公开(公告)号：US20080121343A1

公开(公告)日：2008-05-29

申请号：US12015374

申请日：2008-01-16

Applicant: Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

Inventor： Adam L. Cohen ,  Michael S. Lockard ,  Kieun Kim ,  Qui T. Le ,  Gang Zhang ,  Uri Frodis ,  Dale S. McPherson ,  Dennis R. Smalley

IPC: B32B38/10

CPC classification number: C25D5/022 ,  B81C1/00126 ,  B81C2201/0109 ,  B81C2201/019 ,  C23C18/1605 ,  C23C18/1651 ,  C25D1/003 ,  Y10T156/11 ,  Y10T156/19

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations. Other embodiments are directed to the electrochemical fabrication of multilayer mesoscale or microscale structures which are formed using at least one conductive structural material, at least one conductive sacrificial material, and at least one dielectric material. In some embodiments the dielectric material is a UV-curable photopolymer.

Abstract translation: 本发明的一些实施例涉及在电介质或部分电介质基底上建立单层或多层结构的技术。 某些实施方案将种子层材料直接沉积到基底材料上，而其它实施例使用中间粘合层材料。 一些实施例使用不同种子层材料和/或用于牺牲和结构导电建筑材料的粘合层材料。 一些实施例将种子层和/或粘合层材料应用于有选择性的方式，而其它实施例以毯子的方式应用材料。 一些实施例通过平面化操作去除外来沉积物（例如沉积到不想要形成层的一部分的区域），而其他实施例通过蚀刻操作去除外来材料。 其它实施方案涉及使用至少一种导电结构材料，至少一种导电牺牲材料和至少一种电介质材料形成的多层中尺度或微结构结构的电化学制造。 在一些实施方案中，电介质材料是可UV固化的光聚合物。

公开(公告)号：US20070206267A1

公开(公告)日：2007-09-06

申请号：US11367098

申请日：2006-03-02

Applicant: Ming-Hau Tung ,  Lior Kogut

Inventor： Ming-Hau Tung ,  Lior Kogut

IPC: G02B26/00

CPC classification number: B81C1/00801 ,  B81B3/001 ,  B81B3/0072 ,  B81B2201/042 ,  B81C2201/0109 ,  B81C2201/017 ,  B81C2201/112 ,  B81C2201/115 ,  G02B26/001 ,  Y10T428/30 ,  Y10T428/31678 ,  Y10T428/31935

Abstract: Methods of forming a protective coating on one or more surfaces of a microelectromechanical device are disclosed comprising the steps of forming a composite layer of a sacrificial material and a protective material, and selectively etching the sacrificial material to form a protective coating. The protective coatings of the invention preferably improve one or more aspects of the performance of the microelectromechanical devices in which they are incorporated. Also disclosed are microelectromechanical devices formed by methods of the invention, and visual display devices incorporating such devices.

Abstract translation: 公开了在微机电装置的一个或多个表面上形成保护涂层的方法，其包括以下步骤：形成牺牲材料和保护材料的复合层，并选择性地蚀刻牺牲材料以形成保护涂层。 本发明的保护性涂层优选地改进了其中并入其中的微机电装置的性能的一个或多个方面。 还公开了通过本发明的方法形成的微机电装置以及包括这种装置的视觉显示装置。

公开(公告)号：US20070138582A1

公开(公告)日：2007-06-21

申请号：US11312619

申请日：2005-12-20

Applicant: Peter Nystrom ,  Nancy Jia ,  Kee Ryu

Inventor： Peter Nystrom ,  Nancy Jia ,  Kee Ryu

IPC: H01L29/84

CPC classification number: B81C1/00801 ,  B41J2/14 ,  B41J2/16 ,  B41J2/1626 ,  B41J2/1639 ,  B41J2002/043 ,  B81B2201/052 ,  B81C2201/0109 ,  B81C2201/0133 ,  B81C2201/014

Abstract: This describes a starting structure and method for forming a micro-mechanical device. These devices have several uses in both government and commercial applications. The starting structure can be sold or supplied to others who will then make a final product, or it can be used directly to make a final product. An appropriate use of this starting structure is to make deformable devices useful in an inkjet printing device.

