公开(公告)号：US07930822B2

公开(公告)日：2011-04-26

申请号：US11578311

申请日：2005-04-20

Applicant: Yuki Nakanishi ,  Hideto Sakata ,  Akihiko Igarashi

Inventor： Yuki Nakanishi ,  Hideto Sakata ,  Akihiko Igarashi

IPC: H05K3/02

CPC classification number: H05K3/046 ,  H05K3/041 ,  H05K2201/0355 ,  H05K2203/0522 ,  H05K2203/1545 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49156 ,  Y10T29/49163 ,  Y10T156/1054

Abstract: A conductive member for a non-contact type data carrier such as a wireless tag is simply and cheaply manufactured. A method for manufacturing a conductive member for a non-contact type data carrier comprises: a printing process during which, while a base material (4) is run, a bonding agent layer (5) is printed in a predetermined pattern on the surface thereof, and is dried; a bonding process during which a conductive layer (6) is laminated on the surface of the bonding agent layer (5) for heating and bonding; a punching process during which the conductive layer (6) is punched in the above-described pattern on the base material (4); and a separating process during which an unnecessary portion (6b) of the conductive layer (6) is separated from the base material (4). Accordingly, a conventional multilayered laminated sheet is not required to realize reduction in the material.

Abstract translation: 用于非接触型数据载体（例如无线标签）的导电构件简单便宜地制造。 一种用于非接触型数据载体的导电部件的制造方法，包括：在基材（4）运行的同时，在其表面上以规定的图案印刷接合剂层（5）的印刷工序 ，干燥; 在所述接合剂层（5）的表面上层叠导电层（6）进行加热和接合的接合工艺; 在基材（4）上以上述图案冲压导电层（6）的冲压工艺; 以及导电层（6）的不需要部分（6b）与基材（4）分离的分离工艺。 因此，不需要传统的多层层叠片来实现材料的减少。

公开(公告)号：US20110088933A1

公开(公告)日：2011-04-21

申请号：US12907116

申请日：2010-10-19

Applicant: Satoru AMOU ,  Hikaru Kagiwada ,  Dai Hori

Inventor： Satoru AMOU ,  Hikaru Kagiwada ,  Dai Hori

IPC: H05K1/09 ,  B32B5/02 ,  B32B15/08

CPC classification number: H05K3/389 ,  H05K3/384 ,  H05K3/385 ,  H05K3/4611 ,  H05K2201/0355 ,  H05K2203/0315 ,  Y10T428/12438 ,  Y10T428/12444 ,  Y10T428/12472

Abstract: A wiring board comprising a copper wiring, and an insulating layer which is a cured product of a resin composition containing a compound having a carbon-carbon unsaturated double bond as a cross-linking component, the wiring board having a surface-treated layer formed on one or both sides of the copper wiring, and the surface-treated layer having a metal layer (A) containing at least one metallic component selected from the group consisting of tin, zinc, nickel, chromium, cobalt and aluminium, an oxide and/or hydroxide layer (B) of the metallic component on the metal layer (A), an amino-silane coupling agent layer (C) having an amino group in its structure on the oxide and/or hydroxide layer (B), and a vinyl-silane coupling agent layer (D) having a carbon-carbon unsaturated double bond on the amino-silane coupling agent layer (C).

Abstract translation: 包括铜布线的布线板和作为交联成分含有碳 - 碳不饱和双键的化合物的树脂组合物的固化物的绝缘层，所述布线基板上形成有表面处理层 并且所述表面处理层具有含有选自锡，锌，镍，铬，钴和铝中的至少一种金属成分的金属层（A），氧化物和/ 或氢氧化物层（B），金属层（A）上的金属组分的氢氧化物层（B），在氧化物和/或氢氧化物层（B）上具有氨基的氨基 - 硅烷偶联剂层（C） 在氨基硅烷偶联剂层（C）上具有碳 - 碳不饱和双键的硅烷偶联剂层（D）。

