LCD device having external terminals
    122.
    发明授权
    LCD device having external terminals 有权
    具有外部端子的LCD装置

    公开(公告)号:US07639338B2

    公开(公告)日:2009-12-29

    申请号:US11124803

    申请日:2005-05-09

    Abstract: A LCD device includes external terminals for metallic interconnects in a peripheral area on which TCPs are mounted. The external terminal includes a first ITO film connected to the metallic interconnect, a second ITO film formed on the first ITO film and a plurality of insulator islands sandwiched between the first ITO film and the second ITO film. The surface of the second ITO film has convex and concave portions whereby electric connection between the terminal of the TCP and the second ITO film is improved.

    Abstract translation: LCD装置包括在安装有TCP的外围区域中的用于金属互连的外部端子。 外部端子包括连接到金属互连的第一ITO膜,形成在第一ITO膜上的第二ITO膜和夹在第一ITO膜和第二ITO膜之间的多个绝缘体岛。 第二ITO膜的表面具有凸部和凹部,从而提高了TCP端子与第二ITO膜之间的电连接。

    High density circuit board and manufacturing method thereof
    126.
    发明申请
    High density circuit board and manufacturing method thereof 审中-公开
    高密度电路板及其制造方法

    公开(公告)号:US20090250260A1

    公开(公告)日:2009-10-08

    申请号:US12155756

    申请日:2008-06-09

    Applicant: Myung Sam Kang

    Inventor: Myung Sam Kang

    Abstract: The present invention relates to a high density circuit board for increasing the density of a circuit by impregnating fine circuit patterns inside a top part of a substrate, and a method for manufacturing the same.In accordance with the present invention, a high density circuit board includes a substrate with fine circuit patterns impregnated inside top and bottom parts; a via formed inside the substrate to electrically conduct the fine circuit patterns of the top and bottom parts of the substrate each other; pads formed on the fine circuit patterns of the top part of the substrate; and solder resists formed on the top and bottom parts of the substrate, which can convert the circuit patterns into fine pitches and increase the degree of close adhesion between the substrate and the circuit patterns, thereby improving reliability.

    Abstract translation: 高密度电路板及其制造方法技术领域本发明涉及一种用于通过在基板顶部浸渍精细电路图案来提高电路密度的高密度电路板及其制造方法。 根据本发明,高密度电路板包括具有浸渍在顶部和底部内部的精细电路图案的基板; 形成在基板内部的通孔,以使基板的顶部和底部的精细电路图案彼此导电; 衬垫形成在衬底的顶部的精细电路图案上; 以及形成在基板的顶部和底部上的阻焊剂,其可以将电路图案转换成细间距并增加基板和电路图案之间的紧密粘合度,从而提高可靠性。

    Connecting structure and connecting method, liquid ejection head and method of manufacturing same
    127.
    发明申请
    Connecting structure and connecting method, liquid ejection head and method of manufacturing same 审中-公开
    连接结构和连接方法,液体喷头及其制造方法

    公开(公告)号:US20090211790A1

    公开(公告)日:2009-08-27

    申请号:US12379518

    申请日:2009-02-24

    Inventor: Tsutomu Yokouchi

    Abstract: The connecting structure of a flexible circuit board and electronic components, includes: the flexible circuit board having: a pattern of wires, holes passing through the flexible circuit board in a thickness direction of the wires at parts of the wires to which the electronic components are connected, and a weakened part arranged on a bending line in a bending part of the flexible circuit board on which the flexible circuit board bends when the wires are connected with the electronic components; and the electronic components respectively having projections on parts to which the wires are connected, wherein the wires are electrically connected with the electronic components in a state where the projections are inserted in the holes and the flexible circuit board bends on the weakened part.

    Abstract translation: 柔性电路板和电子部件的连接结构包括:柔性电路板,其具有:电线图案,在电线部分处的电线部分处的导线的厚度方向穿过柔性电路板的孔 柔性电路板的弯曲部的弯曲线上设置的弱化部,柔性电路板在与电子部件连接时弯曲的弯曲部; 电子部件分别具有连接线的部件上的突起,其中,在突起插入孔中并且柔性电路板弯曲在弱化部上的状态下,电线与电子部件电连接。

    Selectively accelerated plating of metal features
    130.
    发明授权
    Selectively accelerated plating of metal features 有权
    选择性加速电镀金属功能

    公开(公告)号:US07560016B1

    公开(公告)日:2009-07-14

    申请号:US12291277

    申请日:2008-11-07

    Abstract: To make a metal feature, a non-plateable layer is applied to a workpiece surface and then patterned to form a first plating region and a first non-plating region. Then, metal is deposited on the workpiece to form a raised field region in said first plating region and a recessed region in said first non-plating region. Then, an accelerator film is applied globally on the workpiece. A portion of the accelerator film is selectively removed from the field region, and another portion of the accelerator film remains in the recessed acceleration region. Then, metal is deposited onto the workpiece, and the metal deposits at an accelerated rate in the acceleration region, resulting in a greater thickness of metal in the acceleration region compared to metal in the non-activated field region. Then, metal is completely removed from the field region, thereby forming the metal feature.

    Abstract translation: 为了制造金属特征,将不可镀层施加到工件表面,然后被图案化以形成第一镀层区域和第一非镀层区域。 然后,金属沉积在工件上,以在所述第一镀覆区域中形成凸起区域,并在所述第一非镀覆区域中形成凹陷区域。 然后,加工膜全部应用于工件上。 加速膜的一部分从场区域选择性地去除,并且加速膜的另一部分残留在凹入加速区域中。 然后,金属沉积在工件上,并且金属在加速区域中以加速的速率沉积,导致与非激活场区域中的金属相比,加速区域中的金属厚度更大。 然后,从场区域中完全去除金属,从而形成金属特征。

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