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    SEGMENTED ELECTROLUMINESCENT DEVICE WITH DISTRIBUTED LOAD ELEMENTS
    132.
    发明申请
    SEGMENTED ELECTROLUMINESCENT DEVICE WITH DISTRIBUTED LOAD ELEMENTS 有权
    带有分布式负载元件的SEGMENTED电致发光器件

    公开(公告)号：US20150097482A1

    公开(公告)日：2015-04-09

    申请号：US14383591

    申请日：2013-03-01

    Applicant: KONINKLIJKE PHILIPS N.V.

    Inventor： Dirk Hente

    IPC: H05B33/08 ,  F21V29/00

    CPC classification number: H05B33/0896 ,  F21V29/502 ,  F21V29/89 ,  H01L27/3204 ,  H01L2251/5361 ,  H05B33/0821 ,  H05K1/0201 ,  H05K1/0209 ,  H05K1/182 ,  H05K2201/0116 ,  H05K2201/062 ,  H05K2201/10022 ,  H05K2201/10106

    Abstract: The invention relates to an electroluminescent lighting device, which is based on an array of standard electroluminescent tiles (D1-Dn) combined with an array of ballast components (R1-Rn) mounted on a carrier board (30) in such a way that the power loss is evenly spread across the whole board area to minimize local electric power in the ballast components. The unavoidable remaining hot spots and electroluminescent tiles are thermally coupled in such a way that the additional thermal load on the electro-luminescent emission layer is as symmetric as possible with respect to the self heating of the electroluminescent device. This can be achieved by a combination of properly designed heat spreading and thermal isolation of the electroluminescent and ballast components. Heat spreading is achieved by a properly designed interconnection structure (40) on the carrier board. Different options are proposed to thermally isolate the electroluminescent tiles from the hot spots.

    Abstract translation: 本发明涉及一种电致发光照明装置，其基于与安装在载体板（30）上的镇流器组件阵列（R1-Rn）组合的标准电致发光瓦片（D1-Dn）的阵列， 功率损耗均匀分布在整个电路板区域上，以最大限度地减少镇流器部件的局部电力。 不可避免的剩余热点和电致发光瓦片以这样的方式热耦合，使得电致发光层上的附加热负荷相对于电致发光器件的自加热尽可能对称。 这可以通过适当设计的电致发光和镇流器部件的散热和热隔离的组合来实现。 通过在载板上的适当设计的互连结构（40）实现散热。 提出了不同的选择以将电致发光瓦片与热点隔离。

    SOLID ELECTROLYTIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME
    136.
    发明申请
    SOLID ELECTROLYTIC CAPACITOR AND CIRCUIT BOARD HAVING THE SAME 有权
    固体电解电容器和具有该电容器的电路板

    公开(公告)号：US20130233605A1

    公开(公告)日：2013-09-12

    申请号：US13607820

    申请日：2012-09-10

    Applicant: Chien-Min Hsu ,  Min-Lin Lee ,  Li-Duan Tsai

    Inventor： Chien-Min Hsu ,  Min-Lin Lee ,  Li-Duan Tsai

    IPC: H05K1/18

    CPC classification number: H05K1/162 ,  H01G9/012 ,  H01G9/04 ,  H01G9/15 ,  H01G9/26 ,  H05K1/0231 ,  H05K1/053 ,  H05K2201/0116 ,  H05K2201/0175 ,  H05K2201/0191 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0338 ,  H05K2201/09063 ,  H05K2201/10522 ,  H05K2203/0307 ,  H05K2203/0315 ,  H05K2203/0369 ,  H05K2203/0723

    Abstract: A capacitor and a circuit board having the same are provided. The capacitor includes a substrate, an oxide layer, a second electrode, an insulating layer, a plurality of conductive sheets and a plurality of vias. The substrate includes a first electrode and a porous structure. The porous structure in at least of two distribution regions has different depths. An oxide layer is disposed on the surface of the porous structure. The second electrode is disposed on the oxide layer and includes a conductive polymer material. The insulating layer disposed on the second electrode has a third and a fourth surfaces. The fourth surface of the insulating layer is connected with the second electrode. The conductive sheets are disposed on the first surface of the first electrode and the third surface of the insulating layer and electrically connected with the corresponding vias according to different polarities.

    Abstract translation: 提供电容器和具有该电容器的电路板。 电容器包括衬底，氧化物层，第二电极，绝缘层，多个导电片和多个通孔。 基板包括第一电极和多孔结构。 至少两个分布区域中的多孔结构具有不同的深度。 氧化物层设置在多孔结构的表面上。 第二电极设置在氧化物层上并且包括导电聚合物材料。 设置在第二电极上的绝缘层具有第三和第四表面。 绝缘层的第四表面与第二电极连接。 导电片设置在第一电极的第一表面和绝缘层的第三表面上，并根据不同的极性与相应的通孔电连接。

    DEVICE MOUNTING BOARD, CELL, AND BATTERY MODULE
    138.
    发明申请
    DEVICE MOUNTING BOARD, CELL, AND BATTERY MODULE 有权
    设备安装板，电池和电池模块

    公开(公告)号：US20130157102A1

    公开(公告)日：2013-06-20

    申请号：US13768777

    申请日：2013-02-15

    Applicant: SANYO ELECTRIC CO., LTD.

    Inventor： Masayuki NAGAMATSU ,  Mayumi NAKASATO ,  Yasuyuki YANASE

    IPC: H05K1/02

    CPC classification number: H05K1/0203 ,  H01M2/1077 ,  H01M2/1094 ,  H01M10/617 ,  H01M10/653 ,  H01M10/6554 ,  H05K1/053 ,  H05K1/056 ,  H05K2201/0116 ,  H05K2201/10037 ,  H05K2201/10166 ,  H05K2203/0315

    Abstract: A device mounting board comprises: a heat dissipating substrate formed of a material containing at least one metal material selected from a group including Al, Mg, and Ti; an insulting resin layer laminated on the heat dissipating substrate; and a wiring layer laminated on the insulating resin layer, and on which a power module is to be mounted. The heat dissipating substrate comprises a random porous layer arranged such that it faces the insulating resin layer, and having cavities elongated in respective random directions.

    Abstract translation: 装置安装板包括：散热基板，由含有选自Al，Mg和Ti的组的至少一种金属材料的材料形成; 层叠在散热基板上的绝缘树脂层; 以及层叠在绝缘树脂层上的布线层，并且其上安装有功率模块。 散热基板包括布置成使其面向绝缘树脂层并且具有在各个随机方向上延伸的空腔的无规多孔层。

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