公开(公告)号：US20110079814A1

公开(公告)日：2011-04-07

申请号：US12571481

申请日：2009-10-01

Applicant: Yi-Chang Chen

Inventor： Yi-Chang Chen

IPC: H01L21/283 ,  H01L33/00

CPC classification number: H05K3/244 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/053 ,  H05K3/06 ,  H05K2201/0355 ,  H05K2201/10106 ,  H05K2203/0369 ,  H05K2203/0522 ,  H01L2924/00

Abstract: A method for producing the LED substrate has steps of: p providing a conductive metallic board, forming multiple grooves in a top of the conductive metallic board; protecting the conductive metallic board from corrosion, forming an etched substrate with circuits and wires for plating on the conductive metallic board, electroless plating the etched substrate to form an electroless plated substrate, plating metal on the electroless plated substrate, and coating solder mask to obtain the LED substrate. Because LED chips are mounted on the surfaces of the metal layer without insulating adhesive below, heat from LED chips can be dissipated efficiently. The LED substrate of the present invention can be soldered directly onto a dissipation module to further enhance dissipation efficiency.

Abstract translation: 一种LED基板的制造方法，其特征在于，具备：p形成导电性金属板，在所述导电性金属板的顶部形成多个槽的工序; 保护导电金属板免受腐蚀，在导电金属板上形成用于电镀的电路和电线的蚀刻基板，对蚀刻的基板进行化学镀以形成无电镀基板，在无电解电镀基板上镀覆金属，并涂覆焊接掩模以获得 LED基板。 因为LED芯片安装在金属层的表面上，而不需要绝缘粘合剂，所以可以有效地散发来自LED芯片的热量。 本发明的LED基板可以直接焊接到耗散模块上，以进一步提高散热效率。

公开(公告)号：US20110074021A1

公开(公告)日：2011-03-31

申请号：US12895417

申请日：2010-09-30

Applicant: Mayumi NAKASATO ,  Kouichi Saitou ,  Tetsuya Yamamoto

Inventor： Mayumi NAKASATO ,  Kouichi Saitou ,  Tetsuya Yamamoto

IPC: H01L23/48 ,  H05K1/11

CPC classification number: H05K3/4007 ,  H01L23/49811 ,  H01L24/11 ,  H01L2224/05144 ,  H01L2224/05155 ,  H01L2224/05647 ,  H01L2924/14 ,  H01L2924/351 ,  H05K1/111 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10674 ,  H05K2203/0369 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A device mounting board includes an insulating resin layer, a wiring layer provided on one of main surfaces of the insulating resin layer, and bump electrodes connected electrically to the wiring layer and protruding on a side of the insulating resin layer from the wiring layer. A semiconductor module is formed by having the bump electrodes connected to a semiconductor device. A recess is provided in the top face of each bump electrode. The recess communicates with an opening provided on a side surface of the bump electrode.

Abstract translation: 装置安装板包括绝缘树脂层，设置在绝缘树脂层的一个主表面上的布线层以及与布线层电连接并从绝缘树脂层的布线层突出的凸起电极。 通过将凸块电极连接到半导体器件来形成半导体模块。 在每个凸起电极的顶面设置凹部。 凹部与设置在凸块电极的侧面上的开口连通。

公开(公告)号：US07915533B2

公开(公告)日：2011-03-29

申请号：US11911794

申请日：2006-04-14

Applicant: Youichirou Kaga ,  Hiromi Kikuchi ,  Hisayuki Imamura ,  Junichi Watanabe

Inventor： Youichirou Kaga ,  Hiromi Kikuchi ,  Hisayuki Imamura ,  Junichi Watanabe

IPC: H01L29/00 ,  H01B3/12 ,  H05K7/06

CPC classification number: H01L23/3731 ,  C04B35/584 ,  C04B37/021 ,  C04B37/026 ,  C04B2235/3206 ,  C04B2235/3224 ,  C04B2235/3225 ,  C04B2235/3878 ,  C04B2235/3882 ,  C04B2235/3895 ,  C04B2235/5296 ,  C04B2235/5436 ,  C04B2235/5445 ,  C04B2235/656 ,  C04B2235/6562 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/725 ,  C04B2235/787 ,  C04B2235/85 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/122 ,  C04B2237/124 ,  C04B2237/125 ,  C04B2237/36 ,  C04B2237/402 ,  C04B2237/407 ,  C04B2237/60 ,  H01L23/15 ,  H01L23/49894 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0355 ,  H01L2924/00

