公开(公告)号：US20160165330A1

公开(公告)日：2016-06-09

申请号：US14856262

申请日：2015-09-16

Applicant: INVENSENSE, INC.

Inventor： Anthony D. Minervini ,  Kieran Harney ,  Aleksey S. Khenkin ,  Baris Cagdaser

IPC: H04R1/02 ,  H04R19/04 ,  G01K13/00 ,  H04R19/00

CPC classification number: H04R1/028 ,  B81B7/0087 ,  B81B2201/0257 ,  B81B2201/0278 ,  B81B2207/012 ,  G01K13/00 ,  H04R19/005 ,  H04R19/04 ,  H04R2231/00

Abstract: Various embodiments provide for an integrated temperature sensor and microphone package where the temperature sensor is located in, over, or near an acoustic port associated with the microphone. This placement of the temperature sensor near the acoustic port enables the temperature sensor to more accurately determine the ambient air temperature and reduces heat island interference cause by heat associated with the integrated circuit. In an embodiment, the temperature sensor can be a thermocouple formed over a substrate, with the temperature sensing portion of the thermocouple formed over the acoustic port. In another embodiment, the temperature sensor can be formed on an application specific integrated circuit that extends into or over the acoustic port. In another embodiment, a thermally conductive channel in a substrate can be placed near the acoustic port to enable the temperature sensor to determine the ambient temperature via the channel.

Abstract translation: 各种实施例提供了一种集成温度传感器和麦克风封装，其中温度传感器位于与麦克风相关联的声学端口中，上方或附近。 温度传感器靠近声学端口的放置使得温度传感器能够更准确地确定环境空气温度并减少与集成电路相关联的热引起的热岛干扰。 在一个实施例中，温度传感器可以是形成在衬底上的热电偶，热电偶的温度感测部分形成在声学端口上。 在另一个实施例中，温度传感器可以形成在延伸到声学端口中或上方的专用集成电路上。 在另一个实施例中，衬底中的导热通道可以放置在声学端口附近，以使得温度传感器能够经由通道确定环境温度。

公开(公告)号：US09363609B2

公开(公告)日：2016-06-07

申请号：US14044654

申请日：2013-10-02

Applicant: Infineon Technologies AG

Inventor： Wolfgang Friza ,  Thomas Grille ,  Klaus Muemmler ,  Guenter Ziegler ,  Carsten Ahrens

IPC: H01L29/00 ,  H04R23/00 ,  B81C1/00 ,  G01L9/00 ,  H04R19/00 ,  H04R31/00

CPC classification number: H04R23/00 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0315 ,  B81C1/00047 ,  B81C1/00936 ,  B81C2201/0109 ,  G01L9/0042 ,  H04R19/005 ,  H04R31/006

Abstract: Embodiments show a method for fabricating a cavity structure, a semiconductor structure, a cavity structure for a semiconductor device and a semiconductor microphone fabricated by the same. In some embodiments the method for fabricating a cavity structure comprises providing a first layer, depositing a carbon layer on the first layer, covering at least partially the carbon layer with a second layer to define the cavity structure, removing by means of dry etching the carbon layer between the first and second layer so that the cavity structure is formed.

公开(公告)号：US09359191B2

公开(公告)日：2016-06-07

申请号：US14659693

申请日：2015-03-17

Applicant: Amkor Technology, Inc.

Inventor： David Bolognia ,  Bob Shih-Wei Kuo ,  Bud Troche

IPC: H01L23/10 ,  H01L23/34 ,  B81B7/00 ,  H01L23/552 ,  H01L23/00 ,  H01L25/16

CPC classification number: B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/095 ,  H01L23/552 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/165 ,  H01L2224/32225 ,  H01L2224/48095 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49171 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/12041 ,  H01L2924/1461 ,  H01L2924/19107 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: Methods and systems for a reversible top/bottom MEMS package may comprise a base substrate comprising metal traces, an opening through the base substrate, a die coupled to a first surface of the substrate and positioned over the opening, a frame member coupled to the first surface of the substrate wherein the die is positioned interior of the frame member, a cover substrate coupled to the frame member, and conductive plating on the frame member that electrically couples the base substrate to the cover substrate, wherein the conductive plating is exposed. The conductive plating may couple a ground plane in the base substrate to a ground plane in the cover substrate. The conductive plating may be exposed at an outer surface of the frame member and/or at an inner perimeter of the frame member. Conductive vias within the frame member may be coupled to the metal traces in the base substrate.

