公开(公告)号：US06501031B1

公开(公告)日：2002-12-31

申请号：US09655809

申请日：2000-09-06

Applicant: Andrew Z. Glovatsky ,  Jay D. Baker ,  Robert Edward Belke ,  Myron Lemecha ,  Richard Keith McMillan ,  Thomas B. Krautheim

Inventor： Andrew Z. Glovatsky ,  Jay D. Baker ,  Robert Edward Belke ,  Myron Lemecha ,  Richard Keith McMillan ,  Thomas B. Krautheim

IPC: H05K111

CPC classification number: H05K3/445 ,  H05K3/386 ,  H05K3/4038 ,  H05K3/4092 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09554 ,  H05K2201/09581 ,  H05K2203/1438 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49172

Abstract: A multi-layer electronic circuit board design 10 having a core member 12, a pair of dielectric layers 14, 16 disposed thereon, and a first circuit portion 20 which is coupled to the dielectric layer 14 and core member 12 using a layer of adhesive material 18. Circuit board design 10 further having selectively formed “blind” apertures, vias or cavities 22 formed through the first circuit portion 20, dielectric layer 14, and adhesive layer 18, thereby exposing core member 12.

Abstract translation: 具有芯构件12，设置在其上的一对电介质层14,16的多层电子电路板设计10以及使用粘合材料层连接到电介质层14和芯构件12的第一电路部分20 电路板设计10还具有选择性地形成通过第一电路部分20形成的“盲”孔，通孔或空腔22，电介质层14和粘合层18，从而露出芯构件12。

公开(公告)号：US06412168B1

公开(公告)日：2002-07-02

申请号：US09655750

申请日：2000-09-06

Applicant: Andrew Z. Glovatsky ,  Jay D. Baker

Inventor： Andrew Z. Glovatsky ,  Jay D. Baker

IPC: H01K310

CPC classification number: H05K3/4038 ,  H05K3/386 ,  H05K3/44 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09554 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26.

Abstract translation: 具有选择性地形成的孔或腔26的多层电子电路板设计10

公开(公告)号：US5579573A

公开(公告)日：1996-12-03

申请号：US320812

申请日：1994-10-11

Applicant: Jay D. Baker ,  Cuong V. Pham ,  Robert E. Belke, Jr.

Inventor： Jay D. Baker ,  Cuong V. Pham ,  Robert E. Belke, Jr.

IPC: H01L21/56 ,  H05K3/34 ,  H01L21/50 ,  H05K3/38

CPC classification number: H01L24/29 ,  H01L21/563 ,  H01L24/32 ,  H01L2224/1319 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01047 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: Method for fabricating an undercoated chip electrically interconnected to a substrate. The method includes the initial step of depositing a predetermined quantity of a liquid undercoat material onto the chip or the substrate. The method continues with the step of interconnecting the chip to the substrate so as to form an electrical interconnection bond therebetween. Finally, the method concludes with the step of heating, reflowing and curing the undercoat material during or after the step of electrically interconnecting the chip to the substrate.

Abstract translation: `制造与基片电连接的底涂芯片的方法。 该方法包括将预定量的液体底涂层材料沉积到芯片或基底上的初始步骤。 该方法继续将芯片与衬底互连以在其间形成电互连结的步骤。 最后，该方法的结论是在将芯片与衬底电互连的步骤期间或之后加热，回流和固化底涂层材料的步骤。

公开(公告)号：US5545073A

公开(公告)日：1996-08-13

申请号：US43943

申请日：1993-04-05

Applicant: Lawrence L. Kneisel ,  Jay D. Baker ,  Lakhi N. Goenka

Inventor： Lawrence L. Kneisel ,  Jay D. Baker ,  Lakhi N. Goenka

IPC: B08B7/02 ,  B05B1/00 ,  B05B7/14 ,  B24C1/00 ,  B24C5/04 ,  B24C11/00

CPC classification number: B05B1/005 ,  B24C1/003 ,  B24C5/04 ,  B05B7/14

Abstract: An apparatus and method for cleaning a workpiece with abrasive CO.sub.2 snow operates with a nozzle for creating and expelling the snow. The nozzle includes an upstream section for receiving CO.sub.2 in a gaseous form, and having a first contour shaped for subsonic flow of the CO.sub.2. The nozzle also includes a downstream section for directing the flow of the CO.sub.2 and the snow toward the workpiece, with the downstream section having a second contour shaped for supersonic flow of the CO.sub.2. The nozzle includes a throat section, interposed between the upstream and downstream sections, for changing the CO.sub.2 from the gaseous phase along a constant entropy line to a gas and snow mixture within the downstream section at a speed of at least Mach 1.0. In this manner, additional kinetic energy is imparted to the snow by delaying the conversion into the solid phase until the gaseous CO.sub.2 reaches supersonic speeds.