Abstract: In the silicon nitride substrate concerning an embodiment of the invention, degree of in-plane orientation fa of β type silicon nitride is 0.4-0.8. Here, degree of in-plane orientation fa can be determined by the rate of the diffracted X-ray intensity in each lattice plane orientation in β type silicon nitride. As a result of research by the inventors, it turned out that both high fracture toughness and high thermal conductivity are acquired, when degree of in-plane orientation fa was 0.4-0.8. Along the thickness direction, both the fracture toughness of 6.0 MPa·m1/2 or higher and the thermal conductivity of 90 W/m·K or higher can be attained.

Abstract translation: 在涉及本发明的一个实施方式的氮化硅衬底中，面的取向度为＆bgr; 氮化硅为0.4-0.8。 这里，面内取向fa的度可以通过＆bgr中的每个晶格面取向中的衍射X射线强度的速率来确定。 型氮化硅。 本发明人的研究结果表明，当面内取向度fa为0.4-0.8时，获得了高断裂韧性和高热导率。 沿厚度方向，可以获得6.0MPa·m1 / 2以上的断裂韧性和90W / m·K以上的导热率。

公开(公告)号：US07898807B2

公开(公告)日：2011-03-01

申请号：US12400067

申请日：2009-03-09

Applicant: Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic

Inventor： Richard Alfred Beaupre ,  Ljubisa Dragoljub Stevanovic

IPC: H05K7/20

CPC classification number: H01L23/473 ,  C04B2237/407 ,  H01L23/3735 ,  H01L2224/32225 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H05K1/0272 ,  H05K1/0306 ,  H05K3/0061 ,  H05K2201/0355 ,  H05K2201/09745 ,  Y10T29/4935 ,  Y10T29/49366 ,  Y10T29/494 ,  Y10T428/2457 ,  H01L2924/00

Abstract: A substrate for power electronics mounted thereon, comprises a middle ceramic layer having a lower surface and an upper surface, an upper metal layer attached to the upper surface of the middle ceramic layer, and a lower metal layer attached to the lower surface of the middle ceramic layer. The lower metal layer has a plurality of millichannels configured to deliver a coolant for cooling the power electronics, wherein the millichannels are formed on the lower metal layer prior to attachment to the lower surface of the middle ceramic layer. Methods for making a cooling device and an apparatus are also presented.

Abstract translation: 安装在其上的用于电力电子的基板包括具有下表面和上表面的中间陶瓷层，附着到中间陶瓷层的上表面的上金属层和附接到中间陶瓷层的下表面的下金属层 陶瓷层。 下金属层具有多个毫通道，其构造成输送用于冷却电力电子设备的冷却剂，其中在连接到中间陶瓷层的下表面之前，在下金属层上形成毫通道。 还提出了制造冷却装置和装置的方法。

公开(公告)号：US20110036914A1

公开(公告)日：2011-02-17

申请号：US12988210

申请日：2009-04-28

Applicant: Akira Shingu ,  Kiyoji Egashira

Inventor： Akira Shingu ,  Kiyoji Egashira

IPC: G06K19/077 ,  H01Q7/00

CPC classification number: H01Q7/00 ,  G06K19/07749 ,  H01Q1/38 ,  H05K1/162 ,  H05K1/165 ,  H05K3/4685 ,  H05K2201/0116 ,  H05K2201/0355 ,  H05K2201/0382

Abstract: Provided are an antenna circuit constituent body for an IC card/tag, which is capable of enhancing a Q value by reducing a permittivity of a resin film of which a base material is made; and an IC card. The antenna circuit constituent body (10) for an IC card/tag comprises: the base material (11) made of the resin film; and circuit pattern layers (131 and 132) each formed on each of both sides of the base material (11) and made of aluminum foil. The circuit pattern layer (131) includes a coiled pattern layer. Parts of the circuit pattern layers (131 and 132), which mutually face each other; and a part of the base material (11), which is interposed between the parts of the circuit pattern layers (131 and 132), constitute a capacitor. The circuit pattern layers (131 and 132) are electrically connected by means of crimping parts (13a and 13b). The base material (11) includes a plurality of void-state-air layers. A relative density of the base material (11) with respect to a density of a resin is less than or equal to 0.9. An average volume of the void-state-air layers is greater than or equal to 2 μm3 and less than or equal to 90 μm3.

