公开(公告)号：US20140096380A1

公开(公告)日：2014-04-10

申请号：US14133157

申请日：2013-12-18

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Chang Hyun LIM ,  Jung Eun KANG ,  Heung Soo PARK ,  Seog Moon CHOI ,  Kwang Soo KIM ,  Joon Seok CHAE ,  Sung Keun PARK

IPC: H05K3/44 ,  H05K3/10

CPC classification number: H05K3/10 ,  H05K1/0203 ,  H05K1/053 ,  H05K3/108 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/062 ,  H05K2201/09745 ,  H05K2201/10166 ,  H05K2203/0315 ,  Y10T29/4913

Abstract: Disclosed herein are a hybrid heat-radiating substrate including a metal core layer; an oxide insulating core layer that is formed in a thickness direction of the metal core layer to have a shape where the oxide insulating core layer is integrally formed with the metal core layer, an oxide insulating layer that is formed on one surface or both surfaces of the metal core layer, and a circuit layer that is configured to include first circuit patterns formed on the oxide insulating core layer and second circuit patterns formed on the oxide insulating layer, and a method of manufacturing the same.

Abstract translation: 本文公开了包括金属芯层的混合散热基板; 氧化物绝缘芯层，其形成在所述金属芯层的厚度方向上，以形成所述氧化物绝缘芯层与所述金属芯层一体形成的形状;氧化物绝缘层，其形成在所述金属芯层的一个表面或两个表面上 金属芯层，以及被配置为包括形成在氧化物绝缘芯层上的第一电路图案和形成在氧化物绝缘层上的第二电路图案的电路层及其制造方法。

公开(公告)号：US20140085834A1

公开(公告)日：2014-03-27

申请号：US14092054

申请日：2013-11-27

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Keishi KATO ,  Osamu TABATA ,  Yoshio OKAYAMA ,  Ryosuke USUI

IPC: H05K1/05

CPC classification number: H05K1/053 ,  H01L23/13 ,  H01L23/142 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1435 ,  H01L2924/1438 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0216 ,  H05K2201/09972 ,  H05K2201/10166 ,  H05K2203/0315 ,  H05K2203/0323 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from the upper surface to the lower surface of the metallic substrate. Oxide films are so formed as to fill in the spaces between adjacent cylinders of insulating resins and the surrounding of the cylinders. That is, a separation layer is formed of the pillared insulating resins and the oxide films that fill up the spaces between the pillared insulating resins as well as their vicinities.

Abstract translation: 在金属基板的上表面，靠近金属基板的中心部分的区域由具有虚线的矩形围绕，矩形的内部和外部电气分离。 侧面的每个点由从金属基板的上表面到下表面贯穿的柱状绝缘树脂形成。 氧化膜被形成为填充绝缘树脂的相邻气缸和气缸周围之间的空间。 也就是说，分离层由柱状绝缘树脂和填充柱状绝缘树脂之间的空间及其附近的氧化物膜形成。

公开(公告)号：US20130334677A1

公开(公告)日：2013-12-19

申请号：US13517654

申请日：2012-06-14

Applicant: Ralf Otremba ,  Davide Chiola ,  Erich Griebl ,  Fabio Brucchi

Inventor： Ralf Otremba ,  Davide Chiola ,  Erich Griebl ,  Fabio Brucchi

IPC: H01L23/495 ,  H01L21/56 ,  H01L23/34

CPC classification number: H01L23/49562 ,  H01L21/565 ,  H01L23/3107 ,  H01L23/36 ,  H01L23/4952 ,  H01L24/06 ,  H01L24/48 ,  H01L24/49 ,  H01L25/11 ,  H01L2224/04042 ,  H01L2224/0603 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48464 ,  H01L2224/4903 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/181 ,  H05K1/0296 ,  H05K3/308 ,  H05K2201/0792 ,  H05K2201/10166 ,  H05K2201/10522 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2924/00012

Abstract: In accordance with an embodiment of the present invention, a semiconductor module includes a first semiconductor device having a first plurality of leads including a first gate/base lead, a first drain/collector lead, and a first source/emitter lead. The module further includes a second semiconductor device and a circuit board. The second semiconductor device has a second plurality of leads including a second gate/base lead, a second drain/collector lead, and a second source/emitter lead. The circuit board has a plurality of mounting holes, wherein each of the first plurality of leads and the second plurality of leads is mounted into a respective one of the plurality of mounting holes. At the plurality of mounting holes, a first distance from the first gate/base lead to the second gate/base lead is different from a second distance from the first source/emitter lead to the second source/emitter lead.

