公开(公告)号：US20140328029A1

公开(公告)日：2014-11-06

申请号：US14364765

申请日：2012-12-11

Applicant: Continental Automotive GmbH

Inventor： Jan Keller ,  Thomas Riepl

IPC: H05K1/02 ,  H05K13/00

CPC classification number: H05K1/0275 ,  G06F21/86 ,  G06F21/87 ,  G06F2221/2101 ,  H05K1/11 ,  H05K1/181 ,  H05K1/182 ,  H05K3/28 ,  H05K13/00 ,  H05K2201/09218 ,  H05K2201/09681 ,  H05K2201/10159 ,  H05K2203/175 ,  H05K2203/178

Abstract: A control unit has a substrate with an electrically conductive structure, an integrated circuit device, which is installed on the substrate in an electrically conductive manner, and a sacrificial structure on the substrate. The sacrificial structure is configured to be irreversibly destroyed if the integrated circuit device is removed from the substrate. The electrically conductive structure has at least one conducting track applied to the substrate. The sacrificial structure is formed by a segment of the conducting track. An electrically insulating connecting layer that connects the integrated circuit device, the substrate, and the segment of the conducting track is formed. The sacrificial structure can be destroyed by the connecting layer when the integrated circuit device is removed.

Abstract translation: 控制单元具有导电结构的基板，以导电方式安装在基板上的集成电路器件以及基板上的牺牲结构。 如果将集成电路器件从衬底移除，牺牲结构被配置为不可逆地破坏。 导电结构具有施加到基板的至少一个导电轨迹。 牺牲结构由导电轨道的一段形成。 形成连接集成电路器件，衬底和导电轨道的段的电绝缘连接层。 当集成电路器件被去除时，牺牲结构可被连接层破坏。

公开(公告)号：US08873265B2

公开(公告)日：2014-10-28

申请号：US13418619

申请日：2012-03-13

Applicant: Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

Inventor： Hayato Masubuchi ,  Naoki Kimura ,  Manabu Matsumoto ,  Toyota Morimoto

IPC: G11C5/02 ,  H01L23/498 ,  H05K1/02 ,  H01L23/31 ,  H05K3/30

CPC classification number: H01L25/18 ,  G11C5/02 ,  H01L23/3121 ,  H01L23/3142 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L25/0655 ,  H01L25/50 ,  H01L27/115 ,  H01L2924/0002 ,  H05K1/0225 ,  H05K1/0271 ,  H05K1/0298 ,  H05K1/181 ,  H05K3/305 ,  H05K2201/09136 ,  H05K2201/09681 ,  H05K2201/10159 ,  Y02P70/613 ,  H01L2924/00

Abstract: According to one embodiment, a semiconductor memory system includes a substrate, a plurality of elements and an adhesive portion. The substrate has a multilayer structure in which wiring patterns are formed, and has a substantially rectangle shape in a planar view. The elements are provided and arranged along the long-side direction of a surface layer side of the substrate. The adhesive portion is filled in a gap between the elements and in a gap between the elements and the substrate, where surfaces of the elements are exposed.

Abstract translation: 根据一个实施例，半导体存储器系统包括衬底，多个元件和粘合剂部分。 基板具有其中形成布线图案并且在平面图中具有大致矩形形状的多层结构。 元件沿着衬底的表面层侧的长边方向设置和布置。 粘合剂部分填充在元件之间的间隙中，并且在元件和基板之间的间隙中填充元件的表面。

公开(公告)号：US08853545B2

公开(公告)日：2014-10-07

申请号：US13798040

申请日：2013-03-12

Applicant: Wistron Corporation

Inventor： Kuei-Yung Cheng ,  Yao-Quan Hu

IPC: H05K1/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H01R13/58 ,  H05K1/14 ,  H05K1/02

CPC classification number: H05K1/0213 ,  H05K1/0292 ,  H05K1/117 ,  H05K3/244 ,  H05K2201/0909 ,  H05K2201/09145 ,  H05K2201/10159

Abstract: A test card includes a substrate and a goldfinger structure disposed on a side of the substrate. The goldfinger structure includes a first conductive section and a second conductive section. The first conductive section is inserted into a slot of a socket for electrically connecting to the socket. The second conductive section is connected to the first conductive section in a separable manner, and the second conductive section is inserted into the slot of the socket for electrically connecting to the socket after the first conductive section is cut for separating from the second conductive section.