Abstract translation: 用于可逆的顶部/底部MEMS封装的方法和系统可以包括基底衬底，其包括金属迹线，通过基底衬底的开口，与衬底的第一表面连接并定位在开口上的模具，耦合到第一 基板的表面，其中模具位于框架构件的内部，连接到框架构件的盖基板和在框架构件上的导电电镀，其将基底基板电耦合到盖基板，其中导电电镀被暴露。 导电电镀可以将基底衬底中的接地平面耦合到覆盖衬底中的接地平面。 导电电镀可以在框架构件的外表面和/或在框架构件的内周边处露出。 框架构件内的导电孔可以连接到基底衬底中的金属迹线。

公开(公告)号：US09337354B2

公开(公告)日：2016-05-10

申请号：US14797436

申请日：2015-07-13

Applicant: Unisem (M) Berhad

Inventor： Rob Protheroe ,  Alan Evans ,  Timothy Leung ,  Tang Ming Xiang ,  Guan JunHua

IPC: H01L29/84 ,  B81C1/00 ,  B81B7/00 ,  H01L23/053 ,  G01L9/00 ,  H04R1/02 ,  H04R1/04

CPC classification number: H01L29/84 ,  B81B7/0041 ,  B81B7/0058 ,  B81B2201/0257 ,  B81B2203/0127 ,  B81B2207/012 ,  B81C1/00269 ,  B81C1/00309 ,  B81C1/00333 ,  B81C2203/0109 ,  B81C2203/052 ,  G01L9/0042 ,  H01L23/053 ,  H01L2224/16225 ,  H04R1/021 ,  H04R1/04 ,  H04R2201/003

Abstract: A method for the manufacture of a package encasing a Micro-Electro-Mechanical Systems (MEMS) device provides a cover having a lid and sidewalls with a port extending through the lid. A first base component is bonded to the sidewalls defining an internal cavity. This first base component further includes an aperture extending therethrough. The MEMS device is inserted through the aperture and bonded to the lid with the MEMS device at least partially overlapping the port. Assembly is completed by bonding a second base component to the first base component to seal the aperture. The package so formed has a cover with a lid, sidewalls and a port extending through the lid. A MEMS device is bonded to the lid and electrically interconnected to electrically conductive features disposed on the first base component. A second base component is bonded to the first base component spanning the aperture.

公开(公告)号：US09332330B2

公开(公告)日：2016-05-03

申请号：US13947930

申请日：2013-07-22

Applicant: Infineon Technologies AG

Inventor： Klaus Elian ,  Horst Theuss ,  Thomas Mueller

IPC: H04R11/04 ,  H04R1/04 ,  H01L29/84

CPC classification number: H04R1/04 ,  B81B2201/0257 ,  H04R2201/00 ,  H04R2499/11

Abstract: A surface mountable microphone package includes a first microphone and a second microphone. Furthermore, the surface mountable microphone package includes a first opening for the first microphone and a second opening for the second microphone. The first opening and the second opening are arranged on opposite sides of the surface mountable microphone package.

Abstract translation: 表面安装式麦克风封装包括第一麦克风和第二麦克风。 此外，表面可安装麦克风封装包括用于第一麦克风的第一开口和用于第二麦克风的第二开口。 第一开口和第二开口布置在可表面安装的麦克风包装的相对侧上。

公开(公告)号：US09319764B2

公开(公告)日：2016-04-19

申请号：US13790219

申请日：2013-03-08

Applicant: Merry Electronics CO., Ltd.

Inventor： Jen-Yi Chen

IPC: H04R1/04 ,  H04R19/00 ,  H01L29/84

CPC classification number: H04R1/04 ,  B81B2201/0257 ,  H01L29/84 ,  H01L2224/32145 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/49109 ,  H01L2224/73265 ,  H01L2224/8592 ,  H01L2924/15151 ,  H01L2924/16152 ,  H01L2924/181 ,  H04R19/005 ,  H04R2201/003 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention provides a MEMS microphone packaging structure for reducing the packaging structure volume, lowering manufacturing cost and improving impact resistance. The packaging structure has a large back cavity formed by a recess of a controlling chip and a deep hole of a MEMS microphone chip. The controlling chip is disposed on the MEMS microphone chip for protecting the MEMS microphone chip. A plastic molding process can be applied on the packaging structure. A plurality of pads on a base of the packaging structure are protected by sealant or primer for protection against corrosion under atmospheric condition. In conclusion, the invention has advantages of small volume and thinner thickness without downgrading the performance, and the manufacturing cost can be lowered.

