公开(公告)号：US07375970B2

公开(公告)日：2008-05-20

申请号：US11775125

申请日：2007-07-09

Applicant: Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

Inventor： Robert S. Pauley ,  Jayesh R. Bhakta ,  William M. Gervasi ,  Chi She Chen ,  Jose Delvalle

IPC: H05K7/20

CPC classification number: H05K1/0203 ,  H05K1/144 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/2018 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: A module is electrically connectable to a computer system. The module includes at least one multilayer structure having a plurality of electrical contacts which are electrically connectable to the computer system. The module further includes a first printed circuit board coupled to the at least one multilayer structure. The first printed circuit board has a first surface and a first plurality of components mounted on the first surface. The first plurality of components is in electrical communication with the electrical contacts. The module further includes a second printed circuit board coupled to the at least one multilayer structure. The second printed circuit board has a second surface and a second plurality of components mounted on the second surface. The second plurality of components is in electrical communication with the electrical contacts. The second surface of the second printed circuit board faces the first surface of the first printed circuit board. The module further includes at least one thermally conductive layer positioned between the first plurality of components and the second plurality of components. The at least one thermally conductive layer is in thermal communication with the first plurality of components, the second plurality of components, and the electrical contacts.

Abstract translation: 模块可电连接到计算机系统。 模块包括至少一个多层结构，其具有可电连接到计算机系统的多个电触点。 该模块还包括耦合到至少一个多层结构的第一印刷电路板。 第一印刷电路板具有安装在第一表面上的第一表面和第一多个部件。 第一组多个组件与电触点电连通。 该模块还包括耦合到至少一个多层结构的第二印刷电路板。 第二印刷电路板具有安装在第二表面上的第二表面和第二多个部件。 第二组件与电触点电连通。 第二印刷电路板的第二表面面向第一印刷电路板的第一表面。 模块还包括位于第一多个部件和第二多个部件之间的至少一个导热层。 所述至少一个导热层与所述第一多个部件，所述第二多个部件和所述电触点热连通。

公开(公告)号：US20080074829A1

公开(公告)日：2008-03-27

申请号：US11902379

申请日：2007-09-21

Applicant: Atsushi Kashiwazaki

Inventor： Atsushi Kashiwazaki

IPC: H02B1/24

CPC classification number: H05K1/181 ,  H01L23/4334 ,  H01L23/49531 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/16 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/0306 ,  H05K1/167 ,  H05K3/0061 ,  H05K3/284 ,  H05K2201/09745 ,  H05K2201/1034 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2201/10924 ,  H05K2203/049 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: An electronic controller having a circuit board with an element disposed thereon, a base member with the circuit board adhered thereon and a lead terminal in an electrical connection with the circuit board includes as the elements thick film resistors and electric components soldered by solder on a bottom side of the circuit board, and also includes electronic components including bare chips being at least wired without soldering on a top surface of the circuit board. The electronic controller has a first concave portion at a position corresponding to a position of the components on a surface that has the circuit board of the base member adhered thereon, and the circuit board is molded by a sealing resin so as to expose a portion of the base member and a portion of the lead terminal.

Abstract translation: 一种电子控制器，具有设置在其上的元件的电路板，其上附着有电路板的基座构件和与电路板电连接的引线端子包括作为元件的厚膜电阻器和焊接在底部的焊料的电气部件 并且还包括电子部件，包括至少布线的裸芯片，而不在电路板的顶表面上焊接。 该电子控制器在对应于在其上附着有基底部件的电路板的表面上的部件的位置处的位置处具有第一凹部，并且电路板由密封树脂模制以暴露部分 基座部件和引线端子的一部分。

公开(公告)号：US20070297155A1

公开(公告)日：2007-12-27

申请号：US11475532

申请日：2006-06-27

Applicant: Daniel Justin Hebel ,  Clifford Allen Gaw ,  Brinda Kumar Ramaiya ,  James Stephen Rutledge

Inventor： Daniel Justin Hebel ,  Clifford Allen Gaw ,  Brinda Kumar Ramaiya ,  James Stephen Rutledge

IPC: H05K7/00

CPC classification number: H05K1/0204 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/1056 ,  H05K2201/10689

Abstract: Heat from the core of a semiconductor chip package mounted on a printed circuit board assembled into0 a computer system is dissipated to both sides of the printed circuit board.

