中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

472 records (took 0.02 seconds)

    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME
    131.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD FOR MANUFACTURING SAME 审中-公开
    印刷电路板及其制造方法

    公开(公告)号：US20150053466A1

    公开(公告)日：2015-02-26

    申请号：US14465794

    申请日：2014-08-21

    Applicant: FUKUI PRECISION COMPONENT (SHENZHEN) CO., LTD. ,  ZHEN DING TECHNOLOGY CO., LTD.

    Inventor： MING-JAAN HO ,  XIAN-QIN HU ,  JIAN LUO ,  FU-YUN SHEN

    IPC: H05K1/02 ,  H05K3/02 ,  H05K1/09

    CPC classification number: H05K1/0274 ,  H05K1/09 ,  H05K3/06 ,  H05K2201/0108 ,  H05K2201/0145 ,  H05K2201/0338 ,  H05K2201/0355 ,  Y10T29/49156

    Abstract: A printed circuit board (PCB) and a method for manufacturing the PCB are disclosed. A PCB includes a transparent insulating substrate, a conductive circuit layer 16, and a transparent cover layer. The conductive circuit layer is located between the transparent insulating substrate and the transparent cover layer. The conductive circuit layer includes a first Ni—W alloy pattern layer, a copper pattern layer, and a second Ni—W alloy pattern layer. The first Ni—W alloy pattern layer is adhered with the transparent adhesive layer. Bottom surfaces of the conductive pattern layer are coated by the first Ni—W alloy pattern layer. Top surfaces and side surfaces of conductive pattern layer are coated by the second Ni—W alloy pattern layer.

    Abstract translation: 公开了一种印刷电路板（PCB）及其制造方法。 PCB包括透明绝缘基板，导电电路层16和透明覆盖层。 导电电路层位于透明绝缘基板和透明覆盖层之间。 导电电路层包括第一Ni-W合金图案层，铜图案层和第二Ni-W合金图案层。 第一Ni-W合金图案层用透明粘合剂层粘附。 导电图案层的底表面被第一Ni-W合金图案层涂覆。 导电图案层的顶表面和侧表面由第二Ni-W合金图案层涂覆。

    MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS
    135.
    发明申请
    MASKING SUBSTRATES FOR APPLICATION OF PROTECTIVE COATINGS 审中-公开
    用于保护涂层的掩模基材

    公开(公告)号：US20140192464A1

    公开(公告)日：2014-07-10

    申请号：US14157684

    申请日：2014-01-17

    Applicant: HzO, Inc.

    Inventor： David James Astle ,  Tyler Christensen Child ,  Vimal Kumar Kasagani ,  Cameron LaMar Loose ,  Blake LeRoy Stevens ,  Max Ernest Sorenson

    IPC: H01L21/64 ,  H05K7/02 ,  H01L21/67

    CPC classification number: B05D1/322 ,  C09J9/00 ,  C09J2201/61 ,  H01L21/56 ,  H01L21/561 ,  H01L21/67011 ,  H01L21/6715 ,  H01L23/3121 ,  H01L2924/0002 ,  H05K1/181 ,  H05K3/0073 ,  H05K3/0079 ,  H05K3/284 ,  H05K2201/0145 ,  H05K2201/09872 ,  H01L2924/00

    Abstract: A method for applying a protective coating to selected portions of a substrate is disclosed. The method includes applying a mask to or forming a mask on at least one portion of the substrate that is not to be covered with the protective coating. The mask may be selectively formed by applying a flowable material to the substrate. Alternatively, the mask may be formed from a preformed film. With the mask in place, the protective coating may be applied to the substrate and the mask. A portion of the protective coating that overlies the mask may be delineated from other portions of the protective coating; for example, by cutting, weakening or removing material from the protective coating at locations at or adjacent to the perimeter of the mask. The portion of the protective coating that overlies the mask, and the mask, may then be removed from the substrate.

    Abstract translation: 公开了一种将保护涂层施加到衬底的选定部分的方法。 该方法包括在不被保护涂层覆盖的基底的至少一部分上施加掩模或形成掩模。 可以通过将可流动材料施加到基底来选择性地形成掩模。 或者，掩模可以由预成型膜形成。 在掩模就位的情况下，可以将保护涂层施加到基底和掩模上。 覆盖在掩模上的保护涂层的一部分可以从保护涂层的其它部分描绘出来; 例如，通过在掩模的周边或附近的位置处切割，削弱或从保护涂层去除材料。 然后可以将覆盖在掩模上的保护涂层和掩模的部分从基材上除去。

    THERMALLY CURABLE SOLDER RESIST COMPOSITION
    140.
    发明申请
    THERMALLY CURABLE SOLDER RESIST COMPOSITION 有权
    耐热固化焊料组合物

    公开(公告)号：US20110306703A1

    公开(公告)日：2011-12-15

    申请号：US13216653

    申请日：2011-08-24

    Applicant: Jhy-Long JENG ,  Jeng-Yu TSAI ,  Shur-Fen LIU ,  Jinn-Shing KING

    Inventor： Jhy-Long JENG ,  Jeng-Yu TSAI ,  Shur-Fen LIU ,  Jinn-Shing KING

    IPC: C08L63/10

    CPC classification number: C08G59/066 ,  C08G59/22 ,  H05K1/0393 ,  H05K3/285 ,  H05K2201/0145

    Abstract: A thermally curable solder resist composition for a flexible printed circuit board is provided. The solder resist composition includes (a) 50-100 parts by weight of an epoxy resin, wherein the epoxy resin includes at least an aliphatic polyester modified epoxy resin having formula (I) or (II), in which, each of R1 and R2, independently, is a C6-38 saturated or an unsaturated carbon chain, R3 is ether, phenyl, a C6-38 heterocyclic or C6-38 saturated carbon chain, n is an integer of 1-10 and the aliphatic polyester modified epoxy resin had a molecular weight of 1000-5000; (b) 1-10 parts by weight of a curing agent; and (c) 1-10 parts by weight of a catalyst.

    Abstract translation: 提供了一种用于柔性印刷电路板的热固化阻焊组合物。 阻焊剂组合物包含（a）50-100重量份的环氧树脂，其中环氧树脂至少包含具有式（I）或（II）的脂族聚酯改性环氧树脂，其中R1和R2各自 独立地是C6-38饱和或不饱和碳链，R3是醚，苯基，C6-38杂环或C6-38饱和碳链，n是1-10的整数，脂肪族聚酯改性环氧树脂具有 分子量1000-5000; （b）1-10重量份的固化剂; 和（c）1-10重量份的催化剂。

Patent Agency Ranking