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    Double-sided printed circuit connection board with insertable male connector plug
    121.
    发明授权
    Double-sided printed circuit connection board with insertable male connector plug 失效
    双面印刷电路连接板，带插入式插头

    公开(公告)号：US3897126A

    公开(公告)日：1975-07-29

    申请号：US46977374

    申请日：1974-05-14

    Applicant: FRANCES ANDRE L ,  BROCHON JACK E

    Inventor： FRANCES ANDRE L ,  BROCHON JACK E

    IPC: H01R12/72 ,  H05K1/11 ,  H05K1/14 ,  H05K3/34 ,  H05K3/36 ,  H05K1/04

    CPC classification number: H01R12/725 ,  H05K1/117 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10424 ,  H05K2201/1081 ,  H05K2201/2036

    Abstract: A printed circuit connection board having equally spaced, parallel contact strips on each side extending from the same edge of the board and including two rows of holes in the board which are parallel and extend transversely to said strips, the strips on one side of the board leading to the row holes of nearer said edge of the board and the strips on the other side of the board leading to the holes of the other row and passing between holes of the first named row. Connections between the board and an insertable male conductor plug, separated by an insulating bar, are ensured by metal rods which are relatively short brads in the case of soldered connections between board and plug and relatively long pins in the case of wrapped connections between the same board and plug.

    Abstract translation: 一种印刷电路连接板，其在每个侧面上具有相等间隔的平行接触条，其从板的相同边缘延伸并且包括平行并横向于所述条的板中的两排孔，板的一侧上的条 导致板的更靠近所述边缘的排孔和板的另一侧上的条带通向另一排的孔并且在第一命名行的孔之间通过。 由绝缘棒分开的板和可插入的公导体插头之间的连接由金属棒确保，金属棒在板和插头之间的焊接连接的情况下是相对短的，而在相同的长度的引脚之间， 板和插头。

    Panel board mounting and interconnection system for electronic logic circuitry
    122.
    发明授权
    Panel board mounting and interconnection system for electronic logic circuitry 失效
    用于电子逻辑电路的面板安装和互连系统

    公开(公告)号：US3891898A

    公开(公告)日：1975-06-24

    申请号：US40550073

    申请日：1973-10-11

    Applicant: AUGAT INC

    Inventor： DAMON NEIL F

    IPC: H05K1/00 ,  H05K1/16 ,  H05K1/18 ,  H05K3/22 ,  H05K3/32 ,  H05K7/02 ,  H05K7/10 ,  H05K7/14 ,  H05K1/04

    CPC classification number: H05K3/222 ,  H01R12/523 ,  H05K1/0287 ,  H05K1/16 ,  H05K7/103 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10689

    Abstract: A panel board mounting and interconnection system for electronic logic circuitry. The system includes a panel board having arrays of wire wrapping pins projecting from one side, the other side of the board being adapted to receive integrated circuit modules and other electronic components for interconnection through leads connected to the wire wrapping pins. Selected pins within a single array are interconnected by means of a printed circuit substrate mounted to the pins parallel to the panel board, the printed circuit including passive elements such as resistors or capacitors or both.

    Abstract translation: 用于电子逻辑电路的面板安装和互连系统。 该系统包括具有从一侧突出的线缠绕线阵列的面板，板的另一侧适于接收集成电路模块和其它电子部件，用于通过连接到线缠绕销的引线互连。 单个阵列中的选定引脚通过安装到平行于面板板的引脚的印刷电路基板互连，印刷电路包括诸如电阻器或电容器的无源元件或两者。

    Method of manufacturing a multi-layered strip transmission line printed circuit board integrated package
    123.
    发明授权
    Method of manufacturing a multi-layered strip transmission line printed circuit board integrated package 失效

    公开(公告)号：US3867759A

    公开(公告)日：1975-02-25

    申请号：US36965473

    申请日：1973-06-13

    Applicant: US AIR FORCE

    Inventor： SIEFKER ROBERT G

    IPC: H05K1/02 ,  H05K1/14 ,  H05K3/42 ,  H05K3/46 ,  H05K3/36

    CPC classification number: H05K1/142 ,  H05K1/0237 ,  H05K3/429 ,  H05K3/4614 ,  H05K3/4623 ,  H05K2201/09536 ,  H05K2201/096 ,  H05K2201/09963 ,  H05K2201/10303 ,  H05K2203/061 ,  Y10T29/49126

