公开(公告)号：US09196506B2

公开(公告)日：2015-11-24

申请号：US13632614

申请日：2012-10-01

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Hyung Jin Jeon ,  Jong In Ryu ,  Seung Wan Shin ,  Seon Hee Moon ,  Young Do Kweon ,  Seung Wook Park

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/46 ,  H05K3/24 ,  H05K3/42

CPC classification number: H01L21/486 ,  H01L21/4857 ,  H01L23/49822 ,  H01L23/49827 ,  H01L2225/06572 ,  H01L2924/0002 ,  H05K3/244 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4605 ,  H05K3/4644 ,  H05K2201/0979 ,  H05K2201/10378 ,  H01L2924/00

Abstract: A method for manufacturing an interposer includes forming a via hole in an insulation plate including a resin or a ceramic; simultaneously forming resists for a first upper redistribution layer on the top surface of the insulation plate, and a resistor for a lower redistribution layer on the bottom surface of the insulation plate; plating copper to fill the via hole and simultaneously forming the first upper redistribution layer and the lower redistribution layer along a designed circuit pattern; and forming a first upper protection layer and a lower protection layer to expose a portion of the first upper redistribution layer and a portion of the lower redistribution layer.

Abstract translation: 一种用于制造插入件的方法包括在包括树脂或陶瓷的绝缘板中形成通孔; 同时在绝缘板的顶表面上形成用于第一上再分配层的抗蚀剂，以及在绝缘板的底表面上的下再分布层的电阻器; 电镀铜以填充通孔并同时沿着设计的电路图形形成第一上再分配层和下再分布层; 以及形成第一上保护层和下保护层以暴露所述第一上再分布层的一部分和所述下再分布层的一部分。

公开(公告)号：US20150325529A1

公开(公告)日：2015-11-12

申请号：US14608482

申请日：2015-01-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Seung Yong CHOI

IPC: H01L23/552 ,  H01L21/50

CPC classification number: H05K1/181 ,  H01L21/50 ,  H01L21/561 ,  H01L21/563 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/5385 ,  H01L23/5389 ,  H01L23/552 ,  H01L24/97 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19106 ,  H05K1/023 ,  H05K2201/10371 ,  H05K2201/10378 ,  H05K2201/1056 ,  H05K2201/2018 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y02P70/611 ,  H01L2224/81 ,  H01L2924/00012

Abstract: An electronic device module includes a first substrate having at least one or more electronic devices mounted on one surface thereof, a second substrate bonded to one surface of the first substrate and including at least one device accommodating part having a space in which the electronic device is accommodated, and a shielding member disposed in the device accommodating part and accommodating at least one or more electronic devices therein.

Abstract translation: 电子设备模块包括具有安装在其一个表面上的至少一个或多个电子设备的第一基板，结合到第一基板的一个表面上的第二基板，并且包括至少一个装置容纳部件，该装置容纳部件具有电子装置 以及设置在所述设备容纳部分中并且容纳其中的至少一个或多个电子设备的屏蔽构件。

公开(公告)号：US09184527B2

公开(公告)日：2015-11-10

申请号：US13700639

申请日：2011-06-02

Applicant: James Rathburn

Inventor： James Rathburn

IPC: H01R13/24 ,  H01R12/70 ,  H05K7/10 ,  H01R13/66 ,  H01R43/20 ,  H01R12/52 ,  H05K3/36

CPC classification number: H01R13/24 ,  H01R12/52 ,  H01R12/7082 ,  H01R13/2421 ,  H01R13/66 ,  H01R43/20 ,  H05K3/361 ,  H05K3/368 ,  H05K7/1069 ,  H05K2201/0187 ,  H05K2201/10378 ,  Y10T29/4922

Abstract: A socket housing and method of making the socket housing. A plurality of dielectric layers are printed with a plurality of recesses on a substrate. The dielectric layers include at least two different dielectric materials. A sacrificial material is printed in the recesses. The assembly is removed from the substrate and the sacrificial material is removed from the recesses. At least one contact member is located in a plurality of the recesses. Distal ends of the contact members are adapted to electrically couple with circuit members.

Abstract translation: 插座壳体和制造插座壳体的方法。 多个电介质层在衬底上印有多个凹槽。 电介质层包括至少两种不同的介电材料。 牺牲材料印在凹槽中。 将组件从衬底移除，并且牺牲材料从凹部移除。 至少一个接触构件位于多个凹部中。 接触构件的远端适于与电路构件电耦合。

公开(公告)号：US09161438B2

公开(公告)日：2015-10-13

申请号：US13638518

申请日：2011-03-24

Applicant: Hidetoshi Masuda

Inventor： Hidetoshi Masuda

IPC: H05K1/02 ,  H05K1/03 ,  H05K1/18 ,  H01R43/00 ,  H05K3/32 ,  H05K3/34 ,  H01R13/24

CPC classification number: H05K1/0271 ,  H01R13/2414 ,  H01R43/007 ,  H05K1/03 ,  H05K1/0306 ,  H05K1/18 ,  H05K3/32 ,  H05K3/3431 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2201/10962 ,  Y02P70/611 ,  Y02P70/613

