公开(公告)号：US20140132386A1

公开(公告)日：2014-05-15

申请号：US14069413

申请日：2013-11-01

Applicant: Hahn-Schickard-Gesellschaft fur angewandte Forschung e.V. ,  Wurth Elektronik Gmbh & Co. KG

Inventor： Jan Kostelnik ,  Alina Schreivogel ,  Jürgen Wolf ,  Jürgen Keck

IPC: H01F27/28 ,  H01F41/04

CPC classification number: H01F27/2804 ,  B33Y10/00 ,  B33Y80/00 ,  H01F17/0006 ,  H01F27/303 ,  H01F27/402 ,  H01F41/042 ,  H01F41/043 ,  H01F2017/0066 ,  H03K17/9505 ,  H03K2017/9527 ,  H05K1/165 ,  H05K3/125 ,  H05K2201/086 ,  H05K2201/09036 ,  H05K2203/1344 ,  Y10T29/4902

Abstract: The invention relates to a method for producing a coil (140) integrated in a substrate (100) or applied to a substrate, wherein the coil has first winding portions (136), which each have first ends (141) and second ends (147), and wherein the coil has second winding portions (138) and third winding portions (139), wherein each two of the first ends are electrically interconnected by the second winding portions and two corresponding second ends of the first winding portions are electrically interconnected by the third winding portions, such that coil windings of the coil are formed hereby, wherein at least the first winding portions are applied by means of a 3D printing method, wherein this is aerosol jet or inkjet printing, for example.

Abstract translation: 本发明涉及一种用于制造集成在基板（100）中或应用于基板的线圈（140）的方法，其中线圈具有第一绕组部分（136），每个具有第一端部（141）和第二端部（147） ），并且其中线圈具有第二绕组部分（138）和第三绕组部分（139），其中每个第一端部通过第二绕组部分电互连，并且第一绕组部分的两个对应的第二端部通过 第三绕组部分，使得线圈的线圈绕组在此形成，其中至少第一绕组部分通过3D印刷方法施加，其中例如是喷雾喷墨或喷墨印刷。

公开(公告)号：US08703232B2

公开(公告)日：2014-04-22

申请号：US13001718

申请日：2009-06-25

Applicant: Matthew S. Stay ,  Mikhail L. Pekurovsky ,  Cristin E. Moran ,  Matthew H. Frey

Inventor： Matthew S. Stay ,  Mikhail L. Pekurovsky ,  Cristin E. Moran ,  Matthew H. Frey

IPC: B05D5/06

CPC classification number: B32B3/30 ,  C09D11/52 ,  C23C18/06 ,  C23C18/08 ,  C23C18/1608 ,  C23C18/30 ,  G02F1/155 ,  G02F2202/22 ,  H05K1/0284 ,  H05K3/107 ,  H05K3/1258 ,  H05K3/182 ,  H05K9/0096 ,  H05K2201/09036 ,  H05K2201/09827

Abstract: The present disclosure describes an article and a method of forming a microstructure. The method includes providing a substrate having a structured surface region comprising one or more recessed features with recessed surfaces. The structured surface region is substantially free of plateaus. The method includes disposing a fluid composition comprising a functional material and a liquid onto the structured surface region. The method includes evaporating liquid from the fluid composition. The functional material collects on the recessed surfaces such that a remainder of the structured surface region is substantially free of the functional material.

Abstract translation: 本公开描述了形成微结构的制品和方法。 该方法包括提供具有结构化表面区域的基底，该结构化表面区域包括具有凹陷表面的一个或多个凹 结构化表面区域基本上没有平台。 该方法包括将包含功能材料和液体的流体组合物设置在结构化表面区域上。 该方法包括从流体组合物蒸发液体。 功能材料集中在凹入的表面上，使得结构化表面区域的其余部分基本上不含功能材料。

公开(公告)号：US20140106129A1

公开(公告)日：2014-04-17

申请号：US14096821

申请日：2013-12-04

Applicant: HITACHI METALS, LTD.

