公开(公告)号：US20060243483A1

公开(公告)日：2006-11-02

申请号：US11476471

申请日：2006-06-28

Applicant: Kyle Kirby ,  Warren Farnworth

Inventor： Kyle Kirby ,  Warren Farnworth

IPC: H01L23/49 ,  H05K7/06

CPC classification number: H01L23/49811 ,  B33Y80/00 ,  G01R1/06727 ,  G01R1/07357 ,  G01R3/00 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/48 ,  H01L24/72 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/136 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/81903 ,  H01L2224/83102 ,  H01L2224/92125 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/351 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Photolithography patterned spring contacts are disclosed. The spring contacts may be fabricated using thin film processing techniques. A substrate, such as a silicon wafer or a carrier substrate is provided. At least one layer of a metal or alloy film may be deposited on the substrate or on at least one intervening release layer and patterned to form metal traces. A stressable material, exhibiting an at least partially tensile stress state, may be deposited on the metal traces in a localized region. A portion of the substrate or a portion of the intervening release layer underneath the metal traces may be removed by etching, causing the metal traces to curl upward resulting in the spring contacts. The spring contacts may be used as compliant electrical contacts for electrical devices, such as integrated circuits or carrier substrates. The compliant electrical contacts may also be used for probe cards to test other electrical devices.

公开(公告)号：US07120999B2

公开(公告)日：2006-10-17

申请号：US10668925

申请日：2003-09-23

Applicant: Robert L. Canella

Inventor： Robert L. Canella

IPC: H01R9/00 ,  H01L23/04

CPC classification number: H01L24/90 ,  G01R1/0408 ,  G01R1/0466 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/4846 ,  H01L21/67121 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/10734 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49181 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A substrate assembly is disclosed including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.

公开(公告)号：US20060175203A1

公开(公告)日：2006-08-10

申请号：US10548277

申请日：2004-03-08

Applicant: Timothy Davis ,  Breet Sexton

Inventor： Timothy Davis ,  Breet Sexton

IPC: H01R13/02 ,  C25D5/10

CPC classification number: B81C1/00666 ,  B81B2201/018 ,  B81B2203/0118 ,  B81C2201/0167 ,  C25D5/12 ,  H01H2059/0081 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0338 ,  H05K2201/0397 ,  H05K2203/0726

Abstract: Curved out of plane metal components are formed on PCB substrates (11) by electroplating two layers (13, 14) of the same metal such that each layer has a different internal stress. This produces as curvature of the layer (13, 14) which enables coils, curved cantilever beams and springs to be fabricated. The amplitude and direction of curvature can be controlled by controlling the stress and thickness of each layer. The stress is controlled by controlling the composition of the electroplating bath.

Abstract translation: 通过对相同金属的两层（13,14）进行电镀，使得每个层具有不同的内部应力，在PCB基板（11）上形成平面金属部件的弯曲。 这产生了能够制造线圈，弯曲悬臂梁和弹簧的层（13,14）的曲率。 可以通过控制各层的应力和厚度来控制曲率的振幅和方向。 通过控制电镀浴的组成来控制应力。

公开(公告)号：US20060094264A1

公开(公告)日：2006-05-04

申请号：US11262982

申请日：2005-11-01

Applicant: Shotaro Senga

Inventor： Shotaro Senga

IPC: H01R12/00

CPC classification number: H05K3/325 ,  H01R12/57 ,  H01R13/24 ,  H05K1/11 ,  H05K3/3457 ,  H05K2201/0311 ,  H05K2201/0373 ,  H05K2201/099 ,  H05K2203/043 ,  H05K2203/0465

Abstract: In a laser beam printer, an elastic conductive member is disposed between a rotating axis of a transfer roller and a land portion of a power supply circuit board and the transfer roller is electrically connected to the power supply circuit board through the elastic conductive member. A front end portion of the elastic conductive member is pressed onto the land portion by its elastic force to come into contact with a soldering pad formed on the surface of the land portion for electrical connection. A resist film is partially formed on the surface of the land portion and the soldering pad is formed on the region on the land portion that is not covered with the resist film. Thus, a large contact area between the front end portion of the elastic conductive member and the soldering pad is ensured so as to address a high voltage applied to the transfer roller. As a result, the transfer roller, etc. can be electrically connected to the power supply circuit board with certainty without increasing the number of components.