Abstract translation: 测试卡包括设置在基板一侧的基板和金手指结构。 金指针结构包括第一导电部分和第二导电部分。 第一导电部分插入到插座的插槽中以电连接到插座。 第二导电部分以可分离的方式连接到第一导电部分，并且在第一导电部分被切割以与第二导电部分分离之后，第二导电部分插入到插座的槽中，用于电连接到插座。

公开(公告)号：US08837141B2

公开(公告)日：2014-09-16

申请号：US13573968

申请日：2012-10-17

Applicant: James E. Clayton ,  Zakaryae Fathi

Inventor： James E. Clayton ,  Zakaryae Fathi

IPC: H05K7/20 ,  H05K3/10 ,  G06F1/20

CPC classification number: H05K1/147 ,  G06F1/20 ,  H01R12/62 ,  H01R12/737 ,  H05K1/118 ,  H05K3/366 ,  H05K2201/046 ,  H05K2201/09481 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10545 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49155

Abstract: An electronic module comprises: a multilayer circuit board having a bifurcated area along one edge and a plurality of electronic components mounted on at least one surface; a plurality of electrode pads functionally connected to the electronic components and positioned on the inner surfaces of the bifurcated area so that when the two legs of the bifurcated area are spread apart by about 180° the electrode pads align with respective contacts on a motherboard, and are connectable thereto, so that a secure connection may be created between the circuit board and the motherboard; and, two metal, heat spreading covers lockably enclosing the circuit board, one on either side, the covers further providing mating surfaces upon which a mechanical clamping device can engage and secure the module to a motherboard.

Abstract translation: 电子模块包括：具有沿着一个边缘的分叉区域和安装在至少一个表面上的多个电子部件的多层电路板; 多个电极焊盘功能地连接到电子部件并且定位在分叉区域的内表面上，使得当分叉区域的两条腿分开约180°时，电极焊盘与主板上的相应触点对准，并且 可连接到其上，从而可以在电路板和母板之间产生安全连接; 以及两个金属的散热盖，其可锁定地围绕电路板，一个在任一侧，所述盖还提供配合表面，机械夹紧装置可以在该配合表面上接合并将模块固定到主板。

公开(公告)号：US20140241062A1

公开(公告)日：2014-08-28

申请号：US13833198

申请日：2013-03-15

Applicant: LSI CORPORATION

Inventor： Shad T. Jeseritz ,  Jason M. Stuhlsatz ,  Gregory P. Shogan ,  Patrick J. Haverty ,  Brian D. Stark ,  Joseph M. Rubinstein

IPC: G11C5/04

CPC classification number: G11C5/04 ,  H05K1/0209 ,  H05K1/148 ,  H05K2201/10159

Abstract: A memory card in a computer system includes a plurality of memory elements on a NAND flash board. The NAND flash board is connected to a controller board by a flexible connector. The flexible connector allows the memory elements and NAND flash controller to be physically separated so that waste heat from one does not impact the other. The flexible connector also allows elements to be organized to create an airflow channel. The airflow channel directs air in such a way as to enhance cooling.

Abstract translation: 计算机系统中的存储卡包括NAND闪存板上的多个存储元件。 NAND闪存板通过柔性连接器连接到控制器板。 灵活的连接器允许存储器元件和NAND闪存控制器物理分离，使得来自一个的废热不会影响另一个。 柔性连接器还允许元件被组织以创建气流通道。 气流通道引导空气以增强冷却。

公开(公告)号：US20140226278A1

公开(公告)日：2014-08-14

申请号：US14174787

申请日：2014-02-06

Applicant: CANON KABUSHIKI KAISHA

Inventor： Masanori Kikuchi

IPC: H05K1/02

CPC classification number: H05K1/0246 ,  G11C29/023 ,  G11C29/025 ,  H05K1/0243 ,  H05K1/114 ,  H05K2201/10159

Abstract: A memory system is provided with a motherboard, and a memory controller and a plurality memory devices mounted on the motherboard. The motherboard comprises a unicursal-shape main wiring, and branch wirings branched from the main wiring to the respective memory devices. Further, the motherboard comprises an open stub wiring branched from a connecting point between a start end and a branch point of the main wiring. Thus, a ringing of a waveform of a signal received by a receiving circuit can be suppressed irrespective of a wiring length of the branch wiring.

Abstract translation: 存储器系统设置有主板，以及安装在母板上的存储器控​​制器和多个存储器件。 主板包括单向形主布线和从主布线分支到各个存储器件的分支布线。 此外，母板包括从主配线的起始端和分支点之间的连接点分支的开放短截线。 因此，可以抑制由接收电路接收的信号的波形的振铃，而与分支布线的布线长度无关。

公开(公告)号：US20140211405A1

公开(公告)日：2014-07-31

申请号：US13863350

申请日：2013-04-15

Applicant: ADATA TECHNOLOGY CO., LTD.

Inventor： YU-JEN YANG

IPC: G06F1/16

CPC classification number: G06F1/183 ,  H01R12/7005 ,  H01R13/6485 ,  H05K1/02 ,  H05K1/117 ,  H05K3/225 ,  H05K2201/09063 ,  H05K2201/10159 ,  H05K2203/176

Abstract: A memory module comprises a PCB and a safety detachable assembly. The PCB has a terminal portion. The safety detachable assembly includes a metal strap connected to the PCB and is disposed on the terminal portion. The metal straps can provide force for the memory module to be detached from a memory slot, and prevent electrostatic from transmitting to the PCB such that normal operations of the PCB maybe affected.