Abstract translation: 本发明提供了一种用于降低封装结构体积，降低制造成本和改善耐冲击性的MEMS麦克风封装结构。 封装结构具有由控制芯片的凹部和MEMS麦克风芯片的深孔形成的大后腔。 控制芯片设置在MEMS麦克风芯片上，用于保护MEMS麦克风芯片。 塑料成型工艺可以应用在包装结构上。 包装结构的基座上的多个垫片由密封剂或底漆保护，以防止在大气条件下的腐蚀。 总之，本发明具有体积小，厚度薄的优点，而不降低性能，可以降低制造成本。

公开(公告)号：US20160068386A1

公开(公告)日：2016-03-10

申请号：US14942969

申请日：2015-11-16

Applicant: Invensense, Inc.

Inventor： Mei-Lin Chan ,  Xiang Li ,  Martin Lim

IPC: B81C1/00

CPC classification number: B81C1/00238 ,  B81B3/0021 ,  B81B3/0086 ,  B81B7/0006 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81C1/00158 ,  B81C2203/035 ,  B81C2203/0785 ,  H01L41/0926 ,  H01L41/0973 ,  H01L41/1132 ,  H01L41/1138 ,  H04R7/08 ,  H04R19/005 ,  H04R19/04

Abstract: A MEMS device includes a dual membrane, an electrode, and an interconnecting structure. The dual membrane has a top membrane and a bottom membrane. The bottom membrane is positioned between the top membrane and the electrode and the interconnecting structure defines a spacing between the top membrane and the bottom membrane.

Abstract translation: MEMS器件包括双膜，电极和互连结构。 双膜具有顶膜和底膜。 底部膜位于顶部膜和电极之间，并且互连结构限定顶部膜和底部膜之间的间隔。

公开(公告)号：US09260298B1

公开(公告)日：2016-02-16

申请号：US14531256

申请日：2014-11-03

Applicant: LINGSEN PRECISION INDUSTRIES, LTD.

Inventor： Hsien-Ken Liao ,  Ming-Te Tu

IPC: H01L27/04 ,  B81C1/00 ,  H04R31/00

CPC classification number: B81C1/0023 ,  B81B7/007 ,  B81B2201/0257 ,  B81B2207/012 ,  B81B2207/093 ,  B81B2207/095 ,  B81C2203/0127 ,  B81C2203/0154 ,  B81C2203/0792 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/8592 ,  H04R1/04 ,  H04R31/00 ,  H04R2201/003 ,  H01L2924/00014

Abstract: A stacked MEMS microphone packaging method includes the steps of: providing a substrate having a conducting part and a through hole; affixing a retaining wall to the substrate and forming a conducting circuit in electrical connection with the conducting part; mounting a processor chip and a sensor chip on the substrate to have the sensor chip be disposed at a top side of the through hole; providing a carrier board having a first solder pad and a second solder pad and fixedly mounting the carrier board at the retaining wall and electrically coupled to the first solder pad and the second solder pad. Thus, the method can make a flip architecture MEMS microphone, reducing the steps of the packaging process and lowering the degree of difficulty of the manufacturing process and the manufacturing costs.

Abstract translation: 层叠的MEMS麦克风封装方法包括以下步骤：提供具有导电部分和通孔的基板; 将固定壁固定到基底上并形成与导电部件电连接的导电电路; 将处理器芯片和传感器芯片安装在基板上以使传感器芯片设置在通孔的顶侧; 提供具有第一焊盘和第二焊盘的载板，并将载板固定地安装在挡墙处并电耦合到第一焊盘和第二焊垫。 因此，该方法可以制造MEMS麦克风的翻转架构，减少封装过程的步骤，降低制造过程的难度和制造成本。

公开(公告)号：US09226079B2

公开(公告)日：2015-12-29

申请号：US14220985

申请日：2014-03-20

Applicant: STMicroelectronics S.r.l.