Abstract translation: 提供一种用于IC卡/标签的天线电路构成体，其能够通过降低制成基材的树脂膜的介电常数来提高Q值; 和IC卡。 用于IC卡/标签的天线电路构成体（10）包括：由树脂膜制成的基材（11）; 以及各自形成在基材（11）的两侧的每一侧上且由铝箔制成的电路图案层（131和132）。 电路图案层（131）包括线圈图案层。 电路图案层（131和132）的相互面对的部分; 并且介于电路图案层（131和132）的部分之间的基底材料（11）的一部分构成电容器。 电路图案层（131和132）通过压接部件（13a和13b）电连接。 基材（11）包括多个空隙状态空气层。 基材（11）相对于树脂的密度的相对密度小于或等于0.9。 空隙状态空气层的平均体积大于或等于2μm3且小于或等于90μm3。

公开(公告)号：US20110031003A1

公开(公告)日：2011-02-10

申请号：US12937018

申请日：2009-02-13

Applicant: Sankar Paul ,  Dirk M. Baars

Inventor： Sankar Paul ,  Dirk M. Baars

IPC: H05K1/00 ,  H05K3/00 ,  B32B27/08

CPC classification number: H05K1/0373 ,  B32B7/12 ,  B32B15/06 ,  B32B15/08 ,  B32B15/085 ,  B32B15/20 ,  B32B27/285 ,  B32B27/32 ,  B32B2255/06 ,  B32B2255/10 ,  B32B2255/26 ,  B32B2262/0276 ,  B32B2264/0278 ,  B32B2307/204 ,  B32B2307/302 ,  B32B2307/3065 ,  B32B2307/50 ,  B32B2307/54 ,  B32B2307/714 ,  B32B2307/7265 ,  B32B2307/734 ,  B32B2457/00 ,  C08K3/22 ,  C08L15/00 ,  C08L19/006 ,  C08L71/12 ,  C08L2666/14 ,  C09D5/24 ,  C09D7/61 ,  C09J107/00 ,  C12Q1/6886 ,  C12Q2600/154 ,  C12Q2600/156 ,  H05K1/032 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/012 ,  H05K2201/0133 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0212 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10T156/10 ,  Y10T428/24802 ,  Y10T428/2804 ,  Y10T428/31826 ,  Y10T428/31833 ,  Y10T428/31855 ,  Y10T428/31909 ,  Y10T428/31924 ,  Y10T428/31931 ,  Y10T428/31938 ,  C08L2666/08

Abstract: A circuit subassembly, comprising: a conductive layer, a dielectric layer formed from a thermosetting composition, wherein the thermosetting composition comprises, based on the total weight of the thermosetting composition a polybutadiene or polyisoprene resin, about 30 to about 70 percent by weight of a magnesium hydroxide having less than about 1000 ppm of ionic contaminants, and about 5 to about 15 percent by weight of a nitrogen-containing compound, wherein the nitrogen-containing compound comprises at least about 15 weight percent of nitrogen; and an adhesive layer disposed between and in intimate contact with the conductive layer and the dielectric layer, wherein the adhesive comprises a poly(arylene ether), wherein the circuit subassembly has a UL-94 rating of at least V-1.