Abstract: A stress buffer sheet 10 is constituted by arranging external conductive layers 16A and 16B on the front and rear main surfaces of a through electrode layer 13. Columnar internal electrodes 14 are formed using a porous oxide base material 30 formed by anodic oxidation of valve metal; the oxide base material 30 is selectively removed after the internal electrodes 14 have been formed, and a resin 12 is filled in a resultant void space. The resin 12 has a small Young's modulus and can be deformed together with the internal electrode 14. In a structure having a wiring board 20 and an electronic component 24 connected through the stress buffer sheet 10, when stress acts on the joint portion during mounting of the electronic component 24, the whole of the through electrode layer 13 is deformed so that the stress is absorbed or released.

Abstract translation: 应力缓冲片10通过在贯通电极层13的前后主表面上配置外部导电层16A和16B构成。柱状内部电极14使用通过阀金属的阳极氧化形成的多孔氧化物基材30形成。 在形成内部电极14之后，选择性地去除氧化物基材30，并且在所得的空隙空间中填充树脂12。 树脂12具有小的杨氏模量并且可以与内部电极14一起变形。在具有通过应力缓冲片10连接的布线板20和电子部件24的结构中，当在安装时应力作用在接合部上 电子部件24，贯通电极层13的整体变形，使得应力被吸收或释放。

公开(公告)号：US09110130B2

公开(公告)日：2015-08-18

申请号：US13178501

申请日：2011-07-08

Applicant: Ming-Chi Chen ,  Horng-Kuang Fan ,  Mao-Fa Shen ,  Ming-Chu Chueh ,  Bang-Shun Liu ,  Che-Wei Lin

Inventor： Ming-Chi Chen ,  Horng-Kuang Fan ,  Mao-Fa Shen ,  Ming-Chu Chueh ,  Bang-Shun Liu ,  Che-Wei Lin

IPC: G01R31/00 ,  G01R31/28 ,  G11B5/455

CPC classification number: G01R31/2889 ,  G11B5/455 ,  H05K2201/10378 ,  Y10T156/1057

Abstract: A probe head of vertical probe card and a manufacturing method of a composite board thereof are provided. The probe head includes guide plate, composite board, and probe pin. The composite board includes first board layer and second board layer which are laminated together by joining operation. The composite board further includes through hole which is made by drilling and passed all the way through the first board layer and the second board layer. The friction coefficient of the first board layer is less than that of the second board layer, and the thermal expansion coefficient of the second board layer is less than that of the first board layer. The probe pin is penetrated all the way through the through hole of the composite board. By this, friction between the probe pin and composite board is reduced so as to stabilize the position of the probe pin.

Abstract translation: 提供了垂直探针卡的探针头及其复合板的制造方法。 探头包括导板，复合板和探针。 复合板包括通过接合操作层压在一起的第一板层和第二板层。 复合板还包括通过钻孔制成的通孔，并且穿过第一板层和第二板层。 第一基板层的摩擦系数小于第二基板层的摩擦系数，第二基板层的热膨胀系数小于第一基板层的热膨胀系数。 探头针一直穿过复合板的通孔。 由此，探针和复合板之间的摩擦减小，从而稳定探针的位置。

公开(公告)号：US09101077B2

公开(公告)日：2015-08-04

申请号：US13722282

申请日：2012-12-20

Applicant: STMicroelectronics (Grenoble 2) SAS

Inventor： Jean-Michel Riviere ,  Karine Saxod

IPC: H05K7/20 ,  H01L23/34 ,  G01F1/20 ,  G06F1/20

CPC classification number: H05K7/20 ,  G01F1/20 ,  H01L23/34 ,  H01L23/4334 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H05K1/0209 ,  H05K3/284 ,  H05K7/20436 ,  H05K2201/10378 ,  H05K2201/10734 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic component package includes a support and heat conductor. The heat conductor has a protuberance and the support has a socket arranged to be able to receive the protuberance so that the movement of heat conductor relative to the support during the assembly process is reduced.

Abstract translation: 电子部件封装包括支撑件和导热体。 热导体具有突起，并且支撑件具有布置成能够容纳突起的插座，使得在组装过程期间热导体相对于支撑件的移动减小。

公开(公告)号：US09095066B2

公开(公告)日：2015-07-28

申请号：US12483102

申请日：2009-06-11

Applicant: Naoto Kusumoto

Inventor： Naoto Kusumoto

IPC: H05K3/34 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/111 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3431 ,  H05K3/3442 ,  H05K2201/049 ,  H05K2201/09381 ,  H05K2201/09427 ,  H05K2201/10121 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2203/048 ,  Y02P70/611 ,  Y02P70/613

Abstract: A printed board is provided, which includes at least a first connecting electrode and a second connecting electrode. A solder is provided over the first connecting electrode and the second connecting electrode, and a chip component is provided over the solder. The chip component includes a first terminal electrode and a second terminal electrode. The first connecting electrode is overlapped with the first terminal electrode and is electrically connected to the first terminal electrode through the solder. The second connecting electrode is overlapped with the second terminal electrode and is electrically connected to the second terminal electrode through the solder. Two corner portions of each of the first connecting electrode and the second connecting electrode are overlapped with two corner portions of each of the first terminal electrode and the second terminal electrode.

