公开(公告)号：US20090040368A1

公开(公告)日：2009-02-12

申请号：US12013916

申请日：2008-01-14

Applicant: WEN-HWA LIN ,  CHEN-KUANG YEH ,  XIANG HUANG ,  WAN-CHENG XIE ,  SHAO-GUANG MO

Inventor： WEN-HWA LIN ,  CHEN-KUANG YEH ,  XIANG HUANG ,  WAN-CHENG XIE ,  SHAO-GUANG MO

IPC: H04N5/225 ,  G03B17/00

CPC classification number: H04N5/2253 ,  H01L27/14618 ,  H01L2924/0002 ,  H04N5/2257 ,  H05K1/189 ,  H05K3/0061 ,  H05K3/0064 ,  H05K3/303 ,  H05K2201/09045 ,  H05K2201/09054 ,  H05K2201/10121 ,  H05K2201/10727 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

Abstract: An image sensor module includes a circuit board (20), an image sensor (10) and a supporting board (30). The circuit board has a plurality of circuits formed thereon. The image sensor is arranged on one side of the circuit board and is electrically connected to the circuit board. The circuit board defines at least one through opening (22) therein. The supporting board is arranged on an opposite side of the circuit board. A protrusion (31) extends outwardly from the supporting board through the at least one through opening of the circuit board. The image sensor is mounted on the protrusion.

Abstract translation: 图像传感器模块包括电路板（20），图像传感器（10）和支撑板（30）。 电路板上形成有多个电路。 图像传感器布置在电路板的一侧并电连接到电路板。 电路板在其中限定至少一个通孔（22）。 支撑板布置在电路板的相对侧。 突起（31）从支撑板向外延伸穿过电路板的至少一个通孔。 图像传感器安装在突起上。

公开(公告)号：US20080297686A1

公开(公告)日：2008-12-04

申请号：US12155079

申请日：2008-05-29

Applicant: Yuichi Hayashi

Inventor： Yuichi Hayashi

IPC: G02F1/1333

CPC classification number: G02F1/13452 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10409 ,  H05K2203/167

Abstract: A liquid crystal module includes: a liquid crystal cell; a flexible circuit board which is joined to outer peripheral portion of the liquid crystal cell; a circuit board which is joined to the flexible circuit board; a frame portion on which the circuit board is fixed by screw fastening; at least one protruding portion which protrudes to the circuit board side with regard to a surface of the frame portion on which the circuit board is attached, and which prevents rotation of the circuit board along with rotation of the screw by contacting with the circuit board.

Abstract translation: 液晶模块包括：液晶单元; 柔性电路板，其与液晶单元的外周部接合; 连接到柔性电路板的电路板; 框架部分，电路板通过螺钉固定固定在其上; 相对于安装有电路板的框架部分的表面突出到电路板侧的至少一个突出部分，并且防止电路板随着与电路板接触的旋转而旋转。

公开(公告)号：US20080257590A1

公开(公告)日：2008-10-23

申请号：US12034564

申请日：2008-02-20

Applicant: Chung W. Ho ,  Leo Shen

Inventor： Chung W. Ho ,  Leo Shen

IPC: H05K1/03 ,  H01B13/00

CPC classification number: H01L23/142 ,  H01L23/49861 ,  H01L33/64 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/44 ,  H05K2201/0355 ,  H05K2201/09054 ,  H05K2201/10106 ,  H05K2203/0323 ,  H05K2203/0369 ,  H01L2924/00

Abstract: A manufacturing process of a high thermal conducting circuit substrate is provided. First, a metal core substrate is provided and then the metal core substrate is etched at different etching speeds. Afterwards, two insulating layers are formed respectively on two sides of the etched metal core substrate. In addition, as an option, two conducting layers are formed respectively on two sides of the metal core substrate and are on top of the insulting layers. The conducting layers are patterned according to designs appropriate for the products. Because the high thermal conducting circuit substrate fabricated as the aforementioned manufacturing process mainly comprises the metal core substrate, it helps to elevate the thermal conduction of the circuit substrate itself.

