公开(公告)号：US20040105955A1

公开(公告)日：2004-06-03

申请号：US10717116

申请日：2003-11-19

Applicant: VIA TECHNOLOGIES, INC.

Inventor： Kwun Yao Ho ,  Moriss Kung

IPC: B32B003/06

CPC classification number: H05K3/4617 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48228 ,  H01L2224/48464 ,  H01L2924/3011 ,  H05K3/062 ,  H05K3/064 ,  H05K3/423 ,  H05K3/4602 ,  H05K3/4647 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09881 ,  H05K2203/0384 ,  H05K2203/0733 ,  Y10S428/901 ,  Y10T428/24025 ,  Y10T428/24917 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A lamination process and structure of a high layout density substrate is disclosed. The lamination process comprises the following steps. First of all, a plurality of laminating layers are individually formed, wherein each laminating layer has a first dielectric layer, a plurality of first vias and a patterned conducting layer. Next, a bottom layer having a second dielectric layer and a plurality of second vias is formed. Then, the laminating layers and the bottom layer are stacked. Finally, the laminating layers and the bottom layer are laminated simultaneously to form a multiplayer substrate at one time.

Abstract translation: 公开了一种高布局密度衬底的叠层工艺和结构。 层压方法包括以下步骤。 首先，分别形成多个层压层，其中每个层压层具有第一介电层，多个第一通孔和图案化的导电层。 接下来，形成具有第二电介质层和多个第二通孔的底层。 然后层叠层叠体和底层。 最后，层压层和底层同时层压以形成多层底板。

公开(公告)号：US06740246B2

公开(公告)日：2004-05-25

申请号：US09836645

申请日：2001-04-17

Applicant: Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Marc Alan Straub ,  Michael George Todd

Inventor： Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Marc Alan Straub ,  Michael George Todd

IPC: H01B1300

CPC classification number: H05K3/4641 ,  H05K3/062 ,  H05K3/4038 ,  H05K3/44 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09881 ,  H05K2203/0733 ,  H05K2203/1184 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for making multi-layer electronic circuit boards 64 having “blind” type apertures 28, 30 which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits 45, 46.

Abstract translation: 一种用于制造具有“盲”型孔28,30的多层电子电路板64的方法，其可选择性地和电接地，并且还具有选择性地形成的空气桥和/或交叉电路45,46。

公开(公告)号：US06739041B2

公开(公告)日：2004-05-25

申请号：US09815234

申请日：2001-03-22

Applicant: Bharat Z. Patel ,  Jay D. Baker ,  Mohan R. Paruchuri

Inventor： Bharat Z. Patel ,  Jay D. Baker ,  Mohan R. Paruchuri

IPC: H05K320

CPC classification number: H05K3/462 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and adding additional electrically conductive layers of material 34, 56, 58, 104, 114, 138, 140 to the member 12, 92 while selectively extending the protuberance 15, 100 within the layers 82, 168, thereby forming a circuit board 82, 168. A portion of the formed circuit board may be etched in order to selectively create air-bridges 86 or interconnection portions 164.

Abstract translation: 一种用于制造多层电子电路板82,168的方法10,90，包括在导电构件12,92上形成至少一个突起15,100的步骤，并且添加另外的材料34,56,58的导电层 ，104,114,138,140连接到构件12,92，同时在层82,168内选择性地延伸突起15,100，从而形成电路板82,168。形成的电路板的一部分可以按顺序蚀刻 以选择性地产生空气桥86或互连部分164。

公开(公告)号：US06729023B2

公开(公告)日：2004-05-04

申请号：US09815564

申请日：2001-03-23

Applicant: Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

Inventor： Achyuta Achari ,  Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Brenda Joyce Nation ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Robert Joseph Gordon ,  Thomas Bernd Krautheim

IPC: H05K302

CPC classification number: H05K3/4038 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1056

Abstract: A method for making a multi-layer circuit board 116 having apertures 96, 98 which may be selectively and electrically isolated from electrically grounded member 46 and further having selectively formed air bridges and/or crossover members 104 which are structurally supported by material 112. Each of the apertures 96, 98 selectively receives electrically conductive material 114.

Abstract translation: 一种用于制造具有孔96,98的多层电路板116的方法，其可以与电接地构件46选择性地和电隔离，并且还具有在结构上由材料112支撑的选择性地形成的空气桥和/或交叉构件104.每个 孔96,98选择性地接收导电材料114。

公开(公告)号：US06673723B2

公开(公告)日：2004-01-06

申请号：US09815226

申请日：2001-03-22

Applicant: Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

Inventor： Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

IPC: H01L21302

CPC classification number: H05K3/44 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1184

Abstract: A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.