Abstract translation: 根据本发明的实施例，半导体模块包括具有包括第一栅极/基极引线，第一漏极/集电极引线和第一源极/发射极引线的第一多个引线的第一半导体器件。 该模块还包括第二半导体器件和电路板。 第二半导体器件具有包括第二栅极/基极引线，第二漏极/集电极引线和第二源极/发射极引线的第二多个引线。 电路板具有多个安装孔，其中第一多个引线和第二多个引线中的每一个安装到多个安装孔中的相应一个安装孔中。 在多个安装孔处，从第一栅极/基极引线到第二栅极/基极引线的第一距离与从第一源极/发射极引线到第二源极/发射极引线的第二距离不同。

公开(公告)号：US20130334676A1

公开(公告)日：2013-12-19

申请号：US14002043

申请日：2011-11-15

Applicant: Yoshihiro Kodaira

Inventor： Yoshihiro Kodaira

IPC: H01L23/498 ,  H01L21/768

CPC classification number: H01L23/498 ,  H01L21/76838 ,  H01L23/142 ,  H01L23/24 ,  H01L23/49811 ,  H01L25/072 ,  H01L2924/0002 ,  H05K2201/10166 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00

Abstract: A semiconductor module is manufactured by bonding a resin case having a first opening through which surfaces of main circuit terminals and control terminals are exposed, onto a metal heat-dissipating substrate onto which is bonded, a conductive-patterned insulating substrate onto which are bonded, semiconductor chips, the main circuit terminals, and the control terminals; inserting into and attaching to a second opening formed on a side wall constituting a resin case, a resin body having a nut embedded therein to fix the main circuit terminals and the control terminals; and filling the resin case with a resin material. A side wall of the first opening is tapered toward the surface thereof; a tapered contact portion contacting the tapered side wall is disposed on the control terminal; and the resin body having the embedded nut fixes the control terminal having a one-footing structure that is an independent terminal.

Abstract translation: 半导体模块通过将具有第一开口的主体电路端子和控制端子露出的第一开口的树脂壳体接合到粘合的导电图案化绝缘基板上的金属散热基板上， 半导体芯片，主电路端子和控制端子; 插入并附接到形成在构成树脂壳体的侧壁上的第二开口，具有嵌入其中的螺母的树脂体，以固定主电路端子和控制端子; 并用树脂材料填充树脂壳体。 第一开口的侧壁朝向其表面逐渐变细; 在所述控制端子上设置与所述锥形侧壁接触的锥形接触部; 并且具有嵌入螺母的树脂体固定具有作为独立端子的单脚结构的控制端子。

公开(公告)号：US20130333932A1

公开(公告)日：2013-12-19

申请号：US13526186

申请日：2012-06-18

Applicant: Philip W. Johnson

Inventor： Philip W. Johnson

IPC: H05K1/18 ,  H05K3/30 ,  H05K1/02

CPC classification number: H05K1/0256 ,  H01L31/0203 ,  H01L31/153 ,  H05K1/0262 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/10121 ,  H05K2201/10166

Abstract: A printed circuit board is provided. The printed circuit board includes a base having a top and a bottom. The top has a first circuit area, a second circuit area and a slotted area disposed between the first circuit area and the second circuit area. The slotted area includes a first row of a plurality of first slots, each first slot of the plurality of first slots has a first length and is separated from an adjacent first slot by a first space. The slotted area includes a second row of a plurality of second slots that is positioned parallel with respect to the first row. Each second slot of the plurality of second slots has a second length that is different than the first length and is separated from an adjacent second slot by a second space. The second space includes a different length than the first space.