Abstract translation: 这描述了用于形成微机械装置的起始结构和方法。 这些设备在政府和商业应用中都有多种用途。 起始结构可以出售或提供给随后制造最终产品的其他人，或者可以直接用于制造最终产品。 适当地使用该起始结构是使可变形装置在喷墨打印装置中有用。

公开(公告)号：US20070128831A1

公开(公告)日：2007-06-07

申请号：US10572554

申请日：2004-09-12

Applicant: Naomasa Oka ,  Hiroshi Harada ,  Jun Ogihara ,  Hiroshi Fukshima ,  Hiroshi Noge ,  Yuji Suzuki ,  Kiyohiko Kawano ,  Takaaki Yoshihara ,  Masahiko Suzumura

Inventor： Naomasa Oka ,  Hiroshi Harada ,  Jun Ogihara ,  Hiroshi Fukshima ,  Hiroshi Noge ,  Yuji Suzuki ,  Kiyohiko Kawano ,  Takaaki Yoshihara ,  Masahiko Suzumura

IPC: H01L21/30

CPC classification number: G02B26/0816 ,  B81B3/0086 ,  B81B2201/033 ,  B81B2201/045 ,  B81C1/00484 ,  B81C2201/0109 ,  B81C2201/019 ,  G02B6/3516 ,  G02B6/3518 ,  G02B6/3546 ,  G02B6/355 ,  G02B6/357 ,  G02B6/3584 ,  H02N1/008

Abstract: A process for fabricating a micro-electro-mechanical system (MEMS) composed of fixed components fixedly supported on a lower substrate and movable components movably supported on the lower substrate. The process utilizes an upper substrate separate from the lower substrate. The upper substrate is selectively etched in its top layer to form therein a plurality of posts which project commonly from a bottom layer of the upper substrate. The posts include the fixed components to be fixed to the lower substrate and the movable components which are resiliently supported only to one or more of the fixed components to be movable relative to the fixed components. The lower substrate is formed in its top surface with at least one recess. The upper substrate is then bonded to the top of the lower substrate upside down in such a manner as to place the fixed components directly on the lower substrate and to place the movable components upwardly of the recess. Finally, the bottom layer of the upper substrate is removed to release the movable components from the bottom layer for floating the movable components above the recess and allowing them to move relative to the lower substrate, while keeping the fixed components fixed to the top of the lower substrate.

Abstract translation: 一种用于制造由固定地支撑在下基板上的固定部件和可移动地支撑在下基板上的可移动部件的微机电系统（MEMS）的制造方法。 该方法利用与下基板分开的上基板。 在其顶层中选择性地蚀刻上基板，以在其中形成多个从上基板的底层共同突出的柱。 支柱包括要固定到下基板的固定部件和仅弹性地支撑到一个或多个固定部件以相对于固定部件可移动的可动部件。 下基板在其顶表面上形成有至少一个凹部。 然后将上基板以这样的方式上下连接到下基板的顶部，以将固定部件直接放置在下基板上并将可移动部件放置在凹部的上方。 最后，去除上基板的底层以从底层释放可移动部件，用于使可移动部件浮动在凹部上方并允许​​它们相对于下基板移动，同时保持固定部件固定在 下基板。

公开(公告)号：US20070090474A1

公开(公告)日：2007-04-26

申请号：US11222547

申请日：2005-09-08

Applicant: Gary Li ,  Bishnu Gogoi ,  Hemant Desai ,  Jonathan Hammond ,  Bernard Diem

Inventor： Gary Li ,  Bishnu Gogoi ,  Hemant Desai ,  Jonathan Hammond ,  Bernard Diem

IPC: H01L29/82

CPC classification number: B81B3/0078 ,  B81B2203/0118 ,  B81C2201/0109 ,  B81C2201/0167

Abstract: A MEMS device and method of fabrication including a plurality of structural tie bars for added structural integrity. The MEMS device includes an active layer and a substrate having an insulating material formed therebetween, first and second pluralities of stationary electrodes and a plurality of moveable electrodes in the active layer. A plurality of interconnects are electrically coupled to a second surface of each of the first and second pluralities of stationary electrodes. A plurality of anchors fixedly attach a first surface of each of the first and second pluralities of stationary electrodes to the substrate. A first structural tie bar couples a second surface of each of the first plurality of stationary electrodes and a second structural tie bar couples a second surface of each of the second plurality of stationary electrodes.