Abstract translation: 提供了一种高导热电路基板的制造工艺。 首先，提供金属芯基板，然后以不同的蚀刻速度蚀刻金属芯基板。 之后，在蚀刻后的金属芯基板的两面分别形成两层绝缘层。 此外，作为选择，分别在金属芯基板的两侧形成两个导电层，并且在绝缘层的顶部。 根据适合于产品的设计对导电层进行图案化。 由于作为上述制造工艺制造的高导热电路基板主要包括金属芯基板，所以有助于提高电路基板本身的热传导。

公开(公告)号：US07340829B2

公开(公告)日：2008-03-11

申请号：US10972146

申请日：2004-10-25

Applicant: Ying-Tung Wang

Inventor： Ying-Tung Wang

IPC: H01K3/10

CPC classification number: H05K3/242 ,  B23K3/0623 ,  B23K2101/42 ,  H05K3/28 ,  H05K3/3473 ,  H05K3/4007 ,  H05K3/4602 ,  H05K2201/0367 ,  H05K2201/09054 ,  H05K2201/09481 ,  H05K2203/0152 ,  H05K2203/043 ,  H05K2203/1581 ,  Y10T29/49126 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method for fabricating an electrical connection structure of a circuit board is proposed. The circuit board is provided with a plurality of pads on a surface thereof and with a plurality of conductive structures therein for electrically connecting the pad. A plurality of openings is formed penetrating through an insulating layer provided on the circuit board to expose the pad. Subsequently, a conductive base is attached to one surface of the circuit board for electrically connecting the pad. By such arrangement, a conductive material can be formed on the pad located on the other surface of the circuit board by an electroplating process via the conductive base, the pad on the surface, and the conductive structure within the circuit board.

Abstract translation: 提出了一种用于制造电路板的电连接结构的方法。 电路板在其表面上设置有多个焊盘，并且其中具有多个导电结构，用于电连接焊盘。 形成穿过设置在电路板上的绝缘层的多个开口以露出衬垫。 随后，将导电基底连接到电路板的一个表面，用于电连接该焊盘。 通过这样的布置，可以通过电镀工艺通过电镀工艺在电路板的另一个表面上的焊盘上形成导电材料，该电镀基底，表面上的焊盘以及电路板内的导电结构。

公开(公告)号：US20060274512A1

公开(公告)日：2006-12-07

申请号：US11160015

申请日：2005-06-06

Applicant: Scott Brandenburg ,  Bruce Myers

Inventor： Scott Brandenburg ,  Bruce Myers

IPC: H05K7/00

CPC classification number: H01L23/3675 ,  H01L23/36 ,  H01L23/3677 ,  H01L24/48 ,  H01L25/105 ,  H01L2224/32188 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1532 ,  H01L2924/16152 ,  H01L2924/181 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2201/10689 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit assembly containing a surface mount (SM) IC package wire bonded to a substrate and configured to conduct heat from the package into a heat sink through a heat-conducting member instead of the substrate. The package contains an IC device with input/output pads on a surface thereof that are connected with leads to conductors on the substrate. The heat sink is located adjacent the package so as not to be separated from the package by the substrate. The heat-conducting member is positioned adjacent the surface of the device opposite its input/output pads, and is bonded to the device and heat sink to provide a heat path between the package and heat sink that does not pass through the substrate.

Abstract translation: 一种电路组件，其包含结合到衬底上的表面安装（SM）IC封装线，并被配置为通过导热构件而不是衬底将热量从封装传导到散热器。 该封装包含IC器件，其表面上具有输入/输出焊盘，其与导体连接到衬底上的导体。 散热器位于封装附近，以便不被基板与封装分离。 导热构件邻近装置的与输入/输出垫相对的表面定位，并且结合到装置和散热器，以在封装和散热器之间提供不通过衬底的热路径。

