公开(公告)号：US20070160829A1

公开(公告)日：2007-07-12

申请号：US11481720

申请日：2006-07-05

Applicant: Stefan Gloede ,  Jurgen Hagen

Inventor： Stefan Gloede ,  Jurgen Hagen

IPC: B32B15/08 ,  B32B27/18

CPC classification number: H05K3/386 ,  B29C65/481 ,  B29C65/483 ,  B29C65/4865 ,  B29C65/5021 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/43441 ,  B29C66/4722 ,  B29C66/71 ,  B29C66/73921 ,  B29C66/742 ,  B29K2071/00 ,  B29K2079/085 ,  B29K2081/04 ,  B29K2081/06 ,  B29K2101/10 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2995/0015 ,  B29K2995/0039 ,  B29K2995/004 ,  B32B15/08 ,  C08J7/045 ,  C09D5/38 ,  H05K1/0201 ,  H05K1/0313 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/0129 ,  H05K2201/10318 ,  Y10T428/264 ,  Y10T428/31678 ,  Y10T428/31681

Abstract: A plastic component with a metal layer applied to the surface for electrical contacting of electrical elements ensuing in a thermal attachment method, particularly in a soldering method, has a layer composed of a duroplastic synthetic or a highly heat-resistant thermoplastic synthetic, on which layer a metal layer is applied, applied on the component carrier made of a thermoplastic synthetic, at least in the region of the contacting point or points. The duroplastic synthetic is a hardened resin, and the resin layer is generated by application of the liquid resin by serigraphy, roller coating or spraying, or the highly heat-resistant thermoplastic synthetic is applied in the form of a film.

Abstract translation: 特别是在焊接方法中，具有金属层的金属层用于电气元件的电接触的塑料部件具有由抗弯强度合成或高耐热热塑性合成材料组成的层，其上层 至少在接触点或点的区域中施加金属层，施加在由热塑性合成物制成的部件载体上。 合成树脂是硬化树脂，树脂层通过使用液体树脂通过丝印，辊涂或喷涂而产生，或者以薄膜形式施加高耐热性热塑性合成物。

公开(公告)号：US20070095566A1

公开(公告)日：2007-05-03

申请号：US11586687

申请日：2006-10-26

Applicant: Yoshihiro Nishida

Inventor： Yoshihiro Nishida

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K1/111 ,  H01L2224/16225 ,  H05K1/0201 ,  H05K3/3452 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/094 ,  H05K2201/0969 ,  H05K2201/10734 ,  Y02P70/611

Abstract: According to one embodiment, disclosed is a printed wiring board in which a plurality of pads are formed on the substrate surface, a surface conductor layer is formed around the pads, and at least one of the pads is partially in contact with the surface conductor layer.

Abstract translation: 根据一个实施例，公开了一种印刷电路板，其中在基板表面上形成多个焊盘，在焊盘周围形成表面导体层，并且至少一个焊盘部分地与表面导体层接触 。

公开(公告)号：US20070074897A1

公开(公告)日：2007-04-05

申请号：US11222310

申请日：2005-09-08

Applicant: Ronald Lashley

Inventor： Ronald Lashley

IPC: H05K1/16

CPC classification number: H05K1/0268 ,  H05K1/0201 ,  H05K2201/09781 ,  H05K2201/10053 ,  H05K2201/10151 ,  H05K2203/304

Abstract: The present invention provides a system and method for detecting thermal events on circuit boards, such as those used in information handling systems. In embodiments of the present invention, a plurality of thermal event detector traces are etched on a printed wire board (PWB) and are isolated from voltage planes in the PWB. In various embodiments of the invention, the thermal event detector traces comprise a pad or trace in a location under or near a component in a critical area. The thermal detection traces or pads are coupled to a detection circuit so that a thermal event resulting in thermal deformation or charring of the PWB in the area of these traces will trigger a power supply shutdown.