    Abstract: The method of manufacturing the integrated package includes, but is not limited to, the steps of: fabricating a plurality of identical strip transmission line printed circuit board segments, which are to be used to form a plurality, preferably two, of printed circuit boards, with each board to be a layer in and of the multi-layered integrated package; joining the segments, which collectively constitute and define each circuit board layer, in coplanar relationship, to form the respective circuit boards, drilling, and plating with an electrically conductive material, a plurality of signal path holes in and through each segment of each circuit board (i.e., each layer); inserting one end of a different two-ended electrically conductive wire into each plated signal path hole in the first circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each wire and its respective plated hole in the first layer; inserting the other end of each wire in a different plated signal path hole in the second circuit board layer, and soldering that end in place to its respective plated signal path hole, thereby providing electrical contact by and between each end of each wire and the two plated signal path holes to which each wire is soldered, and also thereby providing electrical conductivity between, and from and to, the first and the second layers of printed circuit boards; and, bonding the second layer to the first layer in stacked relationship. By cascading the interconnection (i.e., adding a third layer to the two-layered package, and electrically interconnecting the third layer to the second layer), an integrated package of as many layers as desired or as needed may be formed, without having to penetrate more than any two adjacent layers of circuit boards at any one time. The method may be significantly varied, by performing additional steps to drill, plate and align one or more grounded holes in the circuit board layers, to improve the electrical performance of the transition.

    Method of fabricating selectively applied flowable solder joints
    124.
    发明授权
    Method of fabricating selectively applied flowable solder joints 失效
    制造选择性流动的焊接接头的方法

    公开(公告)号：US3849870A

    公开(公告)日：1974-11-26

    申请号：US30649872

    申请日：1972-11-14

    Applicant: AMP INC

    Inventor： COBAUGH R ,  PARMER K

    IPC: B23K1/20 ,  B23K3/06 ,  H01R4/02 ,  H05K3/34

    CPC classification number: B23K1/20 ,  B23K3/0676 ,  B23K2201/36 ,  H01R4/028 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2201/10984 ,  H05K2201/2081 ,  Y10T29/49149

    Abstract: An electrical terminal structure is disclosed which is provided with a flow deposited quantity or band of solder adhered to a selected portion of the terminal and limited from spreading over the surface of the terminal by the presence of a soldernonwettable material adjacent to but not necessarily touching the terminal. A method of mounting the banded electrical terminals in plated apertures provided in a substrate is also disclosed, wherein the solder bands are applied to the terminals according to the above mentioned application technique. A technique of flattening the solder bands, and the resulting terminal structures having flattened solder bands adhered thereto are also disclosed. Flattening of the solder bands facilitates insertion of the banded terminals into the plated apertures by changing the shape of the solder bands and by reducing their structural integrity though the creation of numerous hairline fractures.

    Abstract translation: 公开了一种电气端子结构，其具有粘附到端子的选定部分上的流动沉积量或焊料带，并且被限制在端子的表面上通过存在不可焊接材料而不是必须 触摸终端 还公开了将带状电端子安装在设置在基板中的电镀孔中的方法，其中根据上述应用技术将焊带施加到端子。 还公开了使焊接条平坦化的技术，并且所得到的端接结构具有粘附在其上的扁平焊接带。 焊接带的平坦化有助于通过改变焊接带的形状并通过减少其结构完整性来将带状端子插入电镀孔中，同时产生许多发条断裂。

    Method of connecting electrical component
    125.
    发明授权
    Method of connecting electrical component 失效
    连接电气元件的方法

    公开(公告)号：US3825999A

    公开(公告)日：1974-07-30

    申请号：US31858972

    申请日：1972-12-26

    Applicant: UNITED WIRING AND MFG CO INC

    Inventor： RUBEY U

    IPC: H05K13/06 ,  H05K1/00 ,  H05K3/10 ,  H05K3/22 ,  H05K3/30 ,  H05K3/34 ,  H05K7/06 ,  H05K3/32

    CPC classification number: H05K3/222 ,  H05K1/0287 ,  H05K3/301 ,  H05K3/3447 ,  H05K7/06 ,  H05K2201/10287 ,  H05K2201/10303 ,  H05K2201/10689 ,  H05K2201/10924 ,  Y10T29/49139 ,  Y10T29/49149

    Abstract: A circuit board employs solder pads plated onto the reverse side of an insulative board in an orthogonal array and connected to aligned conductive areas on the obverse side by plated-through holes. Wire guides including upstanding fingers mount on the reverse side of the board with conductive pins from electrical components extending through the holes in the board from the obverse side to the reverse side. Insulated wire is threaded around the pins of the electrical components and guide in accordance with a predetermined pattern of component interconnections. For interconnections between points on the board, wire is threaded substantially orthogonally. Where wire is to be severed, it is threaded angularly relative to the orthogonal array. After wire threading, the wire is selectively soldered to contact areas while evaporating locally the insulation thereon and component pins are soldered in platedthrough holes. All angularly arrayed segments of the wire are cut and loose portions removed leaving only wire segments which form desired interconnections.

    Abstract translation: 电路板使用以正交阵列电镀在绝缘板的背面上的焊盘，并且通过电镀通孔连接到正面的对准的导电区域。 包括直立手指的导线器安装在板的背面，导电引脚由电气部件延伸穿过板的孔，从正面到反面。

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