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    Flexible circuitry with heat and pressure spreading layers
    131.
    发明授权
    Flexible circuitry with heat and pressure spreading layers 有权
    具有热和压力扩展层的柔性电路

    公开(公告)号：US08946561B2

    公开(公告)日：2015-02-03

    申请号：US13353203

    申请日：2012-01-18

    Applicant: Joshua G. Wurzel ,  Casey J. Feinstein

    Inventor： Joshua G. Wurzel ,  Casey J. Feinstein

    IPC: H05K1/00 ,  H05K3/36

    CPC classification number: H05K1/02 ,  H05K3/361 ,  H05K2201/015 ,  H05K2201/0162 ,  H05K2201/2009 ,  Y10T29/49126

    Abstract: A flexible printed circuit may be provided with an integrated heat and pressure spreading layer. The heat and pressure spreading layer may be configured to uniformly spread heat and pressure from a bonding tool across a portion of the flexible printed circuit during bonding of the flexible printed circuit to additional circuitry. During manufacturing of the flexible printed circuit, a sheet of heat and pressure spreading material may be attached to a sheet of flexible printed circuitry and the heat and pressure spreading material and the sheet of flexible printed circuitry may be die cut to form multiple flexible printed circuits each with a heat and pressure spreading layer. An electronic device may be provided with a flexible printed circuit with a heat and pressure spreading layer coupled to a component such as a display.

    Abstract translation: 柔性印刷电路可以设置有集成的热和压扩散层。 热和压扩散层可以被配置为在将柔性印刷电路连接到附加电路的过程中，均匀地将粘合工具的热量和压力传播到柔性印刷电路的一部分上。 在柔性印刷电路的制造期间，一片热和压力扩展材料可以附接到柔性印刷电路板上，并且热和压力扩展材料和柔性印刷电路板可以被模切以形成多个柔性印刷电路 每个具有热和压力扩散层。 电子设备可以设置有柔性印刷电路，其具有耦合到诸如显示器的部件的热和压力扩展层。

    Terahertz metamaterials
    133.
    发明授权
    Terahertz metamaterials 有权
    太赫兹超材料

    公开(公告)号：US08803637B1

    公开(公告)日：2014-08-12

    申请号：US12262422

    申请日：2008-10-31

    Applicant: Xomalin Guaiuli Peralta ,  Igal Brener ,  John O'Hara ,  Abul Azad ,  Evgenya Smirnova ,  John D. Williams ,  Richard D. Averitt

    Inventor： Xomalin Guaiuli Peralta ,  Igal Brener ,  John O'Hara ,  Abul Azad ,  Evgenya Smirnova ,  John D. Williams ,  Richard D. Averitt

    IPC: H01P7/10 ,  H01P7/08

    CPC classification number: H01P7/082 ,  H01P7/10 ,  H01Q15/0086 ,  H05K1/0236 ,  H05K1/024 ,  H05K1/0393 ,  H05K1/165 ,  H05K3/007 ,  H05K2201/015 ,  H05K2201/0154

    Abstract: Terahertz metamaterials comprise a periodic array of resonator elements disposed on a dielectric substrate or thin membrane, wherein the resonator elements have a structure that provides a tunable magnetic permeability or a tunable electric permittivity for incident electromagnetic radiation at a frequency greater than about 100 GHz and the periodic array has a lattice constant that is smaller than the wavelength of the incident electromagnetic radiation. Microfabricated metamaterials exhibit lower losses and can be assembled into three-dimensional structures that enable full coupling of incident electromagnetic terahertz radiation in two or three orthogonal directions. Furthermore, polarization sensitive and insensitive metamaterials at terahertz frequencies can enable new devices and applications.

    Abstract translation: 太赫兹超材料包括布置在电介质基底或薄膜上的谐振器元件的周期性阵列，其中谐振器元件具有为频率大于约100GHz的入射电磁辐射提供可调磁导率或可调谐电容率的结构， 周期性阵列具有小于入射电磁辐射的波长的晶格常数。 微制造的超材料表现出较低的损耗，并且可以组装成能够在两个或三个正交方向上完全耦合入射电磁太赫兹辐射的三维结构。 此外，极化敏感和不敏感的超材料在太赫兹频率可以实现新的设备和应用。

    HIGH-SPEED PLUGGABLE RIGID-END FLEX CIRCUIT
    134.
    发明申请
    HIGH-SPEED PLUGGABLE RIGID-END FLEX CIRCUIT 有权
    高速可插拔刚性端弯曲电路

    公开(公告)号：US20140079403A1

    公开(公告)日：2014-03-20

    申请号：US13623615

    申请日：2012-09-20

    Applicant: FINISAR CORPORATION

    Inventor： Henry Daghighian ,  Steve Bird ,  Bruce Sramek

    IPC: H05K1/02 ,  H04B10/40

    CPC classification number: H05K1/0283 ,  H01P3/08 ,  H01P3/088 ,  H04B10/40 ,  H05K1/0242 ,  H05K1/0251 ,  H05K1/0373 ,  H05K1/0393 ,  H05K1/16 ,  H05K1/165 ,  H05K3/4069 ,  H05K3/429 ,  H05K3/4691 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/086 ,  H05K2201/09518 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/10121 ,  H05K2201/10189 ,  H05K2201/2009

    Abstract: High-speed pluggable rigid-end flex circuit. A circuit includes a flexible section, rigid section, connector disposed on the rigid section, and electrically conductive signal transmission line electrically coupled to the connector. The flexible section includes a first portion of a flexible insulating layer. The rigid section includes a second portion of the flexible insulating layer and a rigid insulating layer disposed on the second portion of the flexible insulating layer. The connector is configured to form a pluggable conductive connection. The electrically conductive signal transmission line includes a first signal trace having a root mean square surface roughness below 20 micrometers and a filled signal via configured to pass through at least a portion of the rigid insulating layer. The flexible and rigid insulating layers have a dissipation factor equal to or below a ratio of 0.004 and a dielectric constant equal to or below a ratio of 3.7.