Abstract translation: 提供印刷电路板。 印刷电路板包括具有顶部和底部的底座。 顶部具有第一电路区域，第二电路区域和布置在第一电路区域和第二电路区域之间的开槽区域。 开槽区域包括多个第一槽的第一排，多个第一槽中的每个第一槽具有第一长度并且通过第一空间与相邻的第一槽分离。 开槽区域包括相对于第一排平行定位的多个第二槽的第二排。 多个第二槽中的每个第二槽具有与第一长度不同的第二长度，并且与相邻的第二槽分开第二空间。 第二空间包括与第一空间不同的长度。

公开(公告)号：US20130279207A1

公开(公告)日：2013-10-24

申请号：US13849636

申请日：2013-03-25

Applicant: LITE-ON ELECTRONICS(GUANGZHOU)LIMITED ,  LITE-ON TECHNOLOGY CORP.

Inventor： WEI-CHENG YU ,  CHI-CHE WU ,  LIANG-HONG WANG

IPC: H02M3/335

CPC classification number: H02M7/217 ,  H02M1/08 ,  H02M1/14 ,  H02M1/34 ,  H02M3/335 ,  H02M3/33507 ,  H02M3/33592 ,  H02M2001/0048 ,  H02M2001/348 ,  H05K1/0203 ,  H05K1/092 ,  H05K1/111 ,  H05K1/117 ,  H05K1/141 ,  H05K1/181 ,  H05K2201/0355 ,  H05K2201/10166 ,  Y02B70/1475

Abstract: A power supply device includes a main unit and a power switching module. The main unit includes a primary circuit board, a transformer including a primary and a secondary coil, a primary-side circuit and a secondary-side circuit. The power switching module includes a separate PCB formed with at least two connection pads and two conductive tracks, and at least one power switching element disposed on the PCB and having two terminals respectively connected to the two connection pads through the two conductive tracks. The power switching module is in the form of a separate PCB that is electrically connected to the primary- or secondary-side circuits through the two connection pads.

Abstract translation: 电源装置包括主单元和电源开关模块。 主单元包括主电路板，包括初级和次级线圈的变压器，初级侧电路和次级侧电路。 电源开关模块包括形成有至少两个连接焊盘和两个导电轨道的单独PCB，以及设置在PCB上的至少一个电源开关元件，并且具有通过两个导电轨道分别连接到两个连接焊盘的两个端子。 电源开关模块是单独的PCB的形式，其通过两个连接焊盘电连接到初级或次级侧电路。

公开(公告)号：US20130222045A1

公开(公告)日：2013-08-29

申请号：US13405041

申请日：2012-02-24

Applicant: Yifeng Wu

Inventor： Yifeng Wu

IPC: H03K17/56 ,  H01L27/088 ,  H01L29/94

CPC classification number: H01L25/50 ,  H01L23/12 ,  H01L23/3675 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49844 ,  H01L23/552 ,  H01L23/642 ,  H01L25/074 ,  H01L25/117 ,  H01L25/16 ,  H01L25/165 ,  H01L27/0883 ,  H01L29/2003 ,  H01L29/7827 ,  H01L2224/48091 ,  H01L2924/13055 ,  H01L2924/30107 ,  H03K17/164 ,  H03K2217/0045 ,  H05K1/0218 ,  H05K1/0263 ,  H05K1/162 ,  H05K2201/10015 ,  H05K2201/10166 ,  H05K2201/10545 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An electronic component is described which includes a first transistor encased in a first package, the first transistor being mounted over a first conductive portion of the first package, and a second transistor encased in a second package, the second transistor being mounted over a second conductive portion of the second package. The component further includes a substrate comprising an insulating layer between a first metal layer and a second metal layer. The first package is on one side of the substrate with the first conductive portion being electrically connected to the first metal layer, and the second package is on another side of the substrate with the second conductive portion being electrically connected to the second metal layer. The first package is opposite the second package, with at least 50% of a first area of the first conductive portion being opposite a second area of the second conductive portion.

