings disposed in parallel with one another, and dummy wirings disposed at each side parallel to the signal wirings of the signal wiring group made by signal wiring, respectively. The dummy wirings have the same shape as the signal wirings, and are disposed in parallel to the signal wirings at the same intervals as that in the signal wirings. Through holes are formed in the respective clearances among the signal wirings. Dummy through holes having the same shape as the through holes are formed between the dummy wiring and signal wiring. A conductive layer is formed on the inner wall of the through holes. The multilayered wiring substrate is able to reduce or eliminate the delay time difference between signals that propagate along the signal wirings.

Abstract translation: 多层布线基板的各布线层包括彼此平行布置的信号布线，并且分别设置在与由信号布线构成的信号布线组的信号布线平行的每一侧的虚拟布线。 虚拟布线具有与信号布线相同的形状，并且以与信号布线中相同的间隔平行于信号布线布置。 在信号布线之间的各间隙中形成通孔。 在虚拟布线和信号布线之间形成具有与通孔相同形状的虚拟通孔。 导电层形成在通孔的内壁上。 多层布线基板能够减少或消除沿着信号布线传播的信号之间的延迟时间差。

公开(公告)号：US20030151476A1

公开(公告)日：2003-08-14

申请号：US10297763

申请日：2002-12-09

Inventor： Olli Salmela ,  Ilpo Kokkonen

IPC: H01P003/06

CPC classification number: H01P3/06 ,  H05K1/0219 ,  H05K1/0237 ,  H05K1/0298 ,  H05K2201/09618 ,  H05K2201/09845

Abstract: The idea of the invention is to fabricate a multilayer coaxial transmission line into a printed circuit. The outermost conductor is fabricated by conductive conduit strips in different layers, using conductive via posts in isolation layers connecting the strips. The innermost conductor can be a single conductive strip or multiple strips in different layers connected together through conductive via posts.

Abstract translation: 本发明的思想是将多层同轴传输线制造成印刷电路。 最外面的导体由不同层的导电导线条制成，使用连接条带的隔离层中的导电通孔。 最内面的导体可以是单个导电条或通过导电通孔连接在一起的不同层中的多个条。

公开(公告)号：US20030133279A1

公开(公告)日：2003-07-17

申请号：US10338183

申请日：2003-01-06

Applicant: KYOCERA CORPORATION

Inventor： Takayuki Shirasaki

IPC: H05K001/11 ,  H05K001/14

CPC classification number: H05K1/0222 ,  H01P1/047 ,  H05K1/0251 ,  H05K2201/09618 ,  H05K2201/09718 ,  H05K2201/09809

Abstract: There has been a problem that a mode (a high-order mode) different from a basic propagation mode occurs at a point of a through conductor and a transmission characteristic deteriorates greatly. The present invention is a high-frequency wiring board wherein L>null/4 and null(AnullB)nullnull are satisfied in which L is a length of a through conductor, A is a diameter of the through conductor, B is shortest distances between the through conductor and a plurality of ground through conductors, null is a circle ratio and null is an effective wavelength of a high-frequency signal transmitted by the through conductor. It is possible to inhibit a high-order mode which occurs at a point of the through conductor.

Abstract translation: 存在与通过导体的点发生与基本传播模式不同的模式（高阶模式）和传输特性劣化劣化的问题。 本发明是一种高频布线板，其中满足L> lambd / 4和pi（A + B）<= lambd，其中L是穿通导体的长度，A是穿通导体的直径，B是 通孔导体与多个接地导体之间的最短距离，pi是圆比，而lambd是通过导体传输的高频信号的有效波长。 可以抑制在贯通导体的点发生的高阶模式。

公开(公告)号：US20030080836A1

公开(公告)日：2003-05-01

申请号：US10067917

申请日：2002-02-08

Applicant: Hitachi, Ltd.

Inventor： Hideyuki Nagaishi ,  Hiroshi Kondoh

IPC: H01P001/00

CPC classification number: H05K1/0222 ,  G01S7/032 ,  G01S13/931 ,  G01S2007/028 ,  H01L23/552 ,  H01L23/66 ,  H01L24/48 ,  H01L2223/6616 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2223/6688 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/16152 ,  H01L2924/1616 ,  H01L2924/16195 ,  H01L2924/1903 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01P1/047 ,  H01Q1/3233 ,  H01Q9/0407 ,  H01Q21/0087 ,  H01Q23/00 ,  H05K1/0221 ,  H05K1/0243 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K3/4629 ,  H05K2201/09618 ,  H05K2201/09781 ,  H05K2201/09809 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A high frequency circuit module for use in an automotive radar or the like, in which RF circuit parts are mounted on both sides of a hard multilayer dielectric substrate, and a transmission line connecting the RF circuit parts provided on both sides is constructed by a via group including a periodical structure or a via having a coaxial structure perpendicular to faces of the multilayer dielectric substrate. As the multilayer dielectric substrate, a hard multilayer substrate using metallic layers as a microstrip line wiring layer, a DC/IF signal line layer, and grounding metal layers for shielding which are disposed on and under the DC/IF signal line is employed. By using the transmission line achieved by a through via having the periodical structure or the through via having the coaxial structure, an electromagnetic wave propagating in parallel between the grounding conductors is confined.

Abstract translation: 一种用于汽车雷达等的高频电路模块，其中RF电路部分安装在硬质多层电介质基板的两侧，以及连接设置在两侧的RF电路部分的传输线由通孔 包括具有垂直于多层电介质基板的表面的同轴结构的周期性结构或通孔。 作为多层电介质基板，采用使用设置在DC / IF信号线上和下方的金属层作为微带线布线层的硬质多层基板，DC / IF信号线层和用于屏蔽的接地金属层。 通过使用具有周期性结构的贯通孔或具有同轴结构的通孔实现的传输线，限制了在接地导体之间并联传播的电磁波。