Abstract translation: 本发明提供一种用于检测电路板上的热事件的系统和方法，例如在信息处理系统中使用的那些。 在本发明的实施例中，在印刷线路板（PWB）上蚀刻多个热事件检测器迹线，并且与PWB中的电压平面隔离。 在本发明的各种实施例中，热事件检测器迹线包括在关键区域中的部件下方或附近的位置处的焊盘或迹线。 热检测迹线或焊盘耦合到检测电路，使得在这些迹线区域中导致PWB的热变形或烧焦的热事件将触发电源关闭。

公开(公告)号：US20060267721A1

公开(公告)日：2006-11-30

申请号：US11420280

申请日：2006-05-25

Applicant: Alfons Graf ,  Martin Maerz ,  Martin Saliternig

Inventor： Alfons Graf ,  Martin Maerz ,  Martin Saliternig

IPC: H01H85/04

CPC classification number: H01C7/126 ,  H01G2/16 ,  H01H37/761 ,  H01L2224/48247 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/13091 ,  H01L2924/181 ,  H05K1/0201 ,  H05K1/0293 ,  H05K3/3489 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/10181 ,  H05K2201/10909 ,  H05K2201/2081 ,  H05K2203/0415 ,  H05K2203/175 ,  H05K2203/176 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A current consumer and/or an electric device generates a predetermined amount of heat in the event of a malfunction. The electric device is protected from overheating in that it is arranged, with a fuse in a circuit, such that the fuse and the electric device are thermally coupled to one another, so that the generation of the amount of heat by the electric device causes a fusible material in the fuse to melt. In this manner, the current terminal path of the electric device is interrupted.

Abstract translation: 当前消费者和/或电子装置在发生故障的情况下产生预定量的热量。 电气装置被防止过热，因为它被布置成具有电路中的保险丝，使得保险丝和电气装置彼此热耦合，使得由电气装置产生的热量导致 保险丝中的易熔材料熔化。 以这种方式，电气设备的当前终端路径被中断。

公开(公告)号：US07107183B2

公开(公告)日：2006-09-12

申请号：US10904364

申请日：2004-11-05

Applicant: Juan Carlos Alonso

Inventor： Juan Carlos Alonso

IPC: G06F19/00

CPC classification number: H05K3/22 ,  G01R31/07 ,  G01R31/2642 ,  H05K1/0201 ,  H05K1/18 ,  H05K2201/10151 ,  H05K2201/10159 ,  H05K2203/163 ,  H05K2203/178 ,  Y02P70/611 ,  Y02P70/613

Abstract: A recyclable electric junction box applicable to automotive vehicles, of the type comprising at least one casing housing a series of circuits inside materialized in one or more printed circuit boards with a series of electroconducting tracks on at least one of its sides, and with a series of components assembled on said plates, welded on said tracks and responsible for carrying out at least one power stage and one signal stage.

Abstract translation: 一种适用于机动车辆的可回收电接线盒，其类型包括：至少一个壳体，其容纳在一个或多个印刷电路板中实现的一系列电路，其中至少一个侧面上具有一系列导电轨道，并且具有串联 组装在所述板上的部件，焊接在所述轨道上，并负责执行至少一个功率级和一个信号级。

公开(公告)号：US20060158783A1

公开(公告)日：2006-07-20

申请号：US11037752

申请日：2005-01-18

Applicant: Satya Arya ,  Xinzhi Xing

Inventor： Satya Arya ,  Xinzhi Xing

IPC: G11B5/48

CPC classification number: G11B5/4846 ,  G11B5/4853 ,  G11B5/486 ,  H05K1/0201 ,  H05K1/056 ,  H05K1/111 ,  H05K3/3494 ,  H05K2201/062 ,  H05K2201/0969 ,  Y02P70/611

Abstract: An apparatus and method for reducing heat absorption around solder pads on an electrical lead suspension (ELS). The method provides a base-metal layer having at least one opening. A dielectric layer is also provided above the base-metal layer, the dielectric layer covering a portion of the base-metal layer and at least one of the openings in the base-metal layer. A signal conductive layer is provided above dielectric layer. The signal conductive layer carries at least one solder pad portion, wherein the solder pad portion is placed above the portion of the dielectric layer such that the solder pad portion does not align with the at least one opening in the base-metal layer. In so doing, the heat absorption with respect to the base-metal layer is reduced.