公开(公告)号：US20130194752A1

公开(公告)日：2013-08-01

申请号：US13361742

申请日：2012-01-30

Applicant: Carlo Baterna Marbella ,  Ganesh Vetrivel Periasamy ,  Kok Kiat Koo ,  Ai Min Tan

Inventor： Carlo Baterna Marbella ,  Ganesh Vetrivel Periasamy ,  Kok Kiat Koo ,  Ai Min Tan

IPC: H05K7/20 ,  H01L21/52 ,  H01L23/373

CPC classification number: H01L23/34 ,  H01L23/3121 ,  H01L23/49562 ,  H01L23/62 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/29101 ,  H01L2224/29116 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/00014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19107 ,  H05K1/0201 ,  H05K2201/0311 ,  H05K2201/10166 ,  H05K2203/176 ,  H01L2224/45099 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: In accordance with an embodiment, a semiconductor package includes a first surface configured to be mounted on a circuit board, and a region of thermally expandable material configured to push the first surface of the semiconductor package away from the circuit board when a temperature of the thermally expandable material exceeds a first temperature.

Abstract translation: 根据实施例，半导体封装包括被配置为安装在电路板上的第一表面和可热膨胀材料的区域，该区域被构造成当热电阻的温度推动半导体封装的第一表面远离电路板时 可膨胀材料超过第一温度。

公开(公告)号：US20130126590A1

公开(公告)日：2013-05-23

申请号：US13655555

申请日：2012-10-19

Applicant: STMICROELECTRONICS S.R.L.

Inventor： Concetto Privitera ,  Cristiano Gianluca Stella

IPC: B23K31/02

CPC classification number: H05K3/3468 ,  H05K1/0206 ,  H05K1/112 ,  H05K3/303 ,  H05K3/3431 ,  H05K2201/09836 ,  H05K2201/10166 ,  H05K2203/044 ,  Y02P70/613

Abstract: A system includes a device of the surface-mounting type having an insulating package provided with a mounting surface and a contact pin exposed on the mounting surface. The device is attached to an insulating board including a gluing surface and an opposite surface. The process for manufacturing the system includes forming through holes a contact region on the gluing surface. The mounting surface is glued to the gluing surface with the contact pin aligned with the contact region. Wave soldering is performed to electrically join the device to the board by hitting the opposite surface with a wave of soldering paste to form, by capillary action with the soldering paste ascending in the through holes up to the overflow on the gluing surface, a conductive contact electrically connecting the contact pin of the electronic device through a solder connection to the contact region of the electronic board.

Abstract translation: 一种系统包括表面安装型的装置，其具有设置有安装表面的绝缘封套和暴露在安装表面上的接触销。 该装置附接到包括胶合表面和相对表面的绝缘板。 制造该系统的方法包括在胶合表面上形成通孔的接触区域。 安装表面胶合到胶合表面，接触销与接触区域对准。 进行波峰焊接以通过用焊膏波撞击相对表面来将该装置电连接到板上，通过毛细作用形成通过在通孔中上升至焊接表面上的溢流的焊膏的导电接触 通过焊接连接将电子设备的接触针电连接到电子板的接触区域。

公开(公告)号：US20130119792A1

公开(公告)日：2013-05-16

申请号：US13741004

申请日：2013-01-14

Applicant: MAKITA CORPORATION

Inventor： Takeshi NISHIMIYA ,  Yutaka MATSUNAGA

IPC: H02K7/14 ,  H02K11/00

CPC classification number: H02K7/145 ,  B25F5/008 ,  H01L2924/0002 ,  H02K11/33 ,  H05K1/0203 ,  H05K7/20463 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/1056 ,  H01L2924/00

Abstract: An electrical power tool may include a switching device capable of controlling output power of a motor, a circuit board supporting the switching device, and a metal case receiving the circuit board. The switching device includes a conductive part and an insulated portion that is covered by an insulating covering material. The conductive part of the switching device contacts the circuit board. The insulated portion of the switching device contacts the metal case via the insulating covering material.

Abstract translation: 电动工具可以包括能够控制电动机的输出功率的开关装置，支撑开关装置的电路板以及接收电路板的金属壳体。 开关装置包括被绝缘覆盖材料覆盖的导电部分和绝缘部分。 开关装置的导电部分接触电路板。 开关装置的绝缘部分经由绝缘覆盖材料接触金属外壳。