Abstract translation: 用研磨二氧化碳雪清洁工件的设备和方法与用于产生和排出雪的喷嘴一起工作。 喷嘴包括用于接收气体形式的CO 2的上游部分，并且具有成形为CO 2的亚音速流的第一轮廓。 喷嘴还包括用于将CO 2和雪的流动引向工件的下游部分，其中下游部分具有成形为用于CO 2的超音速流动的第二轮廓。 喷嘴包括插入在上游部分和下游部分之间的喉部，用于将CO 2从气相沿着恒定的熵线以至少马赫数为1.0的速度在下游部分内改变为气体和混合物。 以这种方式，通过延迟转化为固相直到气态CO 2达到超音速速度，赋予雪额外的动能。

公开(公告)号：US5469329A

公开(公告)日：1995-11-21

申请号：US287033

申请日：1994-08-08

Applicant: Prathap A. Reddy ,  Jay D. Baker ,  Larry L. Kneisel

Inventor： Prathap A. Reddy ,  Jay D. Baker ,  Larry L. Kneisel

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K7/20509 ,  H01L2924/0002

Abstract: A printed wiring board adapted to mount electronic devices including one or more heat spreaders secured to the wiring board, the heat spreaders being formed of a material having high thermal conductivity, each heat spreader being adapted to support an electronic device which is bonded to the heat spreader, the portion of the heat spreader adjacent the electronic device having a metallic layer of low coefficient of thermal expansion that provides a localized area having a coefficient of thermal expansion that is approximately the same as that of the electronic device thereby tending to eliminate thermal stresses in the bond material used to attach the electronic device to the heat spreader, the relatively high thermally conductive material allowing thermal energy to be transferred effectively from the electronic device through the heat spreader to an adjacent heat sink.

Abstract translation: 一种适于安装电子装置的印刷电路板，其包括固定到所述布线板的一个或多个散热器，所述散热器由具有高导热性的材料形成，每个散热器适于支撑结合到所述热的电子装置 散热器，靠近电子设备的散热器的部分具有低热膨胀系数的金属层，其提供具有与电子设备大致相同的热膨胀系数的局部区域，从而有助于消除热应力 在用于将电子设备连接到散热器的粘合材料中，相对高的导热材料允许热能从电子设备通过散热器有效地传递到相邻的散热器。

公开(公告)号：US4739917A

公开(公告)日：1988-04-26

申请号：US2486

申请日：1987-01-12

Applicant: Jay D. Baker

Inventor： Jay D. Baker

IPC: B23K1/00 ,  B23K1/20 ,  B23K35/26 ,  H01R43/02 ,  H01R43/20 ,  H05K3/34 ,  B23K1/02 ,  B23K31/02

CPC classification number: B23K35/262 ,  B23K1/203 ,  B23K35/268 ,  H01R43/205 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3484 ,  B23K2201/40 ,  B23K2201/42 ,  H01L2924/00013 ,  H01R43/02 ,  H05K2201/10636 ,  H05K2201/10689 ,  H05K2201/10727 ,  H05K2201/10992 ,  H05K2203/048 ,  H05K3/3463 ,  Y02P70/611 ,  Y02P70/613

Abstract: A method of providing improved electrical and physical connections between the electrically conducting terminals of an electronic component and the conductors of a printed circuit board by utilizing a high temperature solder material formed in mounds on defined areas of the conductors, coating the mounds with low temperature solder paste and mating the terminals of the component to the mounds by forcing them through the low temperature solder coatings prior to reflowing and cooling the low temperature solder.

公开(公告)号：US07030977B2

公开(公告)日：2006-04-18

申请号：US10430669

申请日：2003-05-06

Applicant: Jay D. Baker ,  Charles F. Schweitzer ,  Zhong-You (Joe) Shi ,  William Zhang

Inventor： Jay D. Baker ,  Charles F. Schweitzer ,  Zhong-You (Joe) Shi ,  William Zhang

IPC: G01N21/00

CPC classification number: H05K13/08

Abstract: The present invention provides a system for the contactless testing and configuring of electronic assemblies during the manufacturing process. The system includes an onboard optical transceiver, a system controller, and a controller optical transceiver. The onboard optical transceiver is located on the electronic assembly. The onboard optical transceiver is connected to an integrated circuit which is capable of performing functional tests or storing programs on the assembly. The controller optical transceiver is connected to the system controller and located adjacent to the electronic assembly. The onboard transceiver and the controller optical transceiver are used to establish a contactless communication link between the system controller and the electronic assembly. The contactless nature of the communication link allows the assembly to be transported past the controller optical transceiver by a simple conveyor while the system controller is communicating with the electronic assembly.