Abstract translation: 一种用于减少电铅悬架（ELS）上的焊盘周围的吸热的装置和方法。 该方法提供具有至少一个开口的基底金属层。 电介质层也设置在母金属层的上方，电介质层覆盖基底金属层的一部分和基底金属层中的至少一个开口。 信号导电层设置在电介质层的上方。 信号导电层承载至少一个焊料焊盘部分，其中焊料焊盘部分放置在电介质层的部分上方，使得焊料焊盘部分不与基体金属层中的至少一个开口对准。 在这样做时，相对于基底金属层的吸热性降低。

公开(公告)号：US07023291B2

公开(公告)日：2006-04-04

申请号：US10946890

申请日：2004-09-22

Applicant: Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

Inventor： Hiroshi Kato ,  Manabu Ito ,  Takeshi Uchida

IPC: H03B5/32

CPC classification number: H05K1/0201 ,  G05D23/19 ,  H03B5/04 ,  H03B5/36 ,  H05K1/181 ,  H05K3/301 ,  H05K2201/10022 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10515 ,  H05K2201/10606

Abstract: To provide a highly stable crystal oscillator having increased thermal efficiency. The highly stable crystal oscillator comprises; a thermostat mainframe which maintains the temperature of a crystal resonator including a resonator container for sealing a crystal piece constant, an oscillating element which constitutes an oscillation circuit together with said crystal resonator, a temperature control element which controls the temperature inside of said thermostat mainframe, and a circuit board mounted with said thermostat mainframe, said oscillating element, and said temperature control element. The construction is such that a heat generating chip resistor and a highly heat sensitive element having a higher temperature dependency, among said oscillating element and said temperature control element, are arranged on one principal plane of said circuit board, and said heat generating chip resistor, said highly heat sensitive element, and said thermostat mainframe are directly heat bonded by a thermo-conductive material.

Abstract translation: 提供具有增加的热效率的高度稳定的晶体振荡器。 高度稳定的晶体振荡器包括： 恒温器主机，其保持包括用于密封晶体片的谐振器容器的晶体谐振器的温度，与所述晶体谐振器一起构成振荡电路的振荡元件，控制所述恒温器主机内部的温度的温度控制元件， 以及安装有所述恒温器主机，所述振荡元件和所述温度控制元件的电路板。 该结构使得在所述振荡元件和所述温度控制元件之中具有较高温度依赖性的发热芯片电阻器和高热敏元件被布置在所述电路板的一个主平面上，并且所述发热芯片电阻器， 所述高热敏元件，并且所述恒温器主机通过热导材料直接热粘合。

公开(公告)号：US20050248023A1

公开(公告)日：2005-11-10

申请号：US10838406

申请日：2004-05-04

Applicant: Josef Maier

Inventor： Josef Maier

IPC: H01L23/34 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18

CPC classification number: H01L25/162 ,  H01L25/16 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/0203 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/10166 ,  H01L2924/00

Abstract: A circuit board is provided with a plurality of MOSFETs (metal oxide semiconductor field effect transistors) each of which include a field effect transistor and an associated control circuit. The control circuits are mounted in a control section of the board remote from a power section mounting the MOSFETs. The present invention reduces the assembly steps required in the prior art wherein the MOSFET and its control circuit were mounted as preassembled units to the board. Moreover, the number of MOSFETs per unit area of board is increased by the present invention.