    Abstract translation: 高速可插拔刚性端柔性电路。 电路包括柔性部分，刚性部分，设置在刚性部分上的连接器，以及电连接到连接器的导电信号传输线。 柔性部分包括柔性绝缘层的第一部分。 刚性部分包括柔性绝缘层的第二部分和设置在柔性绝缘层的第二部分上的刚性绝缘层。 连接器被配置成形成可插拔的导电连接。 导电信号传输线包括具有低于20微米的均方根粗糙度的第一信号迹线和经配置以穿过刚性绝缘层的至少一部分的填充信号通道。 柔性和刚性绝缘层的损耗因子等于或低于0.004的比例和等于或低于3.7的介电常数。

    Method for Reducing Creep Corrosion
    135.
    发明申请
    Method for Reducing Creep Corrosion 审中-公开
    减少蠕变腐蚀的方法

    公开(公告)号：US20130240256A1

    公开(公告)日：2013-09-19

    申请号：US13885119

    申请日：2011-11-09

    Applicant: Timothy Von Werne

    Inventor： Timothy Von Werne

    IPC: H05K3/28 ,  H05K1/09 ,  H05K1/03

    CPC classification number: H05K3/282 ,  H05K1/032 ,  H05K1/09 ,  H05K3/284 ,  H05K2201/015 ,  H05K2201/0179 ,  H05K2201/09872 ,  H05K2203/095

    Abstract: A method for reducing creep corrosion on a printed circuit board, the printed circuit board comprising a substrate, a plurality of electrically conductive tracks located on at least one surface of the substrate, a solder mask coating at least a first area of the plurality of electrically conductive tracks and a surface finish coating at least a second area of the plurality of electrically conductive tracks, the method comprising depositing by plasma-polymerization a fluorohydrocarbon onto at least part of the solder mask and at least part of the surface finish.

    Abstract translation: 一种用于减少印刷电路板上的蠕变腐蚀的方法，所述印刷电路板包括基板，位于所述基板的至少一个表面上的多个导电轨道，焊接掩模涂覆所述多个电气的至少第一区域 导电轨道和表面光洁度涂层，所述方法包括通过将氟代烃等离子体聚合到至少部分焊料掩模和至少部分表面光洁度上进行沉积。

    Multilayer printed wiring board with filled viahole structure
    139.
    发明授权
    Multilayer printed wiring board with filled viahole structure 有权
    多层印刷线路板，带有通孔结构

    公开(公告)号：US08115111B2

    公开(公告)日：2012-02-14

    申请号：US12646517

    申请日：2009-12-23

    Applicant: Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

    Inventor： Seiji Shirai ,  Kenichi Shimada ,  Motoo Asai

    IPC: H05K1/11

    CPC classification number: H05K3/4661 ,  H05K3/108 ,  H05K3/381 ,  H05K3/382 ,  H05K3/421 ,  H05K3/423 ,  H05K2201/0129 ,  H05K2201/015 ,  H05K2201/0278 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09745 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/24917 ,  Y10T428/31681

    Abstract: A multilayer printed wiring board includes a multilayered structure having conductor circuit layers and interlaminar insulative layers, the interlaminar insulative layers including an outermost interlaminar insulative layer, the conductor circuit layers including an outermost conductor circuit layer formed over the outermost interlaminar insulative, a filled-viahole formed in the outermost interlaminar insulative layer and having one or more metal plating fillings and completely closing a hole formed through the outermost interlaminar insulative layer such that the metal plating of the filled-viahole extends out of the hole and forms a substantially flat surface, and solder bumps including a first solder bump formed on the substantially flat surface of the filled-viahole and a second solder bump formed on a surface portion in the outermost conductor circuit layer. The substantially flat surface of the filled-viahole is leveled substantially at the same height as the surface portion of the outermost conductor circuit layer.

    Abstract translation: 多层印刷线路板包括具有导体电路层和层间绝缘层的多层结构，所述层间绝缘层包括最外层间绝缘层，所述导体电路层包括形成在最外层间绝缘体上的最外导体电路层，填充通孔 形成在最外层间绝缘层中并且具有一个或多个金属电镀填充物并且完全闭合通过最外层间绝缘层形成的孔，使得填充通孔的金属镀层延伸出孔并形成基本平坦的表面，并且 焊料凸点包括形成在填充通孔的基本上平坦的表面上的第一焊料凸块和形成在最外导体电路层的表面部分上的第二焊料凸点。 填充通孔的基本上平坦的表面基本上与最外面的导体电路层的表面部分的高度平齐。

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