Abstract translation: 一种电路子组件，包括：导电层，由热固性组合物形成的电介质层，其中所述热固性组合物基于所述热固性组合物的总重量包含聚丁二烯或聚异戊二烯树脂，约30至约70重量％ 具有小于约1000ppm的离子污染物的氢氧化镁和约5至约15重量％的含氮化合物，其中所述含氮化合物包含至少约15重量％的氮; 以及设置在所述导电层和所述电介质层之间并且与所述电介质层紧密接触的粘合剂层，其中所述粘合剂包括聚（亚芳基醚），其中所述电路子组件具有至少V-1的UL-94等级。

公开(公告)号：US20110011628A1

公开(公告)日：2011-01-20

申请号：US12643045

申请日：2009-12-21

Applicant: Ming-Chi Kan ,  Shao-Chung Hu ,  Chien-Min Sung

Inventor： Ming-Chi Kan ,  Shao-Chung Hu ,  Chien-Min Sung

IPC: H05K7/20

CPC classification number: H05K1/05 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/0355

Abstract: A highly thermal conductive circuit board includes a composite substrate, and a metal layer, an insulating layer, and a conductor layer sequentially disposed on the composite substrate. When at least one electronic element is electrically disposed on the conductor layer of the highly thermal conductive circuit board, heat produced by the electronic element in operation is rapidly dissipated through characteristics such as a high thermal conductivity and a low thermal expansion coefficient of the highly thermal conductive circuit board.

Abstract translation: 高导热电路板包括复合衬底和顺序地设置在复合衬底上的金属层，绝缘层和导体层。 当至少一个电子元件电气地布置在高导热电路板的导体层上时，由电子元件在运行中产生的热量通过诸如高热导率和低热膨胀系数的特性快速消散 导电电路板。

公开(公告)号：US07871698B2

公开(公告)日：2011-01-18

申请号：US11568689

申请日：2005-04-26

Applicant: Kazuhiro Ono ,  Kan Fujihara ,  Takaaki Matsuwaki

Inventor： Kazuhiro Ono ,  Kan Fujihara ,  Takaaki Matsuwaki

IPC: B32B7/12 ,  C08G73/10

CPC classification number: B32B27/281 ,  B32B7/12 ,  B32B15/08 ,  B32B27/34 ,  B32B2307/734 ,  B32B2457/08 ,  C08G73/1067 ,  C08G73/1071 ,  C08G73/16 ,  C09J7/22 ,  C09J7/25 ,  C09J7/35 ,  C09J179/08 ,  C09J2479/08 ,  C09J2479/086 ,  H05K1/0346 ,  H05K1/0393 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/068 ,  Y10T428/2852 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The present invention relates to an adhesive film with which a flexible metal-clad laminate is obtained with suppressed dimensional changes occurred when produced by a laminating method; and a flexible metal-clad laminate comprising the adhesive film and a metal foil bonded thereto. The adhesive film comprises a polyimide film and, formed on at least one side thereof, an adhesive layer comprising a thermoplastic polyimide and has coefficients of linear expansion satisfying the relationship 1.0>(coefficient of linear expansion in the MD direction)/(coefficient of linear expansion in the TD direction)>0.1. This adhesive film may be one produced continuously and further satisfying the relationship 1.70>(elastic modulus in the MD direction)/(elastic modulus in the TD direction)>1.05 when the adhesive film has an MD modulus of 5 GPa or higher throughout the whole width thereof. That adhesive film may be one produced continuously and further satisfying the relationship 2.00>(elastic modulus in the MD direction)/(elastic modulus in the TD direction)>1.10 when the adhesive film has an MD modulus less than 5 GPa throughout the whole thereof.

Abstract translation: 本发明涉及一种粘合膜，当通过层压方法制备时，可以获得具有抑制的尺寸变化的柔性覆金属层压板; 以及包含所述粘合膜和与其结合的金属箔的柔性覆金属层压板。 粘合膜包括聚酰亚胺膜，并且在其至少一侧上形成包含热塑性聚酰亚胺的粘合剂层，并且具有满足关系1.0>（MD方向的线性膨胀系数）/（线性系数）的线性膨胀系数 在TD方向扩展）> 0.1。 该粘合膜可以是连续地进一步满足关系1.70>（MD方向的弹性模量）/（TD方向的弹性模量）> 1.05，当粘合膜的MD模量为5GPa以上时，整个 的宽度。 该粘合膜可以是在粘合膜整体的MD模量小于5GPa的情况下连续地进一步满足2.00>（MD方向的弹性模量）/（TD方向的弹性模量）> 1.10的关系 。