Abstract translation: 电路板设置有多个MOSFET（金属氧化物半导体场效应晶体管），每个MOSFET包括场效应晶体管和相关联的控制电路。 控制电路安装在远离安装MOSFET的电源部分的板的控制部分中。 本发明减少了现有技术中所需的组装步骤，其中MOSFET及其控制电路作为预先组装的单元安装到板上。 此外，通过本发明，板单位面积的MOSFET的数量增加。

公开(公告)号：US06937454B2

公开(公告)日：2005-08-30

申请号：US10463316

申请日：2003-06-16

Applicant: Adrian Mikolajczak ,  Dean Huumala

Inventor： Adrian Mikolajczak ,  Dean Huumala

IPC: H01C7/02 ,  H01F17/06 ,  H01F27/00 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K1/16 ,  H05K3/34 ,  H05K3/42 ,  H05K9/00 ,  H02H3/22

CPC classification number: H05K1/0233 ,  H05K1/0201 ,  H05K1/0254 ,  H05K1/056 ,  H05K1/141 ,  H05K1/167 ,  H05K3/3442 ,  H05K3/429 ,  H05K2201/086 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/1006 ,  H05K2203/1572

Abstract: An electrical component includes a mounting substrate, a common-mode rejection filter mounted to the substrate, and at least one circuit protection element mounted to or formed by the substrate. The circuit protection element may provide a PPTC resistor element for overcurrent protection and/or a spark gap NTC element for overvoltage protection. The substrate includes a plurality of contacts including filter contacts connected to the common-mode rejection filter, and protection contacts connected to the protection element, the electrodes enabling surface mounting and connection of the component to aligned connection features of a host printed circuit board.

Abstract translation: 电气部件包括安装基板，安装到基板的共模抑制滤波器以及安装到基板或由基板形成的至少一个电路保护元件。 电路保护元件可以提供用于过电流保护的PPTC电阻元件和/或用于过电压保护的火花隙NTC元件。 基板包括多个触点，其包括连接到共模抑制滤波器的滤波器触点，以及连接到保护元件的保护触点，电极能够将元件表面安装和连接到主机印刷电路板的对准的连接特征。

公开(公告)号：US20050151240A1

公开(公告)日：2005-07-14

申请号：US11076938

申请日：2005-03-11

Applicant: Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

Inventor： Eriko Takeda ,  Atsushi Isobe ,  Satoshi Tanaka ,  Hiroshi Okabe

IPC: H01L23/12 ,  H01L23/34 ,  H01L23/367 ,  H01L25/04 ,  H01L25/18 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03

CPC classification number: H01L23/345 ,  H01L23/3677 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15153 ,  H01L2924/15313 ,  H01L2924/16251 ,  H01L2924/19105 ,  H05K1/0201 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/062 ,  H01L2924/00012

Abstract: In a compact radio frequency module, a first chip forms a heater element and a second chip forms a device whose operating characteristics vary with temperature change or whose maximum operating temperature is lower than the maximum operating temperature of the first chip. A multilayer substrate has a plurality of dielectric layers and a plurality of conductor layers and mechanically supports the first chip and the second chip with some of the conductor layers electrically connected with these chips. The module can conduct the heat generated by the first chip throughout the module; guide the heat generated by the first chip from the module's top face side to its bottom face side; and interrupt the heat conduction from the first conductor pattern on which the first chip is placed to the second conductor pattern on which the second chip is placed.

Abstract translation: 在紧凑型射频模块中，第一芯片形成加热元件，第二芯片形成其工作特性随温度变化而变化或其最大工作温度低于第一芯片的最大工作温度的器件。 多层基板具有多个电介质层和多个导体层，并且机械地支撑第一芯片和第二芯片，其中一些导体层与这些芯片电连接。 该模块可以在整个模块中传导第一芯片产生的热量; 将第一芯片产生的热量从模块的顶面引导到其底面; 并且将来自第一芯片的第一导体图案的热传导中断到放置第二芯片的第二导体图案。