Abstract translation: 制造多层电路板70的方法10具有至少一个在板70内和至少一个空气桥74上延伸的导电互连部分或“通孔”72。方法10包括以下步骤：形成突起13 在芯构件12上，将预电路组件32,34附接到芯构件12，从而形成电路板70，同时并且选择性地延伸形成的电路板70内的至少一个突起13。

公开(公告)号：US06613239B2

公开(公告)日：2003-09-02

申请号：US09836644

申请日：2001-04-17

Applicant: Andrew Z. Glovatsky ,  Robert E. Belke ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Marc A. Straub ,  Richard K. McMillan ,  Ram S. Raghava ,  Thomas B. Krautheim ,  Michael A. Howey ,  Vivek A. Jairazbhoy

Inventor： Andrew Z. Glovatsky ,  Robert E. Belke ,  Delin Li ,  Lakhi N. Goenka ,  Mohan R. Paruchuri ,  Marc A. Straub ,  Richard K. McMillan ,  Ram S. Raghava ,  Thomas B. Krautheim ,  Michael A. Howey ,  Vivek A. Jairazbhoy

IPC: B44C122

CPC classification number: H05K3/4641 ,  H05K3/062 ,  H05K3/4038 ,  H05K3/4623 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09881 ,  H05K2203/0733 ,  H05K2203/1184 ,  Y10T29/49155

Abstract: A method 10 for making multi-layer electronic circuit boards having metallized apertures 34, 36 which may be selectively and electrically grounded or isolated from an electrical ground plane.

公开(公告)号：US20030063465A1

公开(公告)日：2003-04-03

申请号：US09966495

申请日：2001-09-28

Inventor： Richard K. McMillan ,  Cindy M. Rutyna ,  Walter K. Stepanenko ,  Lawrence L. Kneisel

IPC: F21V007/00

CPC classification number: H05K1/0274 ,  F21S41/37 ,  F21S43/14 ,  F21V7/22 ,  H05K1/09 ,  H05K1/181 ,  H05K2201/0108 ,  H05K2201/0361 ,  H05K2201/09072 ,  H05K2201/10106 ,  H05K2201/2054

Abstract: A method for constructing an illuminating and reflecting apparatus is provided. The method comprises the steps of providing a layered metal substrate with an aluminum layer between a first and a second layer of copper and removing a defined area of one of the layers of copper to form a reflective portion. A localized light source is positioned to allow light to reflect off of the reflective portion.

Abstract translation: 提供一种构成照明和反射装置的方法。 该方法包括以下步骤：在第一和第二铜层之间提供具有铝层的分层金属基板，并移除铜层之一的限定区域以形成反射部分。 定位局部光源以允许光从反射部分反射出来。

公开(公告)号：US06473963B1

公开(公告)日：2002-11-05

申请号：US09656388

申请日：2000-09-06

Applicant: Lakhi N. Goenka ,  Zhong-You Shi

Inventor： Lakhi N. Goenka ,  Zhong-You Shi

IPC: H05K336

CPC classification number: H05K1/0272 ,  H05K3/4641 ,  H05K2201/0361 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49165

Abstract: A multi-layer circuit board with heat pipes and a method for forming a multi-layer circuit board with heat pipes is disclosed. The method includes forming channels in a first and second pre-circuit assembly and attaching the first pre-circuit assembly to the second pre-circuit assembly such that the channels cooperatively form a heat pipe.

Abstract translation: 公开了一种具有热管的多层电路板和用于形成具有热管的多层电路板的方法。 该方法包括在第一和第二预循环组件中形成通道并将第一预循环组件附接到第二预循环组件，使得通道协同地形成热管。

公开(公告)号：US20020148642A1

公开(公告)日：2002-10-17

申请号：US09836645

申请日：2001-04-17

Inventor： Andrew Zachary Glovatsky ,  Robert Edward Belke ,  Marc Alan Straub ,  Michael George Todd

IPC: H01B013/00 ,  H05K003/02

CPC classification number: H05K3/4641 ,  H05K3/062 ,  H05K3/4038 ,  H05K3/44 ,  H05K3/4623 ,  H05K3/4652 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09881 ,  H05K2203/0733 ,  H05K2203/1184 ,  Y10T29/49124 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A method for making multi-layer electronic circuit boards 64 having nullblindnull type apertures 28, 30 which may be selectively and electrically grounded and further having selectively formed air bridges and/or crossover circuits 45, 46.

Abstract translation: 一种用于制造具有“盲”型孔28,30的多层电子电路板64的方法，其可选择性地和电接地，并且还具有选择性地形成的空气桥和/或交叉电路45,46。

公开(公告)号：US06454878B1

公开(公告)日：2002-09-24

申请号：US09703553

申请日：2000-11-01

Applicant: Achyuta Achari ,  Brenda Joyce Nation ,  Jay D Baker ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri ,  Vladimir Stoica

Inventor： Achyuta Achari ,  Brenda Joyce Nation ,  Jay D Baker ,  Lakhi Nandlal Goenka ,  Mohan R. Paruchuri ,  Vladimir Stoica

IPC: C23C806

CPC classification number: H05K3/022 ,  B32B15/017 ,  B32B15/018 ,  H05K2201/0361 ,  Y10T29/49126

Abstract: A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

Abstract translation: 一种用于形成包含使用包层磨的三金属材料组的方法。 当形成多组三金属材料时，通过氧化制备每组的外表面以防止每一组粘附到上述或下方。 氧化的替代物是在三金属材料的外表面上提供可除去的层。 或者可以在中间表面上使用粘合材料; 这种接合材料可以选自锡，镍，钛，铬，银和锌。