Abstract translation: 提供了一种印刷电路板，其包括至少第一连接电极和第二连接电极。 在第一连接电极和第二连接电极之上提供焊料，并且在焊料上方设置芯片部件。 芯片部件包括第一端子电极和第二端子电极。 第一连接电极与第一端子电极重叠，并通过焊料与第一端子电极电连接。 第二连接电极与第二端子电极重叠，并且通过焊料与第二端子电极电连接。 第一连接电极和第二连接电极的两个角部与第一端子电极和第二端子电极的两个角部重叠。

公开(公告)号：US20150179476A1

公开(公告)日：2015-06-25

申请号：US14641887

申请日：2015-03-09

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US20150179475A1

公开(公告)日：2015-06-25

申请号：US14641918

申请日：2015-03-09

Applicant: Unimicron Technology Corporation

Inventor： Tzyy-Jang Tseng ,  Dyi-Chung Hu ,  Ying-Chih Chan

IPC: H01L21/48

CPC classification number: H01L23/49838 ,  H01L21/486 ,  H01L21/4867 ,  H01L21/56 ,  H01L21/563 ,  H01L21/768 ,  H01L23/3128 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L24/16 ,  H01L25/0655 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/115 ,  H05K2201/10378 ,  H01L2224/16225 ,  H01L2924/00 ,  H01L2924/014

Abstract: A through-holed interposer is provided, including a board body, a conductive gel formed in the board body, and a circuit redistribution structure disposed on the board body. The conductive gel has one end protruding from a surface of the board body, and an area of the protruded end of the conductive gel that is in contact with other structures (e.g., packaging substrates or circuit structures) is increased, thereby strengthening the bonding of the conductive gel and reliability of the interposer.

Abstract translation: 提供了一种贯穿孔插入器，包括板体，形成在板体中的导电凝胶，以及布置在板体上的电路再分布结构。 导电性凝胶具有从板体的表面突出的一端，与其他结构（例如，封装基板或电路结构）接触的导电性凝胶的突出部的面积增加，从而加强 导电凝胶和插层的可靠性。

公开(公告)号：US20150162301A1

公开(公告)日：2015-06-11

申请号：US14276320

申请日：2014-05-13

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Huei-Nuan Huang ,  Mu-Hsuan Chan ,  Chun-Tang Lin

IPC: H01L23/00 ,  H01L21/78 ,  H01L21/56

CPC classification number: H01L21/78 ,  H01L21/4846 ,  H01L21/4853 ,  H01L21/561 ,  H01L21/568 ,  H01L21/6836 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/5384 ,  H01L23/5385 ,  H01L24/13 ,  H01L24/16 ,  H01L24/92 ,  H01L24/95 ,  H01L25/0655 ,  H01L2221/68331 ,  H01L2221/68372 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/81005 ,  H01L2224/92 ,  H01L2224/95 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3841 ,  H05K1/181 ,  H05K3/284 ,  H05K2201/10378 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2221/68304 ,  H01L21/56 ,  H01L21/304 ,  H01L2221/68381

Abstract: A method for fabricating a semiconductor package is provided, which includes the steps of: providing a carrier having at least a semiconductor chip disposed thereon, the semiconductor chip having a first surface attached to the carrier, and an opposite second surface having a plurality of first conductive elements thereon; disposing an interposer on the first conductive elements, wherein the interposer has opposite third and fourth surfaces, the interposer is disposed on the first conductive elements via the third surface, and a plurality of conductive posts are embedded in the interposer and electrically connected to the third surface; forming an encapsulant on the carrier for encapsulating the semiconductor chip and the interposer; removing a portion of the encapsulant from the upper surface thereof and a portion of the interposer from the fourth surface thereof to expose ends of the conductive posts; and removing the carrier, thereby improving the connection quality between the semiconductor chip and the interposer.

Abstract translation: 提供一种制造半导体封装的方法，其包括以下步骤：提供至少具有其上设置的半导体芯片的载体，所述半导体芯片具有附接到载体的第一表面，以及相对的第二表面，具有多个第一 导电元件; 在所述第一导电元件上设置插入件，其中所述插入件具有相对的第三和第四表面，所述插入件经由所述第三表面设置在所述第一导电元件上，并且多个导电柱嵌入所述插入件中并电连接到所述第三导电元件 表面; 在载体上形成密封剂以封装半导体芯片和插入件; 从其上表面去除所述密封剂的一部分和从所述第四表面移除所述插入件的一部分以暴露所述导电柱的端部; 并移除载体，从而提高半导体芯片和插入件之间的连接质量。