Abstract translation: 本发明提供了一种用于在制造过程中非接触式测试和配置电子组件的系统。 该系统包括板载光收发器，系统控制器和控制器光收发器。 车载光收发器位于电子组件上。 板载光收发器连接到能够对组件进行功能测试或存储程序的集成电路。 控制器光收发器连接到系统控制器并位于电子组件附近。 板载收发器和控制器光收发器用于在系统控制器和电子组件之间建立非接触式通信链路。 通信链路的非接触性质允许组件通过简单的传送带传输通过控制器光收发器，同时系统控制器与电子组件通信。

公开(公告)号：US06906679B2

公开(公告)日：2005-06-14

申请号：US10624040

申请日：2003-07-21

Applicant: Lawrence Leroy Kneisel ,  Jay D. Baker ,  Bernard A. Meyer ,  Andrew Z. Glovatsky

Inventor： Lawrence Leroy Kneisel ,  Jay D. Baker ,  Bernard A. Meyer ,  Andrew Z. Glovatsky

IPC: H01Q1/08 ,  H01Q1/12 ,  H01Q1/27 ,  H01Q1/32 ,  H01Q3/26 ,  H01Q15/14 ,  H01Q21/00 ,  H01Q21/06 ,  H04B10/00

CPC classification number: H01Q1/08 ,  H01Q1/1235 ,  H01Q1/32 ,  H01Q3/26 ,  H01Q3/2676 ,  H01Q21/062

Abstract: An antenna system for receiving communication signals from satellites having plurality of subplates, a plurality of antenna nodes supported on the top surface of each subplate, and an electronic control unit to which the subplates are fixed and aligned and a collapsible support stand fixed to the bottom of the electronic control unit opposite the subplates in which the subplates, electronic control unit and stand interconnect to form an easily assembled lightweight antenna assembly that may be disassembled into easily portable components.

Abstract translation: 一种天线系统，用于从具有多个子板的卫星接收通信信号，多个天线节点被支撑在每个辅助板的顶表面上，以及一个电子控制单元，子板被固定和对准，一个可折叠的支撑架固定在底部 电子控制单元与底板相对的子板，电子控制单元和支架互连构成易于组装的轻型天线组件，其可以拆卸成易于携带的部件。

公开(公告)号：US06739041B2

公开(公告)日：2004-05-25

申请号：US09815234

申请日：2001-03-22

Applicant: Bharat Z. Patel ,  Jay D. Baker ,  Mohan R. Paruchuri

Inventor： Bharat Z. Patel ,  Jay D. Baker ,  Mohan R. Paruchuri

IPC: H05K320

CPC classification number: H05K3/462 ,  H05K3/0047 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/44 ,  H05K3/445 ,  H05K3/4608 ,  H05K3/4611 ,  H05K3/4623 ,  H05K3/4641 ,  H05K3/4685 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/0379 ,  H05K2201/0397 ,  H05K2201/09309 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09609 ,  H05K2201/09845 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/066 ,  H05K2203/0733 ,  H05K2203/1152 ,  H05K2203/1184 ,  H05K2203/1536 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: A method 10, 90 for making a multi-layer electronic circuit board 82, 168 including the steps of forming at least one protuberance 15, 100 upon an electrically conductive member 12, 92 and adding additional electrically conductive layers of material 34, 56, 58, 104, 114, 138, 140 to the member 12, 92 while selectively extending the protuberance 15, 100 within the layers 82, 168, thereby forming a circuit board 82, 168. A portion of the formed circuit board may be etched in order to selectively create air-bridges 86 or interconnection portions 164.

Abstract translation: 一种用于制造多层电子电路板82,168的方法10,90，包括在导电构件12,92上形成至少一个突起15,100的步骤，并且添加另外的材料34,56,58的导电层 ，104,114,138,140连接到构件12,92，同时在层82,168内选择性地延伸突起15,100，从而形成电路板82,168。形成的电路板的一部分可以按顺序蚀刻 以选择性地产生空气桥86或互连部分164。

公开(公告)号：US06673723B2

公开(公告)日：2004-01-06

申请号：US09815226

申请日：2001-03-22

Applicant: Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

Inventor： Bharat Z. Patel ,  Jay D. Baker ,  Lakhi N. Goenka ,  Michael Allen Howey ,  Mohan R. Paruchuri ,  Richard Keith McMillan

IPC: H01L21302

CPC classification number: H05K3/44 ,  H05K3/06 ,  H05K3/062 ,  H05K3/064 ,  H05K3/4038 ,  H05K3/429 ,  H05K3/445 ,  H05K3/4623 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0352 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09609 ,  H05K2201/09881 ,  H05K2203/0369 ,  H05K2203/0733 ,  H05K2203/1184

Abstract: A method 10 for making a multi-layer circuit board 70 having at least one electrically conductive interconnection portion or “via” 72 which extends within the board 70 and at least one air-bridge 74. The method 10 includes the steps of forming protuberances 13 upon a core member 12, attaching pre-circuit assemblies 32, 34 to the core member 12, thereby forming the circuit board 70 while concomitantly and selectively extending at least one of the protuberances 13 within the formed circuit board 70.

Abstract translation: 制造多层电路板70的方法10具有至少一个在板70内和至少一个空气桥74上延伸的导电互连部分或“通孔”72。方法10包括以下步骤：形成突起13 在芯构件12上，将预电路组件32,34附接到芯构件12，从而形成电路板70，同时并且选择性地延伸形成的电路板70内的至少一个突起13。