Abstract translation: 存储器模块包括PCB和安全可拆卸组件。 PCB具有端子部分。 安全可拆卸组件包括连接到PCB的金属带并且设置在端子部分上。 金属带可以提供用于将存储器模块从存储器插槽分离的力，并且防止静电传输到PCB，使得PCB的正常操作可能受到影响。

公开(公告)号：US08777452B2

公开(公告)日：2014-07-15

申请号：US13321183

申请日：2010-05-05

Applicant: Filip Bruyneel ,  Alfred Peeters

Inventor： Filip Bruyneel ,  Alfred Peeters

IPC: F21V21/00

CPC classification number: H05K1/189 ,  G02F1/133603 ,  G02F1/133608 ,  H05B33/0803 ,  H05K2201/051 ,  H05K2201/09018 ,  H05K2201/10106 ,  H05K2201/10159 ,  H05K2201/2009

Abstract: An oblong sized printed circuit board (1) comprises light emitting diode circuitry (2, 3). Parts of the printed circuit board (1) are flexible in at least one direction, to improve a manufacturing efficiency. Preferably, the printed circuit board (1) can make curves in length and width directions and does not require holes for screws. The light emitting diode circuitry (2, 3) may comprise light emitting diode circuits (2) with light emitting diodes and other circuitry (3) such as a driver for driving light emitting diode circuits (2) individually for providing ambient light for a display (5). A device (100) comprising the printed circuit board (1) may further comprise the display (5). Such a device (100) is for example a television receiver/display device/screen device. The printed circuit board (1) may be attached to structures (61, 62) moveable by hand/machine for directing the ambient light. The device (100) may be a roll (101) for rolling up the printed circuit board (1).

Abstract translation: 长方形的印刷电路板（1）包括发光二极管电路（2,3）。 印刷电路板（1）的部分在至少一个方向上是柔性的，以提高制造效率。 优选地，印刷电路板（1）可以在长度和宽度方向上形成曲线，并且不需要用于螺钉的孔。 发光二极管电路（2,3）可以包括具有发光二极管和其它电路（3）的发光二极管电路（2），例如用于驱动发光二极管电路（2）的驱动器，用于为显示器提供环境光 （5）。 包括印刷电路板（1）的设备（100）还可以包括显示器（5）。 这样的设备（100）例如是电视接收机/显示设备/屏幕设备。 印刷电路板（1）可以附接到用手或机器移动以引导环境光的结构（61,62）。 设备（100）可以是用于卷绕印刷电路板（1）的卷（101）。

公开(公告)号：US08775991B2

公开(公告)日：2014-07-08

申请号：US13888627

申请日：2013-05-07

Applicant: Intel Corporation

Inventor： Michael W. Leddige ,  Kuljit Singh Bains ,  John Thomas Sprietsma

IPC: G06F17/50

CPC classification number: H01L23/49816 ,  G11C5/02 ,  H01L2224/16 ,  H01L2224/16145 ,  H01L2224/16225 ,  H05K1/181 ,  H05K2201/10159 ,  H05K2201/10734 ,  H05K2203/1572 ,  Y02P70/611

Abstract: A memory module has an array of connections. The array of connections is arranged in rows and columns such that there are first and second outer columns. Connections in the first and second outer columns can be interchanged to optimize double-side module placement on a substrate. Other embodiments are also disclosed and claimed.

Abstract translation: 存储器模块具有连接阵列。 连接阵列以行和列排列，使得存在第一和第二外部列。 可以互换第一和第二外柱中的连接，以优化在基板上的双面模块放置。 还公开并要求保护其他实施例。

公开(公告)号：US08687377B2

公开(公告)日：2014-04-01

申请号：US13308432

申请日：2011-11-30

Applicant: Masaru Harashima ,  Norihiro Ishii

Inventor： Masaru Harashima ,  Norihiro Ishii

IPC: H05K5/00

CPC classification number: G06F1/187 ,  H05K1/0271 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/10159 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: According to one embodiment, a storage device includes a housing, a circuit board, and a module. The circuit board is located in the housing, and includes a first surface and a second surface located opposite the first surface. The module is provided on at least one of the first surface and the second surface of the circuit board. The circuit board is provided with a first notch and a connection portion to be connected to the housing at the periphery. The first notch is provided with a second notch extending toward an area between the connection portion and a module fixation area where the module is fixed on the circuit board.

Abstract translation: 根据一个实施例，存储设备包括壳体，电路板和模块。 电路板位于壳体中，并且包括第一表面和与第一表面相对的第二表面。 模块设置在电路板的第一表面和第二表面中的至少一个上。 电路板设置有第一凹口和连接部分，以在外围连接到壳体。 第一凹口设置有朝向连接部分和模块固定区域之间的区域延伸的第二凹口，其中模块固定在电路板上。