公开(公告)号：US06971160B1

公开(公告)日：2005-12-06

申请号：US10034769

申请日：2002-01-03

Applicant: Ryan J. Welch ,  Tony K. Quach

Inventor： Ryan J. Welch ,  Tony K. Quach

IPC: H01K3/30 ,  H01L23/66 ,  H05K1/02

CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L2224/16 ,  H01L2224/32188 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/1423 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/3011 ,  H05K1/0204 ,  H05K3/0061 ,  H05K2201/09054 ,  H05K2203/0228 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T29/53178 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A hybrid integrated circuit fabrication method in which an insulating substrate member and its metallic substrate carrier are made to be mating with precision through use of computer controlled machining performed on each member. A combination of disclosed specifically tailored software and commercially available software are used in the method to generate code for controlling a precision milling machine during the fabrication of substrate and substrate carrier members. The method for precision mating of substrate and substrate carrier enable disposition of a precision recess in the substrate carrier and the location of recess pillars and pedestals (the latter being for integrated circuit die mounting use) at any carrier recess location desirable for electrical, thermal or physical strength reasons. Enhanced electrical thermal and physical properties are achieved in hybrid devices fabricated according to the method especially when compared with devices and methods having the limited availability of comparable elements afforded by previous hybrid fabrication arrangements.

Abstract translation: 一种混合集成电路制造方法，其中通过使用对每个部件执行的计算机控制加工，使绝缘基板部件及其金属基板载体精确配合。 所公开的专门定制的软件和市售软件的组合被用于生成用于在制造衬底和衬底载体构件期间控制精密铣床的代码的方法。 基板和基板载体的精密匹配方法能够在基板载体上布置精密凹槽，并且可以在任何载体凹槽位置处设置凹槽和基座（后者用于集成电路模具安装用途） 体力原因 特别是当与先前的混合制造装置提供的可比元件的有限可用性的装置和方法相比时，在根据该方法制造的混合装置中实现增强的电热和物理性能。

公开(公告)号：US20050152118A1

公开(公告)日：2005-07-14

申请号：US10926070

申请日：2004-08-26

Applicant: Sung-wook Cho

Inventor： Sung-wook Cho

IPC: G06F1/20 ,  G11B17/04 ,  G11B33/12 ,  G11B33/14 ,  H01L23/13 ,  H01L23/34 ,  H01L23/367 ,  H05K1/02 ,  H05K7/20

CPC classification number: G11B33/123 ,  G06F1/20 ,  G11B17/056 ,  G11B33/1426 ,  H01L23/13 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K7/20436 ,  H05K2201/09054 ,  H05K2201/10416 ,  H05K2201/10689 ,  H01L2924/00

Abstract: A device to cool an integrated circuit element, the device having a printed circuit board with a through hole smaller than the integrated circuit element; a cooling pad attached to a first element surface of the integrated circuit element, and positioned inside the through hole; and a heat transfer portion connected with a heat absorption body and making contact with the cooling pad, to transfer heat to the heat absorption body, so that the integrated circuit element is cooled by transferring the heat generated in the integrated circuit element, which is mounted on a first surface of the printed circuit board, to the heat absorption body, which is disposed facing a second surface of the printed circuit board opposite the first surface.

Abstract translation: 一种用于冷却集成电路元件的装置，该装置具有具有比该集成电路元件小的通孔的印刷电路板; 安装在集成电路元件的第一元件表面上并位于通孔内的冷却垫; 以及与吸热体连接并与冷却垫接触的传热部，将热量传递到吸热体，使得集成电路元件通过传递集成电路元件中产生的热而被冷却，该集成电路元件安装 在所述印刷电路板的第一表面上，与所述印刷电路板的与所述第一表面相对的第二表面设置的吸热体。

公开(公告)号：US20050105277A1

公开(公告)日：2005-05-19

申请号：US10958614

申请日：2004-10-05

Applicant: Michael Frisch

Inventor： Michael Frisch

IPC: H01L23/367 ,  H05K1/02 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K2201/0397 ,  H05K2201/09054 ,  H05K2201/10166 ,  H01L2924/00

Abstract: The present invention relates to a power unit comprising at least one power electronics module, a circuit carrier, which is connected to said power electronics module, and at least one heat sink, which is connected to said power electronics module, in order to dissipate heat. The invention also relates to an associated heat sink and a corresponding assembly method. In order to provide a power unit and an associated assembly method which allows improved dissipation of air heat, as well as adequate electrical insulation of the power modules and simplified implementation, the circuit carrier comprises at least one through hole. At least one contact extension located on the heat sink, which is at least partially received by the through hole. The contact extension of the heat sink is thermally contacted with the power electronics module by means of a heat-conductive material.