Abstract translation: 一种MEMS器件和制造方法，包括多个用于增加结构完整性的结构连接条。 MEMS器件包括有源层和在其间形成有绝缘材料的衬底，第一和第二多个固定电极以及有源层中的多个可移动电极。 多个互连件电耦合到第一和第二多个固定电极中的每一个的第二表面。 多个锚固体将第一和第二多个固定电极中的每一个的第一表面固定地附接到基板。 第一结构连接杆联接第一多个固定电极中的每一个的第二表面，并且第二结构连接条连接第二多个固定电极中的每一个的第二表面。

公开(公告)号：US20070012891A1

公开(公告)日：2007-01-18

申请号：US11297651

申请日：2005-12-07

Applicant: George Maltezos ,  Axel Scherer ,  Saurabh Vyawahare

Inventor： George Maltezos ,  Axel Scherer ,  Saurabh Vyawahare

IPC: F16K31/12 ,  B29C33/40 ,  G06F19/00

CPC classification number: B29C33/0016 ,  B01L3/502707 ,  B01L3/502738 ,  B01L2200/12 ,  B29K2891/00 ,  B29L2031/7506 ,  B29L2031/756 ,  B33Y80/00 ,  B81B2201/054 ,  B81C1/00119 ,  B81C99/009 ,  B81C2201/0109 ,  F16K27/003 ,  F16K99/0001 ,  F16K99/0026 ,  F16K99/0059 ,  F16K2099/0074 ,  F16K2099/0078 ,  F16K2099/008 ,  F16K2099/0084 ,  F16K2099/0088 ,  Y10T428/1393

Abstract: A printing method to fabricate three-dimensional microfluidic components is disclosed. A three-dimensional mold made of a first wax is formed. A sacrificial material made of a second wax is provided as a temporary support and then dissolved. A component material is poured onto the mold and cured. The first wax is then melted away. In this way three-dimensional interconnected fluidic components comprising channels, vias and control sections can be obtained.

Abstract translation: 公开了制造三维微流体组分的印刷方法。 形成由第一蜡制成的三维模具。 提供由第二蜡制成的牺牲材料作为临时载体，然后溶解。 将组分材料倒入模具中并固化。 然后将第一根蜡熔化掉。 以这种方式，可以获得包括通道，通孔和控制部分的三维相互连接的流体部件。

公开(公告)号：US07153717B2

公开(公告)日：2006-12-26

申请号：US10319174

申请日：2002-12-13

Applicant: L. Richard Carley ,  Suresh Santhanam ,  Hsu Yu-Nu

Inventor： L. Richard Carley ,  Suresh Santhanam ,  Hsu Yu-Nu

IPC: H01L21/00

CPC classification number: B81B7/0077 ,  B81B2203/0315 ,  B81C1/00476 ,  B81C1/00936 ,  B81C2201/0109 ,  B81C2201/0132 ,  B81C2203/0136 ,  G01P1/023 ,  G01P15/0802 ,  G01P2015/0828

Abstract: This invention comprises a process for fabricating a MEMS microstructure in a sealed cavity wherein the etchant entry holes are created as a by-product of the fabrication process without an additional step to etch holes in the cap layer. The process involves extending the layers of sacrificial material past the horizontal boundaries of the cap layer. The cap layer is supported by pillars formed by a deposition in holes etched through the sacrificial layers, and the etchant entry holes are formed when the excess sacrificial material is etched away, leaving voids between the pillars supporting the cap.

公开(公告)号：US07116462B2

公开(公告)日：2006-10-03

申请号：US10468873

申请日：2002-12-16

Applicant: Koichi Ikeda

Inventor： Koichi Ikeda

IPC: G02B26/00

CPC classification number: B81C1/0015 ,  B81B2201/045 ,  B81B2203/04 ,  B81C2201/0109 ,  B81C2201/0173 ,  B81C2203/0109 ,  G02B26/0841

Abstract: An electrostatic drive type MEMS device and a manufacturing method thereof are provided, in which flattening the surface of a driving side electrode, improving performance, and furthering the improvements of the degree of freedom of designing in the manufacturing process are implemented. In addition, a GLV device using this MEMS device is provided, and further a laser display using this GLV device is also provided. The electrostatic drive type MEMS device includes a substrate side electrode and a beam having a driving side electrode driven by electrostatic attraction force or electrostatic repulsion force that acts between the substrate side electrode and driving side electrode, in which the substrate side electrode is formed of an impurities-doped conductive semiconductor region in a semiconductor substrate.

Abstract translation: 提供一种静电驱动型MEMS器件及其制造方法，其中，使驱动侧电极的表面变平，提高性能，进一步提高制造工艺中的设计自由度的提高。 此外，提供了使用该MEMS器件的GLV器件，并且还提供使用该GLV器件的激光器显示器。 静电驱动型MEMS器件包括基板侧电极和具有由基板侧电极和驱动侧电极之间作用的静电吸引力或静电排斥力驱动的驱动侧电极的光束，其中基板侧电极由 半导体衬底中的杂质掺杂导电半导体区域。

公开(公告)号：US20060128049A1

公开(公告)日：2006-06-15

申请号：US11158217

申请日：2005-06-21

Applicant: Venkatachalam Jaiprakash ,  Jonathan Ward ,  Thomas Rueckes ,  Brent Segal