Abstract translation: 安装在组装在计算机系统上的印刷电路板上的半导体芯片封装的芯体的热量散发到印刷电路板的两侧。

公开(公告)号：US20070279842A1

公开(公告)日：2007-12-06

申请号：US11755020

申请日：2007-05-30

Applicant: Yuichi ISHIDA ,  Masaaki ISHIGURO ,  Kazuaki NAKAMURA

Inventor： Yuichi ISHIDA ,  Masaaki ISHIGURO ,  Kazuaki NAKAMURA

IPC: H02B1/00

CPC classification number: B60R16/0239 ,  H05K1/0204 ,  H05K1/021 ,  H05K1/056 ,  H05K1/182 ,  H05K2201/066 ,  H05K2201/10181 ,  H05K2201/10416 ,  H05K2201/1056 ,  H05K2201/1059

Abstract: An electrical connection box includes a circuit substrate on which an electrical component is mounted, a case which is adapted to cover the circuit substrate, and a heat radiation member which is directly attached to the electrical component.

Abstract translation: 电连接盒包括其上安装有电气部件的电路基板，适于覆盖电路基板的壳体和直接附接到电气部件的散热构件。

公开(公告)号：US20070230139A1

公开(公告)日：2007-10-04

申请号：US11754211

申请日：2007-05-25

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H05K7/20

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The semiconductor module includes a heat spreader, two semiconductors that include circuitry, a termination resistor, an array of electrical contact points, and a plurality of electrically conductive leads. The semiconductors are thermally coupled to the heat spreader. The terminator resistor is electrically coupled to the circuitry of at least one of the semiconductors. The array of electrical contact points are coupled to the heat spreader. The conductive leads are electrically connected to the semiconductors and the array of electrical contact points. At least one of the leads is common to both of the semiconductors.

Abstract translation: 半导体模块包括散热器，包括电路的两个半导体，终端电阻器，电接触点阵列以及多个导电引线。 半导体热耦合到散热器。 终端电阻器电耦合到至少一个半导体的电路。 电触点阵列耦合到散热器。 导电引线电连接到半导体和电接触点阵列。 至少一个引线对于这两个半导体都是共同的。

公开(公告)号：US20070230134A1

公开(公告)日：2007-10-04

申请号：US11754212

申请日：2007-05-25

Applicant: Belgacem Haba

Inventor： Belgacem Haba

IPC: H05K7/20

CPC classification number: H01L23/647 ,  H01L23/36 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L23/552 ,  H01L24/86 ,  H01L25/0655 ,  H01L25/0657 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06527 ,  H01L2225/06551 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/12032 ,  H01L2924/14 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/0246 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10022 ,  H05K2201/1056 ,  H05K2201/10674 ,  H01L2924/00

Abstract: The semiconductor module includes a heat spreader, first and second sets of two semiconductors that include circuitry and are thermally coupled to the heat spreader, first and second termination resistors, and first and second sets of electrically conductive leads. The first termination resistor is coupled to the circuitry at the first set of semiconductors, while the second termination resistor is coupled to the circuitry of the second set of semiconductors. The first set of leads connect to the first set of semiconductors and has at least one lead that is common to both of the semiconductors of the first set of semiconductors. The second set of leads connect to the second set of semiconductors and has at least one lead that is common to both of the semiconductors of the second set of semiconductors.

Abstract translation: 半导体模块包括散热器，包括电路的第一和第二组两个半导体，并且热耦合到散热器，第一和第二终端电阻器以及第一和第二组导电引线。 第一终端电阻器耦合到第一组半导体的电路，而第二终端电阻器耦合到第二组半导体的电路。 第一组引线连接到第一组半导体，并且具有至少一个与第一组半导体的半导体的半导体共同的引线。 第二组引线连接到第二组半导体，并且具有至少一个与第二组半导体的半导体的半导体共同的引线。

公开(公告)号：US20070139897A1

公开(公告)日：2007-06-21

申请号：US11311701

申请日：2005-12-19

Applicant: Siva RaghuRam

Inventor： Siva RaghuRam

IPC: H05K7/20

CPC classification number: H01L23/3672 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/117 ,  H05K1/144 ,  H05K7/20509 ,  H05K2201/1056 ,  H01L2924/00

Abstract: A circuit board arrangement includes a heat dissipater. A cooling body is arranged near a first circuit board and a second circuit board. Both circuit boards have electronic devices on two major surfaces. The cooling body is arranged between the electronic devices on one surface of the first circuit board and the electronic devices on one surface of the second circuit board. The circuit boards are supported by fixing elements of the cooling body.