Abstract translation: 本发明涉及一种功率单元，其包括至少一个功率电子模块，连接到所述功率电子模块的电路载体和连接到所述功率电子模块的至少一个散热器，以便散热 。 本发明还涉及相关联的散热器和相应的组装方法。 为了提供功率单元和相关联的组装方法，其允许改善空气热的耗散，以及功率模块的充分的电绝缘和简化的实现，电路载体包括至少一个通孔。 位于散热器上的至少一个接触延伸部分，其至少部分地被通孔接收。 散热器的接触延伸通过导热材料与电力电子模块热接触。

公开(公告)号：US20040233642A1

公开(公告)日：2004-11-25

申请号：US10846871

申请日：2004-05-14

Inventor： Kazutoshi Ito ,  Takamasa Oguri ,  Akihiro Mizutani

IPC: H05K007/20

CPC classification number: H05K1/0206 ,  H01L23/3677 ,  H01L23/42 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/181 ,  H05K3/429 ,  H05K2201/09054 ,  H05K2201/0959 ,  H05K2201/10166 ,  Y10T428/31681 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/43 ,  H01L2924/00012

Abstract: A heat dissipation structure includes a heat-producing electronic component on a substrate, a thermally conductive case, and grease. The electronic component and the substrate are housed in the case. The grease is provided between the case and the electronic component or the substrate for transmitting heat produced by the electronic component to the case. The case has contact surfaces that contact with the grease. The contact surfaces have free energy equal to or higher than 20 mN/m and roughness equal to or larger than 1.0 nullm.

Abstract translation: 散热结构包括在基板上的发热电子部件，导热壳体和油脂。 电子部件和基板被容纳在壳体中。 在壳体和电子部件或基板之间设置有用于将由电子部件产生的热量传递到壳体的润滑脂。 外壳有与油脂接触的接触表面。 接触面的自由能等于或大于20mN / m，粗糙度等于或大于1.0μm。

公开(公告)号：US06762939B2

公开(公告)日：2004-07-13

申请号：US10079181

申请日：2002-02-20

Applicant: Mark D. Summers ,  Javíer Leija

Inventor： Mark D. Summers ,  Javíer Leija

IPC: H05K720

CPC classification number: H05K7/20436 ,  H05K1/0204 ,  H05K2201/09054 ,  H05K2203/1572 ,  Y10T29/4935

Abstract: A bottom heat dissipating device may be attached to a bottom surface of a printed circuit board (PCB). A top surface of the bottom heat dissipating device may be thermally coupled with a backside surface of one or more electronic components mounted on the bottom surface of the PCB. A top heat dissipating device may be attached to a top surface of the PCB. The top heat dissipating device may be thermally coupled with the bottom heat dissipating device through a thermally conductive coupling member to provide a conductive path for heat transfer from the bottom heat dissipating device to the top heat dissipating device. An opening adjacent to an edge of the thermally conductive coupling member may allow air flow between the top and bottom heat dissipating devices. The PCB may be part of a mezzanine card, such as a Peripheral Component Interconnect (PCI) mezzanine card (PMC).

Abstract translation: 底部散热装置可附接到印刷电路板（PCB）的底表面。 底部散热装置的顶表面可以与安装在PCB的底表面上的一个或多个电子部件的背面热耦合。 顶部散热装置可附接到PCB的顶表面。 顶部散热装置可以通过导热联接构件与底部散热装置热耦合，以提供用于从底部散热装置到顶部散热装置的热传递的导电路径。 与导热联接构件的边缘相邻的开口可以允许空气在顶部和底部散热装置之间流动。 PCB可以是夹层卡的一部分，例如外围组件互连（PCI）夹层卡（PMC）。