Capacitor holder, and capacitor holding structure
    112.
    发明授权
    Capacitor holder, and capacitor holding structure 有权
    电容器支架和电容器支架结构

    公开(公告)号:US09596763B2

    公开(公告)日:2017-03-14

    申请号:US14442105

    申请日:2013-10-29

    Inventor: Tatsuya Nakamura

    Abstract: A capacitor holder comprises: a holding portion having a cylindrical inner wall surface, at least an outer peripheral portion of the inner wall surface being open, the holding portion being configured to hold a capacitor inserted through the opening into an inside of the inner wall surface; a fixed portion formed integrally with the holding portion and positioned opposite to the opening of the holding portion; a pair of fitting grooves formed at a pair of end surfaces of the fixed portion opposed to each other adjacent to the holding portion, the fitting grooves being configured to fittably engage with end edges of a printed circuit board to extend along a surface of the printed circuit board; and a proximity suppressor configured to suppress portions of the fixed portion where the fitting grooves are formed from being brought into proximity each other.

    Abstract translation: 电容器保持器包括:具有圆筒形内壁表面的保持部分,内壁表面的至少外周部分是开放的,保持部分构造成将通过开口插入的电容器保持在内壁表面的内部 ; 与所述保持部一体形成并与所述保持部的开口相对定位的固定部; 一对嵌合槽,形成在所述固定部分的相对于所述保持部分相对的一对端面处,所述嵌合槽被配置为与所述印刷电路板的端部边缘适配地接合以沿着所述印刷电路板的表面延伸 电路板; 以及接近抑制器,被配置为抑制形成有嵌合槽的固定部分的彼此接近的部分。

    ASSEMBLY ARCHITECTURE EMPLOYING ORGANIC SUPPORT FOR COMPACT AND IMPROVED ASSEMBLY THROUGHPUT
    113.
    发明申请
    ASSEMBLY ARCHITECTURE EMPLOYING ORGANIC SUPPORT FOR COMPACT AND IMPROVED ASSEMBLY THROUGHPUT 审中-公开
    组装结构为有力的支持和改进的组装通过

    公开(公告)号:US20160360618A1

    公开(公告)日:2016-12-08

    申请号:US14778027

    申请日:2014-12-26

    Abstract: An apparatus including a substrate including a first side and an opposite second side; at least one first circuit device on the first side of the substrate, at least one second device on the second side of the substrate; and a support on the second side of the substrate, the support including interconnections connected to the at least one first and second circuit device, the support having a thickness dimension operable to define a dimension from the substrate greater than a thickness dimension of the at least one second circuit device. A method including disposing at least one first circuit component on a first side of a substrate; disposing at least one second circuit component on a second side of the substrate; and coupling a support to the substrate, the substrate defining a dimension from the substrate greater than a thickness dimension of the at least one second circuit component.

    Abstract translation: 一种装置,包括:基板,包括第一侧和相对的第二侧; 在衬底的第一侧上的至少一个第一电路器件,在衬底的第二侧上的至少一个第二器件; 以及在所述基板的第二侧上的支撑件,所述支撑件包括连接到所述至少一个第一和第二电路装置的互连件,所述支撑件具有可操作以从所述基板限定大于所述至少一个第一和第二电路装置的厚度尺寸的尺寸的厚度尺寸 一秒电路装置。 一种方法,包括在衬底的第一侧上布置至少一个第一电路部件; 在所述基板的第二侧上布置至少一个第二电路部件; 以及将支撑件耦合到所述衬底,所述衬底限定来自所述衬底的尺寸大于所述至少一个第二电路部件的厚度尺寸。

    Method of manufacturing a printed circuit board including a component located in a via
    114.
    发明授权
    Method of manufacturing a printed circuit board including a component located in a via 有权
    制造包括位于通孔中的部件的印刷电路板的方法

    公开(公告)号:US09137898B2

    公开(公告)日:2015-09-15

    申请号:US13243251

    申请日:2011-09-23

    Applicant: Gary D. Frasco

    Inventor: Gary D. Frasco

    Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

    Abstract translation: 压配合的无源部件,例如电阻器或电容器,适于装配在印刷电路板的通孔内或部分位于印刷电路板的通孔内。 在一个示例中,压配合无源部件具有在本体的任一端具有可焊接端子的圆柱形体,以及至少部分地围绕圆柱形主体设置的介电轴颈。 将部件放置在通孔中并进行焊接,以便提供与印刷电路板的机械和电连接。

    METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD INCLUDING A COMPONENT LOCATED IN A VIA
    118.
    发明申请
    METHOD OF MANUFACTURING A PRINTED CIRCUIT BOARD INCLUDING A COMPONENT LOCATED IN A VIA 有权
    制造印刷电路板的方法,包括位于威盛的组件

    公开(公告)号:US20120005892A1

    公开(公告)日:2012-01-12

    申请号:US13243251

    申请日:2011-09-23

    Applicant: Gary D. Frasco

    Inventor: Gary D. Frasco

    Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body. The component is placed in the via and soldered in order to provide a mechanical and electrical connection to the printed circuit board.

    Abstract translation: 压配合的无源部件,例如电阻器或电容器,适于装配在印刷电路板的通孔内或部分位于印刷电路板的通孔内。 在一个示例中,压配合无源部件具有在本体的任一端具有可焊接端子的圆柱形体,以及至少部分地围绕圆柱形主体设置的介电轴颈。 将部件放置在通孔中并进行焊接,以便提供与印刷电路板的机械和电连接。

    Press fit passive component
    119.
    发明授权
    Press fit passive component 有权
    压配合无源元件

    公开(公告)号:US08064214B2

    公开(公告)日:2011-11-22

    申请号:US11969401

    申请日:2008-01-04

    Applicant: Gary D Frasco

    Inventor: Gary D Frasco

    Abstract: A press fit passive component, such as a resistor or capacitor, adapted to fit within, or partially within, a via of a printed circuit board. In one example, the press fit passive component has a cylindrically shaped body with solderable terminals at either end of the body, and a dielectric collar disposed at least partially about the cylindrically shaped body.

    Abstract translation: 压配合的无源部件,例如电阻器或电容器,适于装配在印刷电路板的通孔内或部分位于印刷电路板的通孔内。 在一个示例中,压配合无源部件具有在本体的任一端具有可焊接端子的圆柱形体,以及至少部分地围绕圆柱形主体设置的介电轴颈。

    Embedding an electronic component between surfaces of a printed circuit board
    120.
    发明授权
    Embedding an electronic component between surfaces of a printed circuit board 有权
    在电路板的表面之间嵌入电子部件

    公开(公告)号:US07782629B2

    公开(公告)日:2010-08-24

    申请号:US11828196

    申请日:2007-07-25

    Abstract: A pre-drilled hole, providing a passageway between an upper and a lower surface of a printed circuit board layer, receives a passive component, for example a resistor or a capacitor. In one embodiment the component is cylindrical, with an electrically conductive contact point at each end. The hole diameter is approximately the same as the diameter of the cylindrical component. The hole is similar to a via in a printed circuit board, except that the hole is not plated through (such would cause an electrical short). Electrically conductive lines are provided to the openings of the hole on the upper and the lower surfaces of the PCB. The area of the exposed end of the cylindrical component and the termination of the conducting line is less than the area of a surface mounted component equivalent to the cylindrical component. In some embodiments the hole and inserted component are located directly below a pin pad for a surface mounted device, for example an integrated circuit, providing the equivalent of zero wire and line lengths with no net increase in printed circuit board area.

    Abstract translation: 在印刷电路板层的上表面和下表面之间提供通道的预钻孔接收无源元件,例如电阻器或电容器。 在一个实施例中,部件是圆柱形的,在每个端部具有导电接触点。 孔直径与圆柱形部件的直径大致相同。 该孔与印刷电路板中的通孔类似,不同之处在于孔不通电(这将导致电气短路)。 导电线设置在PCB的上表面和下表面上的孔的开口处。 圆柱形部件的露出端的面积和导线的终端小于与圆柱形部件相当的表面安装部件的面积。 在一些实施例中,孔和插入部件直接位于用于表面安装器件(例如集成电路)的针焊盘的正下方,提供零线和线长度的等效线,而印刷电路板面积没有增加。

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