Inventor： Alessandra Sciutti ,  Matteo Perletti ,  Sebastiano Conti ,  Roberto Carminati

IPC: H04R25/00 ,  H04R19/00 ,  H04R19/04

CPC classification number: H04R19/005 ,  B81B7/0029 ,  B81B2201/0257 ,  B81B2203/0118 ,  B81B2203/0127 ,  G01L9/0073 ,  H04R19/04

Abstract: A microelectromechanical sensing structure for a capacitive acoustic transducer, including: a semiconductor substrate; a rigid electrode; and a membrane set between the substrate and the rigid electrode, the membrane having a first surface and a second surface, which are in fluid communication, respectively, with a first chamber and a second chamber, respectively, the first chamber being delimited at least in part by a first wall portion and a second wall portion formed at least in part by the substrate, the second chamber being delimited at least in part by the rigid electrode, the membrane being moreover designed to undergo deformation following upon incidence of pressure waves and facing the rigid electrode so as to form a sensing capacitor having a capacitance that varies as a function of the deformation of the membrane. The structure moreover includes a beam, which is connected to the first and second wall portions and is designed to limit the oscillations of the membrane.

Abstract translation: 一种用于电容式声换能器的微机电感测结构，包括：半导体衬底; 刚性电极; 以及膜，其设置在所述基底和所述刚性电极之间，所述膜具有第一表面和第二表面，所述第一表面和第二表面分别与第一腔室和第二腔室流体连通，所述第一腔室至少在 部分由第一壁部分和至少部分地由基底形成的第二壁部分，第二室至少部分地由刚性电极限定，该膜还被设计成在压力波入射之后经历变形，并且面向 刚性电极，以形成感测电容器，该感测电容器具有作为膜的变形的函数而变化的电容。 该结构还包括梁，其连接到第一和第二壁部分并被设计成限制膜的振荡。

公开(公告)号：US09184131B2

公开(公告)日：2015-11-10

申请号：US14127580

申请日：2012-06-29

Applicant: Heikki Kuisma

Inventor： Heikki Kuisma

IPC: H01L23/00 ,  H01L23/528 ,  H01L25/16 ,  H01L25/18 ,  B81C1/00 ,  G01P1/02 ,  H01L23/538 ,  G01L19/14 ,  G01P15/08 ,  G01C19/5783 ,  H01L25/00 ,  H01L21/56 ,  H01L27/146 ,  G01L19/00

CPC classification number: B81B7/0074 ,  B81B2201/0235 ,  B81B2201/025 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/036 ,  B81B2207/012 ,  B81B2207/095 ,  B81C1/00333 ,  G01C19/5783 ,  G01L19/0084 ,  G01L19/148 ,  G01P1/023 ,  G01P1/026 ,  G01P15/0802 ,  H01L21/568 ,  H01L23/528 ,  H01L23/5389 ,  H01L24/16 ,  H01L24/17 ,  H01L24/19 ,  H01L24/32 ,  H01L24/73 ,  H01L24/83 ,  H01L24/92 ,  H01L24/96 ,  H01L24/97 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L27/14618 ,  H01L2223/6677 ,  H01L2224/12105 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8312 ,  H01L2224/8319 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/1461 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00012 ,  H01L2924/00

Abstract: A method of making a system-in-package device, and a system-in-package device is disclosed. In the method, at least one first species die with predetermined dimensions, at least one second species die with predetermined dimensions, and at least one further component of the system-in-device is included in the system-in package device. At least one of the first and second species dies is selected for redimensioning, and material is added to at least one side of the selected die such that the added material and the selected die form a redimensioned die structure. A connecting layer is formed on the redimensioned die structure. The redimensioned die structure is dimensioned to allow mounting of the non-selected die and the at least one further component into contact with the redimensioned die structure via the connecting layer.

Abstract translation: 公开了一种制造系统级封装器件的方法，以及一种系统级封装器件。 在该方法中，具有预定尺寸的至少一个第一种类模具，具有预定尺寸的至少一种第二种类模具，并且系统级装置中的至少一个其它部件包括在系统级封装装置中。 选择第一和第二种类模具中的至少一种用于重新定向，并且将材料添加到所选择的模具的至少一侧，使得添加的材料和所选择的模具形成重新定型的模具结构。 在重新定型的模具结构上形成连接层。 尺寸设计为重新定型的模具结构，以允许非选择的模具和至少一个另外的部件通过连接层与重新定向的模具结构接触。