Inventor： Hiroyuki TESHIMA ,  Junichi WATANABE ,  Shinichi KAZUI ,  Makoto SASAKI ,  Akihito MIZUNO

IPC: H05K1/03 ,  H05K1/02

CPC classification number: H05K1/0306 ,  B23K26/40 ,  B23K2103/52 ,  H01L21/481 ,  H01L23/3735 ,  H01L2924/0002 ,  H05K3/0029 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/0909 ,  Y10T428/24479 ,  H01L2924/00

Abstract: A ceramic assembled board is formed by cutting continuous dividing grooves on one or both of the surfaces of a sintered ceramic board by way of laser machining to produce a large number of circuit substrates and at least one of the continuous grooves has a largest depth section and a smallest depth section with a depth difference Δd of 10 μm≦Δd≦50 μm. A ceramic substrate is produced by dividing the ceramic assembled board and at least one of its lateral surfaces is a surface formed by dividing the ceramic assembled board along the continuous grooves, the arithmetic mean roughness Ra2 of the machined surfaces of the continuous grooves being smaller than the arithmetic mean roughness Ra1 of the surfaces of broken sections with regard to the arithmetic mean roughness Ra of the lateral surfaces.

Abstract translation: 通过激光加工在烧结陶瓷板的一个或两个表面上切割连续的分隔槽来形成陶瓷组装板，以产生大量的电路基板，并且至少一个连续的凹槽具有最大的深度部分和 具有深度差Dgr的最小深度部分，d为10μm和nlE; Dgr; d＆nlE;50μm。 通过分割陶瓷组装板来制造陶瓷基板，并且其侧面中的至少一个是沿着连续槽分割陶瓷组装板而形成的表面，连续槽的加工表面的算术平均粗糙度Ra2小于 断面的表面的算术平均粗糙度Ra1相对于侧面的算术平均粗糙度Ra。

公开(公告)号：US20140055961A1

公开(公告)日：2014-02-27

申请号：US13593352

申请日：2012-08-23

Applicant: Shayan Malek ,  Nicholas G. L. Merz ,  Michael B. Wittenberg

Inventor： Shayan Malek ,  Nicholas G. L. Merz ,  Michael B. Wittenberg

IPC: H05K3/34 ,  H05K3/46 ,  H05K7/00

CPC classification number: H05K3/1216 ,  H05K1/183 ,  H05K3/1225 ,  H05K3/3436 ,  H05K3/3484 ,  H05K2201/09036 ,  Y10T29/49144 ,  Y10T29/49155

Abstract: Printed circuit boards are provided with recess-mounted components. The components may be mounted within recesses in the surface of a printed circuit board substrate that are larger than the component. A solder stencil may be used to mount the components in a recess. The solder stencil may have curved portions between a planar portion and a depressed portion. The difference in the lateral width of the recess and the lateral width of the component may be configured to allow the planar portion and the depressed portion to be placed against the surface of the printed circuit board without damaging edges of the recess during solder application processes. The recess may be formed by placing a dummy component having a size and shape that is larger than the size and shape of the recess-mounted component against a portion of the printed circuit board during board formation operations.

Abstract translation: 印刷电路板设有凹槽安装部件。 组件可以安装在印刷电路板基板的大于该部件的表面中的凹部内。 可以使用焊接模板将组件安装在凹槽中。 焊料模板可以在平坦部分和凹陷部分之间具有弯曲部分。 凹部的横向宽度和部件的横向宽度的差异可以被配置为允许平面部分和凹陷部分抵靠印刷电路板的表面放置，而不会在焊接应用过程中损坏凹部的边缘。 可以通过在板形成操作期间将具有大于凹入安装部件的尺寸和形状的尺寸和形状放置在印刷电路板的一部分上的方式来形成凹部。

公开(公告)号：US20140042406A1

公开(公告)日：2014-02-13

申请号：US13932834

申请日：2013-07-01

Applicant: Apple Inc.

Inventor： Brett W. Degner ,  Chieh-Wei Chen ,  Dinesh C. Mathew ,  Paul S. Drzaic ,  Sang Ha Kim ,  Silvio Grespan ,  John Z. Zhong ,  Jean-Pierre Guillou ,  Kuo-Hua Sung ,  Young Bae Park ,  Vasudha Gupta

IPC: H01L27/32

CPC classification number: H01L27/326 ,  G02F1/133305 ,  G02F2001/133388 ,  H01L27/3297 ,  H01L51/0097 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09036 ,  H05K2201/0979 ,  H05K2201/10128 ,  Y02E10/549

Abstract: An electronic device may be provided with an organic light-emitting diode display with minimized border regions. The border regions may be minimized by providing the display with bent edge portions having neutral plane adjustment features that facilitate bending of the bent edge portions while minimizing damage to the bent edge portions. The neutral plane adjustment features may include a modified backfilm layer of the display in which portions of the backfilm layer are removed in a bend region. A display device may include a substrate, a display panel on the substrate having display pixels, and peripheral circuitry proximate the display panel and configured to drive the display pixels. A portion of the periphery of the substrate may be bent substantially orthogonal to the display panel to reduce an apparent surface area of the display device. The bent portion may include an electrode for communication with the peripheral circuitry.