Abstract translation: 在激光束打印机中，弹性导电构件设置在转印辊的旋转轴线和电源电路板的接地部之间，并且转印辊通过弹性导电构件电连接到电源电路板。 弹性导电部件的前端部通过弹性力被压接到台肩部上，与形成在台面部的表面上的焊垫接触，进行电连接。 抗蚀剂膜部分地形成在焊盘部分的表面上，并且焊盘被形成在未被抗蚀剂膜覆盖的焊盘部分上的区域上。 因此，确保弹性导电构件的前端部与焊盘之间的大的接触面积，以解决施加到转印辊的高电压。 结果，转印辊等可以确实地电连接到电源电路板，而不增加部件的数量。

公开(公告)号：US20050277309A1

公开(公告)日：2005-12-15

申请号：US11140232

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Shigeyuki Hoshikawa ,  Hiroshi Ikeda

Inventor： Atsuhito Noda ,  Shigeyuki Hoshikawa ,  Hiroshi Ikeda

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/32

CPC classification number: H01R4/028 ,  H01L23/49811 ,  H01L24/12 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/05573 ,  H01L2224/13011 ,  H01L2224/13099 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/81012 ,  H01L2224/81815 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01R12/52 ,  H01R12/57 ,  H01R12/714 ,  H01R13/2407 ,  H01R13/2464 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10265 ,  H05K2201/10719 ,  H05K2201/10946 ,  H01L2224/29099 ,  H01L2224/05599

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is formed to have at least one protuberance on the a ring's exterior surface. The protuberance has an apex or point, which when placed against a surface, will scrub or scrape the surface as the ring is compressed by a force acting on the ring radially. By scrubbing a contact surface with the apex, surface contaminants and layered material that might interfere with electrical signals can be removed.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环形成为在环的外表面上具有至少一个突起。 突起具有顶点或点，当放置在表面上时，当环被径向作用在环上的力压缩时，将擦拭或刮擦表面。 通过用顶点擦拭接触表面，可以去除可能干扰电信号的表面污染物和分层材料。

公开(公告)号：US06935867B1

公开(公告)日：2005-08-30

申请号：US10852911

申请日：2004-05-24

Applicant: Daisuke Takai ,  Kaoru Soeta

Inventor： Daisuke Takai ,  Kaoru Soeta

IPC: H01R33/76 ,  H01R12/00 ,  H01R13/24 ,  H05K1/18 ,  H05K3/32

CPC classification number: H01R13/2435 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/10628

Abstract: A compact, simple connection unit for mounting an electronic component to a substrate includes connectors having one or more arm portions. The connectors are provided with internal stress, which allows the arm portions to grip the electronic component so that the electronic component can be firmly fixed to the substrate.

Abstract translation: 用于将电子部件安装到基板的紧凑且简单的连接单元包括具有一个或多个臂部分的连接器。 连接器设置有内部应力，这允许臂部分握住电子部件，使得电子部件能够牢固地固定到基板。

公开(公告)号：US20040102064A1

公开(公告)日：2004-05-27

申请号：US10715683

申请日：2003-11-17

Applicant: FormFactor, Inc.

Inventor： Gaetan L. Mathieu

IPC: H01R012/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/71 ,  H01L24/72 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01R12/57 ,  H01R12/718 ,  H01R13/03 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

公开(公告)号：US20040058470A1

公开(公告)日：2004-03-25

申请号：US10668925

申请日：2003-09-23

Inventor： Robert L. Canella

IPC: H01L021/44 ,  H01L021/50 ,  H01L021/48

CPC classification number: H01L24/90 ,  G01R1/0408 ,  G01R1/0466 ,  H01L21/283 ,  H01L21/2885 ,  H01L21/4846 ,  H01L21/67121 ,  H01L23/49811 ,  H01L24/72 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/10734 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49147 ,  Y10T29/49156 ,  Y10T29/49169 ,  Y10T29/49181 ,  Y10T29/49204 ,  Y10T29/49222 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A substrate assembly including a substrate and a plurality of spring-biased electrical contacts formed thereon for establishing electrical contact with the lead elements of an IC device. The substrate assembly also comprises a layer of resilient conductive material formed on a surface of the substrate, the spring-biased electrical contacts being formed in the resilient conductive material layer in situ on the substrate. Each spring-biased electrical contact includes a surface or surfaces configured to bias against and electrically contact an IC device lead element. The present invention also encompasses methods of fabricating substrate assemblies according to the invention, including heat treating the substrate assembly after formation to achieve desired spring characteristics.