Abstract translation: 电路板装置包括散热器。 冷却体设置在第一电路板和第二电路板附近。 两个电路板在两个主要表面上都有电子设备。 冷却体设置在第一电路板的一个表面上的电子设备和第二电路板的一个表面上的电子设备之间。 电路板由冷却体的固定元件支撑。

公开(公告)号：US20070086187A1

公开(公告)日：2007-04-19

申请号：US11538769

申请日：2006-10-04

Applicant: Robert Raos ,  Nilesh Desai ,  Steven Flank

Inventor： Robert Raos ,  Nilesh Desai ,  Steven Flank

IPC: F21V21/00

CPC classification number: G09F9/33 ,  G09F13/20 ,  H05K1/0209 ,  H05K3/28 ,  H05K2201/064 ,  H05K2201/0989 ,  H05K2201/10106 ,  H05K2201/1056 ,  H05K2203/081 ,  H05K2203/1178

Abstract: A light emitting diode (LED) assembly with a vented printed circuit board is disclosed. A printed circuit board assembly may include a plurality of LED modules disposed in an array with a multilayered substrate and a plurality of vents. The multilayer substrate may include a thermal cooling layer which is in thermal communication with the LED modules for heat dissipation. The multilayer substrate may include one or more electrical power layers in electrical communication with the LED modules for energizing the LEDs. The multilayered substrate may have an external insulating layer that includes a plurality of fluid apertures configured for fluid communication with the thermal cooling layer.

公开(公告)号：US20060281230A1

公开(公告)日：2006-12-14

申请号：US11150997

申请日：2005-06-13

Applicant: Scott Brandenburg ,  David Laudick

Inventor： Scott Brandenburg ,  David Laudick

IPC: H01L21/00

CPC classification number: H01L23/3121 ,  H01L23/4334 ,  H01L25/0652 ,  H01L25/162 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/19041 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/284 ,  H05K5/0034 ,  H05K7/20854 ,  H05K2201/09063 ,  H05K2201/09745 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2224/05599 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is provided. The IC die is electrically connected to one or more of a plurality of electrically conductive traces formed on the first side of the substrate. The substrate includes a hole approximate an outer edge of the IC die. The first side of the substrate is then positioned in contact with at least a portion of the first side of the backplate. The IC die is positioned within the cavity with a second side of the IC die in thermal contact with the backplate. The substrate and at least a portion of the backplate are overmolded with an overmold material, which enters the cavity through the hold to substantially underfill the IC die and substantially fill an unoccupied portion of the cavity.

公开(公告)号：US20060261449A1

公开(公告)日：2006-11-23

申请号：US11131835

申请日：2005-05-18

Applicant: Russell Rapport ,  Paul Goodwin ,  James Cady

Inventor： Russell Rapport ,  Paul Goodwin ,  James Cady

IPC: H01L23/495

CPC classification number: H05K1/117 ,  G11C5/04 ,  H01L2924/0002 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/4691 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A circuit module is provided in which two secondary substrates or cards or the rigid portions of a rigid flex assembly are populated with integrated circuits (ICs). The secondary substrates are connected with flexible circuitry. One side of the flexible circuitry exhibits contacts adapted for connection to an edge connector. The flexible circuitry is wrapped about an edge of a preferably metallic substrate to dispose one of the two secondary substrates on a first side of the substrate and the other of the secondary substrates on the second side of the substrate.

Abstract translation: 提供了一种电路模块，其中两个辅助基板或卡或刚性柔性组件的刚性部分填充有集成电路（IC）。 辅助基板与柔性电路连接。 柔性电路的一侧具有适于连接到边缘连接器的触点。 柔性电路围绕优选金属衬底的边缘缠绕，以将两个次要衬底中的一个设置在衬底的第一侧上，并且在衬底的第二侧上设置另一个辅助衬底。