Abstract translation: 电子设备可以设置有具有最小边界区域的有机发光二极管显示器。 通过为显示器提供具有中立平面调整特征的弯曲边缘部分，可以使边缘区域最小化，这有利于弯曲边缘部分的弯曲同时最小化对弯曲边缘部分的损伤。 中性平面调整特征可以包括显示器的改进的背膜层，其中后膜层的部分在弯曲区域中被去除。 显示装置可以包括衬底，具有显示像素的衬底上的显示面板以及靠近显示面板的外围电路，并被配置为驱动显示像素。 基板的周边的一部分可以基本上垂直于显示面板弯曲，以减少显示装置的表观表面积。 弯曲部分可以包括用于与外围电路通信的电极。

公开(公告)号：US20140034960A1

公开(公告)日：2014-02-06

申请号：US14014998

申请日：2013-08-30

Applicant: Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

Inventor： Michael A. Tischler ,  Philippe M. Schick ,  Ian Ashdown ,  Calvin Wade Sheen ,  Paul Jungwirth

IPC: H01L33/08 ,  H01L33/32

CPC classification number: F21K9/66 ,  F21K9/20 ,  F21K9/275 ,  F21K9/278 ,  F21K9/64 ,  F21K9/65 ,  F21V3/02 ,  F21V9/30 ,  F21V23/003 ,  F21V23/02 ,  F21V29/74 ,  F21Y2115/10 ,  G02F1/133603 ,  H01L23/367 ,  H01L23/4985 ,  H01L23/5387 ,  H01L24/32 ,  H01L24/83 ,  H01L25/0753 ,  H01L27/156 ,  H01L31/0468 ,  H01L33/0025 ,  H01L33/06 ,  H01L33/08 ,  H01L33/28 ,  H01L33/30 ,  H01L33/32 ,  H01L33/36 ,  H01L33/483 ,  H01L33/486 ,  H01L33/502 ,  H01L33/505 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L51/0097 ,  H01L2224/06102 ,  H01L2224/16225 ,  H01L2224/2929 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01063 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10321 ,  H01L2924/10322 ,  H01L2924/10323 ,  H01L2924/10324 ,  H01L2924/10328 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/10331 ,  H01L2924/10332 ,  H01L2924/10333 ,  H01L2924/10334 ,  H01L2924/10335 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/381 ,  H02S30/00 ,  H05B33/0854 ,  H05B37/0218 ,  H05B37/0227 ,  H05B37/0245 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/09036 ,  H05K2201/10106 ,  H05K2203/302 ,  H01L2924/01015 ,  H01L2924/01031 ,  H01L2924/01051 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00014

Abstract: In accordance with certain embodiments, a semiconductor die is adhered directly to a yielding substrate with a pressure-activated adhesive notwithstanding any nonplanarity of the surface of the semiconductor die or non-coplanarity of the semiconductor die contacts.

Abstract translation: 根据某些实施例，尽管半导体管芯的表面具有任何非平面性或半导​​体管芯接触件的非共面性，半导体管芯也用压力激活的粘合剂直接粘附到屈服基底上。

公开(公告)号：US20140027921A1

公开(公告)日：2014-01-30

申请号：US14005105

申请日：2012-03-16

Applicant: Reimund Oberschmid

Inventor： Reimund Oberschmid

IPC: H05K1/02 ,  H01L23/498

CPC classification number: H01L23/498 ,  H01L23/49811 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/16225 ,  H01L2224/81385 ,  H01L2924/01322 ,  H05K1/0271 ,  H05K1/111 ,  H05K2201/0133 ,  H05K2201/09036 ,  H05K2201/09263 ,  H05K2201/10106 ,  H01L2924/00

Abstract: A connection carrier for at least one semiconductor chip is disclosed. The connection carrier has a carrier body having a main surface. A first connection area and a second connection area at a distance from the first connection area are formed on the main surface. The connection carrier has a mechanical decoupling device which is intended to reduce transmission of mechanical forces from the carrier body to at least one region of the first connection area. A semiconductor component having such a connection carrier is also stated.