Abstract translation: 一种衬底组件，包括衬底和形成在其上的多个弹簧偏置电触点，用于与IC器件的引线元件建立电接触。 衬底组件还包括形成在衬底的表面上的弹性导电材料层，弹簧偏压的电触点在衬底上原位形成在弹性导电材料层中。 每个弹簧偏置的电触点包括被配置为偏置IC电气元件引线元件并与其电接触的表面或表面。 本发明还包括制造根据本发明的衬底组件的方法，包括在形成之后对衬底组件进行热处理以实现期望的弹簧特性。

公开(公告)号：US06524122B1

公开(公告)日：2003-02-25

申请号：US09624940

申请日：2000-07-25

Applicant: Thomas A. Johnson ,  Jeffrey L. Jones ,  David Oliphant

Inventor： Thomas A. Johnson ,  Jeffrey L. Jones ,  David Oliphant

IPC: H01R1344

CPC classification number: H05K1/028 ,  H01R24/62 ,  H01R2201/06 ,  H05K3/0061 ,  H05K2201/0311

Abstract: A communication card includes a retractable connector that is smoothly extendable and retractable. A torsion spring is positioned within a slot that receives the retractable connector and the torsion spring assists the extension of the retractable platform and counter forces that may otherwise cause the platform to bind as it extends and retracts. A flexible circuit is attached to the torsion spring and it allows electrical communication between the retractable connectors and the communication card. The flexible circuit is preferably attached to the retractable connector and the communication card by zero insertion force connectors. Because the flexible circuit is bonded to the torsion spring, the movement of the circuit is constrained and that helps protect the circuit from damage.

Abstract translation: 通信卡包括可伸缩连接器，其可平滑地延伸和缩回。 扭转弹簧定位在容纳可伸缩连接器的狭槽内，并且扭转弹簧有助于可伸缩平台的延伸和反作用力，否则可能使平台在其伸展和缩回时结合。 柔性电路连接到扭转弹簧，并且其允许可伸缩连接器和通信卡之间的电气连通。 柔性电路优选通过零插入力连接器附接到可伸缩连接器和通信卡。 由于柔性电路与扭转弹簧结合，电路的运动受到约束，有助于保护电路免受损坏。

公开(公告)号：US20020164893A1

公开(公告)日：2002-11-07

申请号：US09473414

申请日：1999-12-28

Inventor： GAETAN L. MATHIEU ,  BENJAMIN N. ELDRIDGE

IPC: H01R012/00

CPC classification number: G01R3/00 ,  G01R1/06727 ,  G01R1/06761 ,  H01L21/4853 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/71 ,  H01L24/72 ,  H01L2224/05001 ,  H01L2224/05568 ,  H01L2224/11002 ,  H01L2224/11003 ,  H01L2224/13099 ,  H01L2924/0001 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/0104 ,  H01L2924/01042 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15787 ,  H01L2924/3011 ,  H01R12/57 ,  H01R12/718 ,  H01R13/03 ,  H01R13/24 ,  H05K3/326 ,  H05K3/4092 ,  H05K2201/0311 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49204 ,  Y10T29/49222 ,  Y10T29/49224 ,  H01L2924/00

Abstract: An interconnection element and a method of forming an interconnection element. In one embodiment, the interconnection element includes a first structure and a second structure coupled to the first structure. The second structure coupled with the first material has a spring constant greater than the spring constant of the first structure alone. In one embodiment, the interconnection element is adapted to be coupled to an electronic component tracked as a conductive path from the electronic component. In one embodiment, the method includes forming a first (interconnection) structure coupled to a substrate to define a shape suitable as an interconnection in an integrated circuit environment and then coupling, such as by coating, a second (interconnection) structure to the first (interconnection) structure to form an interconnection element. Collectively, the first (interconnection) structure and the second (interconnection) structure have a spring constant greater than a spring constant of the first (interconnection) structure.

Abstract translation: 一种互连元件和形成互连元件的方法。 在一个实施例中，互连元件包括耦合到第一结构的第一结构和第二结构。 与第一材料耦合的第二结构具有大于单独的第一结构的弹簧常数的弹簧常数。 在一个实施例中，互连元件适于耦合到从电子部件跟踪为导电路径的电子部件。 在一个实施例中，该方法包括形成耦合到衬底的第一（互连）结构以限定适合于集成电路环境中的互连的形状，然后例如通过将第二（互连）结构涂覆到第一（互连） 互连）结构以形成互连元件。 总的来说，第一（互连）结构和第二（互连）结构具有大于第一（互连）结构的弹簧常数的弹簧常数。