Inventor： Venkatachalam Jaiprakash ,  Jonathan Ward ,  Thomas Rueckes ,  Brent Segal

IPC: H01L21/00

CPC classification number: G11C13/025 ,  B81B2203/0338 ,  B81B2203/04 ,  B81C1/00142 ,  B81C2201/0109 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B2202/02 ,  C01B2202/22 ,  G11C11/56 ,  G11C13/0033 ,  G11C23/00 ,  G11C2213/16 ,  G11C2213/77 ,  G11C2213/81 ,  H01H1/0094 ,  H01L21/76838 ,  H01L51/0048 ,  H01L2221/1094 ,  Y10S977/943

Abstract: Electro-mechanical switches and memory cells using vertically-disposed nanofabric articles and methods of making the same are described. An electro-mechanical device, includes a structure having a major horizontal surface and a channel formed therein. A conductive trace is in the channel; and a nanotube article vertically suspended in the channel, in spaced relation to a vertical wall of the channel. The article is electro-mechanically deflectable in a horizontal direction toward the conductive trace. Under certain embodiments, the vertically suspended extent of the nanotube article is defined by a thin film process. Under certain embodiments, the vertically suspended extent of the nanotube article is about 50 nanometers or less. Under certain embodiments, the nanotube article is clamped with a conducting material disposed in porous spaces between some nanotubes of the nanotube article. Under certain embodiments, the nanotube article is formed from a porous nanofabric. Under certain embodiments, the nanotube article is electromechanically deflectable into contact with the conductive trace and the contact is either a volatile state or non-volatile state depending on the device construction. Under certain embodiments, the vertically oriented device is arranged into various forms of three-trace devices. Under certain embodiments, the channel may be used for multiple independent devices, or for devices that share a common electrode.

Abstract translation: 描述了使用垂直布置的纳米制品的机电开关和存储单元及其制造方法。 机电装置包括具有主要水平表面和形成在其中的通道的结构。 通道中有导电迹线; 以及垂直悬挂在所述通道中的与所述通道的垂直壁成间隔开的纳米管制品。 该物品在水平方向上可电导向导电迹线偏转。 在某些实施方案中，纳米管制品的垂直悬浮程度由薄膜工艺限定。 在某些实施方案中，纳米管制品的垂直悬浮程度为约50纳米或更小。 在某些实施例中，纳米管制品被夹持在布置在纳米管制品的一些纳米管之间的多孔空间中的导电材料上。 在某些实施方案中，纳米管制品由多孔纳米纤维形成。 在某些实施例中，取决于器件结构，纳米管制品在机电上可偏转成与导电迹线接触，并且触点是易失性状态或非易失性状态。 在某些实施例中，垂直取向的装置被布置成各种形式的三轨迹装置。 在某些实施例中，信道可以用于多个独立设备，或者可以用于共享公共电极的设备。

公开(公告)号：US07035591B2

公开(公告)日：2006-04-25

申请号：US10827004

申请日：2004-04-19

Applicant: Charles M. Newton ,  Raymond C. Rumpf ,  Carol Gamlen

Inventor： Charles M. Newton ,  Raymond C. Rumpf ,  Carol Gamlen

IPC: H04B3/38

CPC classification number: B81C1/0015 ,  B81B2201/0271 ,  B81C2201/0109 ,  H01H59/0009 ,  H01P1/127 ,  H05K1/092 ,  H05K3/02 ,  Y10T29/49117 ,  Y10T428/24926 ,  Y10T428/2495

Abstract: A microelectromechanical structure and method is disclosed. A ceramic substrate preferably is formed from low temperature co-fired ceramic sheets. A low loss photodefinable dielectric planarizing layer is formed over one surface of the ceramic substrate. This layer can e a sacrificial layer or a subsequent sacrificial layer added. A photodefined conductor is printed over the low loss dielectric planarizing layer and formed with the sacrificial layer into a structural circuit component. In one aspect of the invention, a switch is formed with a biasing actuator and deflectable member formed over the biasing actuator and moveable into open and closed circuit positions.

Abstract translation: 公开了一种微机电结构和方法。 陶瓷基板优选由低温共烧陶瓷片形成。 在陶瓷基板的一个表面上形成低损耗可光限定介电平面化层。 该层可以添加牺牲层或随后的牺牲层。 在低损耗介电平面化层上印刷光致定导体，并将牺牲层形成为结构电路部件。 在本发明的一个方面，开关形成有偏置致动器和可偏转构件，该偏置致动器和偏转构件形成在偏置致动器上方并且可移动到打开和闭合的位置。