Abstract translation: 公开了一种用于至少一个半导体芯片的连接载体。 连接载体具有主体，主体具有主表面。 在主表面上形成有距离第一连接区域一定距离的第一连接区域和第二连接区域。 连接载体具有机械解耦装置，其旨在减少机械力从载体主体到第一连接区域的至少一个区域的传递。 还描述了具有这种连接载体的半导体部件。

公开(公告)号：US08625296B2

公开(公告)日：2014-01-07

申请号：US13158037

申请日：2011-06-10

Applicant: Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

Inventor： Shinji Watanabe ,  Nobuhiro Mikami ,  Junya Sato ,  Kenichiro Fujii ,  Katsumi Abe ,  Atsumasa Sawada

IPC: H05K7/00

CPC classification number: H05K1/18 ,  H01L24/18 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/24998 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/1515 ,  H01L2924/15151 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3511 ,  H05K1/023 ,  H05K1/0271 ,  H05K1/0284 ,  H05K1/185 ,  H05K1/189 ,  H05K3/0014 ,  H05K3/32 ,  H05K3/4644 ,  H05K2201/0187 ,  H05K2201/0191 ,  H05K2201/0195 ,  H05K2201/09018 ,  H05K2201/09036 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09436 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2203/1469 ,  H05K2203/302 ,  Y02P70/611 ,  H01L2924/00

Abstract: An object of the present invention is to allow stress that may be applied to a semiconductor package to be suppressed, when the semiconductor package is mounted on a curved board. In a mount board 1, a semiconductor package 20 is mounted on a curved board 10 including a curved surface on at least a portion thereof. The curved board 10 includes a pedestal portion 13a disposed on a region of the curved surface portion where the semiconductor package 20 is mounted and having an upper surface thereof formed flat, and a plurality of pad portions 15a disposed on the flat surface of the pedestal portion 13a. The pedestal portion 13a is formed of an insulating material. The semiconductor package 20 is mounted on the pad portions 15a.

公开(公告)号：US08624130B2

公开(公告)日：2014-01-07

申请号：US13140091

申请日：2009-11-30

Applicant: Detlev Bagung

Inventor： Detlev Bagung

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/0278 ,  H05K1/0218 ,  H05K1/028 ,  H05K2201/0191 ,  H05K2201/09036 ,  H05K2201/09781 ,  Y10T29/49165

Abstract: A circuit board has a grown metal layer in a flexible zone. A circuit board has a first part, a second part and a recess in the circuit board that is arranged between the first part and the second part. A thickness of the circuit board reduced in the region of the recess. The first part can be pivoted relative to the second part as a result of the recess. The flexibility of the circuit board is improved in the range of the recess by a metal layer applied on a surface section of the circuit board in the recess by deposition. Furthermore, EMC problems can be reduced by the metal layer on a side wall of the recess and electrical contacts to conductor path metallization layers can be created.

Abstract translation: 电路板在柔性区域中具有生长的金属层。 电路板具有布置在第一部分和第二部分之间的电路板中的第一部分，第二部分和凹部。 电路板的厚度在凹部的区域减小。 作为凹部的结果，第一部分可以相对于第二部分枢转。 通过沉积在凹部中的电路板的表面部分上施加的金属层，在凹部的范围内改善了电路板的柔性。 此外，可以通过凹部的侧壁上的金属层来减小EMC问题，并且可以产生与导体路径金属化层的电接触。

公开(公告)号：US08599571B2

公开(公告)日：2013-12-03

申请号：US12279915

申请日：2007-04-18

Applicant: Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

Inventor： Hidenobu Nishikawa ,  Daido Komyoji ,  Atsunobu Iwamoto ,  Hiroyuki Yamada ,  Shuichi Takeda ,  Shigeru Kondou

IPC: H01L23/12 ,  H01L23/02 ,  H01L23/34 ,  H05K7/00 ,  H05K7/20 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2924/19105 ,  H05K3/284 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10674 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Memory card (1) includes at least semiconductor chip (3), circuit board (2) with semiconductor chip (3) mounted on main surface (21), having at least rigidity reducing portion (23) formed in main surface (21) or in a linear region of surface (22) opposite to the main surface, and cover portion (71) for covering semiconductor chip (3) on main surface (21) of circuit board (2), wherein circuit board (2) has a plurality of convex regions (201) which flex in a convex shape toward main surface (21) due to rigidity reducing portion (23).

Abstract translation: 存储卡（1）至少包括半导体芯片（3），具有安装在主表面（21）上的半导体芯片（3）的电路板（2），至少具有形成在主表面（21）中的刚性减小部分（23）或 在与所述主表面相对的表面（22）的直线区域中，以及用于覆盖电路板（2）的主表面（21）上的半导体芯片（3）的盖部分（71），其中电路板（2）具有多个 由刚性减小部分（23）向主表面（21）弯曲成凸形的凸区域（201）。